HiSilicon Kirin 810 vs HiSilicon Kirin 9000 5G

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The HiSilicon Kirin 810 and HiSilicon Kirin 9000 5G are two processors with distinctive specifications, catering to different performance levels and capabilities.

Starting with the HiSilicon Kirin 810, it features an architecture consisting of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. With a total of 8 cores, it offers a balanced combination of high-performance and energy-efficient cores. The processor utilizes the ARMv8.2-A instruction set and is manufactured using a 7 nm lithography process. With 6900 million transistors, it provides a significant processing capability within a compact space. It operates with a thermal design power (TDP) of 5 Watts, indicating a relatively low power consumption. Additionally, the HiSilicon Kirin 810 includes the Ascend D100 Lite for neural processing, employing the HUAWEI Da Vinci Architecture.

On the other hand, the HiSilicon Kirin 9000 5G is a more advanced processor. It utilizes an architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. With a total of 8 cores, it provides a powerful processing capability. Similarly, it employs the ARMv8.2-A instruction set. The Kirin 9000 5G is manufactured using a more advanced 5 nm lithography process, resulting in improved efficiency and performance. It features a higher number of transistors, with 15300 million, indicating a greater computing power. The TDP of 6 Watts suggests a slightly higher power consumption compared to the Kirin 810. Additionally, the HiSilicon Kirin 9000 5G incorporates advanced neural processing capabilities, incorporating the Ascend Lite (2x) and Ascend Tiny (1x) with the HUAWEI Da Vinci Architecture 2.0.

In summary, the HiSilicon Kirin 810 and HiSilicon Kirin 9000 5G differ in various aspects. While the Kirin 810 offers a balanced combination of performance and energy efficiency, the Kirin 9000 5G provides a more advanced and powerful computing experience. The use of different lithography processes, number of transistors, and neural processing capabilities contribute to the contrasting specifications, with the Kirin 9000 5G emerging as the more high-end processor of the two.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 5 nm
Number of transistors 6900 million 15300 million
TDP 5 Watt 6 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR5
Memory frequency 2133 MHz 2750 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G52 MP6 Mali-G78 MP24
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 760 MHz
Execution units 6 24
Shaders 96 384
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 3840x2160
Max camera resolution 1x 48MP, 2x 20MP
Max Video Capture FullHD@30fps 4K@60fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 4.6 Gbps
Peak Upload Speed 0.15 Gbps 2.5 Gbps
Wi-Fi 6 (802.11ax) 6 (802.11ax)
Bluetooth 5.1 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC

Supplemental Information

Launch Date 2019 Quarter 2 2020 October
Partnumber Hi6280
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 810
373134
Kirin 9000 5G
762886

GeekBench 6 Single-Core

Score
Kirin 810
604
Kirin 9000 5G
1062

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Kirin 9000 5G
3724