HiSilicon Kirin 810 vs HiSilicon Kirin 9000 5G
The HiSilicon Kirin 810 and HiSilicon Kirin 9000 5G are two processors with distinctive specifications, catering to different performance levels and capabilities.
Starting with the HiSilicon Kirin 810, it features an architecture consisting of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. With a total of 8 cores, it offers a balanced combination of high-performance and energy-efficient cores. The processor utilizes the ARMv8.2-A instruction set and is manufactured using a 7 nm lithography process. With 6900 million transistors, it provides a significant processing capability within a compact space. It operates with a thermal design power (TDP) of 5 Watts, indicating a relatively low power consumption. Additionally, the HiSilicon Kirin 810 includes the Ascend D100 Lite for neural processing, employing the HUAWEI Da Vinci Architecture.
On the other hand, the HiSilicon Kirin 9000 5G is a more advanced processor. It utilizes an architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. With a total of 8 cores, it provides a powerful processing capability. Similarly, it employs the ARMv8.2-A instruction set. The Kirin 9000 5G is manufactured using a more advanced 5 nm lithography process, resulting in improved efficiency and performance. It features a higher number of transistors, with 15300 million, indicating a greater computing power. The TDP of 6 Watts suggests a slightly higher power consumption compared to the Kirin 810. Additionally, the HiSilicon Kirin 9000 5G incorporates advanced neural processing capabilities, incorporating the Ascend Lite (2x) and Ascend Tiny (1x) with the HUAWEI Da Vinci Architecture 2.0.
In summary, the HiSilicon Kirin 810 and HiSilicon Kirin 9000 5G differ in various aspects. While the Kirin 810 offers a balanced combination of performance and energy efficiency, the Kirin 9000 5G provides a more advanced and powerful computing experience. The use of different lithography processes, number of transistors, and neural processing capabilities contribute to the contrasting specifications, with the Kirin 9000 5G emerging as the more high-end processor of the two.
Starting with the HiSilicon Kirin 810, it features an architecture consisting of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. With a total of 8 cores, it offers a balanced combination of high-performance and energy-efficient cores. The processor utilizes the ARMv8.2-A instruction set and is manufactured using a 7 nm lithography process. With 6900 million transistors, it provides a significant processing capability within a compact space. It operates with a thermal design power (TDP) of 5 Watts, indicating a relatively low power consumption. Additionally, the HiSilicon Kirin 810 includes the Ascend D100 Lite for neural processing, employing the HUAWEI Da Vinci Architecture.
On the other hand, the HiSilicon Kirin 9000 5G is a more advanced processor. It utilizes an architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. With a total of 8 cores, it provides a powerful processing capability. Similarly, it employs the ARMv8.2-A instruction set. The Kirin 9000 5G is manufactured using a more advanced 5 nm lithography process, resulting in improved efficiency and performance. It features a higher number of transistors, with 15300 million, indicating a greater computing power. The TDP of 6 Watts suggests a slightly higher power consumption compared to the Kirin 810. Additionally, the HiSilicon Kirin 9000 5G incorporates advanced neural processing capabilities, incorporating the Ascend Lite (2x) and Ascend Tiny (1x) with the HUAWEI Da Vinci Architecture 2.0.
In summary, the HiSilicon Kirin 810 and HiSilicon Kirin 9000 5G differ in various aspects. While the Kirin 810 offers a balanced combination of performance and energy efficiency, the Kirin 9000 5G provides a more advanced and powerful computing experience. The use of different lithography processes, number of transistors, and neural processing capabilities contribute to the contrasting specifications, with the Kirin 9000 5G emerging as the more high-end processor of the two.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 5 nm |
Number of transistors | 6900 million | 15300 million |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 2750 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G78 MP24 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 760 MHz |
Execution units | 6 | 24 |
Shaders | 96 | 384 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | |
Max camera resolution | 1x 48MP, 2x 20MP | |
Max Video Capture | FullHD@30fps | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 2.5 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2020 October |
Partnumber | Hi6280 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
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