HiSilicon Kirin 710F vs MediaTek Dimensity 920

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The HiSilicon Kirin 710F and MediaTek Dimensity 920 are two processors used in mobile devices. Let's compare their specifications to gain a deeper understanding of their capabilities.

Starting with the HiSilicon Kirin 710F, this processor has a total of eight cores. It utilizes an architecture that consists of four Cortex-A73 cores with a clock speed of 2.2 GHz and four Cortex-A53 cores running at 1.7 GHz. This combination allows for a balanced performance between power and efficiency. The instruction set supported by the Kirin 710F is ARMv8-A, offering compatibility with various software applications. With a lithography of 12 nm, this processor packs around 5,500 million transistors. Additionally, the TDP (Thermal Design Power) is rated at 5 Watts, ensuring efficient power management.

On the other hand, the MediaTek Dimensity 920 also features eight cores. It adopts a different architectural configuration, with two high-performance Cortex-A78 cores reaching a clock speed of 2.5 GHz, and six energy-efficient Cortex-A55 cores operating at 2.0 GHz. This arrangement offers a higher overall performance potential. Supporting ARMv8.2-A instruction set, the Dimensity 920 boasts a more advanced architecture compared to the Kirin 710F. The lithography of the Dimensity 920 is even more impressive, with a 6 nm manufacturing process, allowing for better power efficiency and performance gains. This processor also features a TDP of 10 Watts and incorporates an NPU (Neural Processing Unit), enabling enhanced AI and machine learning capabilities.

Overall, both processors excel in different aspects. The HiSilicon Kirin 710F focuses on a balanced performance and power efficiency, making it suitable for mid-range mobile devices. On the other hand, the MediaTek Dimensity 920 offers higher performance potential, especially with its powerful Cortex-A78 cores and advanced architecture. With its 6 nm lithography and added NPU, the Dimensity 920 is geared towards high-end smartphones that require AI capabilities.

Ultimately, the choice between these processors depends on the specific requirements of the device and the desired level of performance. Each processor has its own strengths and can offer an optimized user experience in different scenarios.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.5 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 6 nm
Number of transistors 5500 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1866 MHz 3200 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G51 MP4 Mali-G68 MP4
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 950 MHz
GPU boost frequency 1000 MHz
Execution units 4 4
Shaders 64 96
DirectX 12 12
OpenCL API 2.0 2.0
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 108MP, 2x 20MP
Max Video Capture 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2019 Quarter 1 2021 Quarter 3
Partnumber Hi6260 MT6877T
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
195573
Dimensity 920
453634

GeekBench 6 Single-Core

Score
Kirin 710F
329
Dimensity 920
780

GeekBench 6 Multi-Core

Score
Kirin 710F
1341
Dimensity 920
2594