HiSilicon Kirin 710F vs MediaTek Dimensity 920
The HiSilicon Kirin 710F and MediaTek Dimensity 920 are two processors used in mobile devices. Let's compare their specifications to gain a deeper understanding of their capabilities.
Starting with the HiSilicon Kirin 710F, this processor has a total of eight cores. It utilizes an architecture that consists of four Cortex-A73 cores with a clock speed of 2.2 GHz and four Cortex-A53 cores running at 1.7 GHz. This combination allows for a balanced performance between power and efficiency. The instruction set supported by the Kirin 710F is ARMv8-A, offering compatibility with various software applications. With a lithography of 12 nm, this processor packs around 5,500 million transistors. Additionally, the TDP (Thermal Design Power) is rated at 5 Watts, ensuring efficient power management.
On the other hand, the MediaTek Dimensity 920 also features eight cores. It adopts a different architectural configuration, with two high-performance Cortex-A78 cores reaching a clock speed of 2.5 GHz, and six energy-efficient Cortex-A55 cores operating at 2.0 GHz. This arrangement offers a higher overall performance potential. Supporting ARMv8.2-A instruction set, the Dimensity 920 boasts a more advanced architecture compared to the Kirin 710F. The lithography of the Dimensity 920 is even more impressive, with a 6 nm manufacturing process, allowing for better power efficiency and performance gains. This processor also features a TDP of 10 Watts and incorporates an NPU (Neural Processing Unit), enabling enhanced AI and machine learning capabilities.
Overall, both processors excel in different aspects. The HiSilicon Kirin 710F focuses on a balanced performance and power efficiency, making it suitable for mid-range mobile devices. On the other hand, the MediaTek Dimensity 920 offers higher performance potential, especially with its powerful Cortex-A78 cores and advanced architecture. With its 6 nm lithography and added NPU, the Dimensity 920 is geared towards high-end smartphones that require AI capabilities.
Ultimately, the choice between these processors depends on the specific requirements of the device and the desired level of performance. Each processor has its own strengths and can offer an optimized user experience in different scenarios.
Starting with the HiSilicon Kirin 710F, this processor has a total of eight cores. It utilizes an architecture that consists of four Cortex-A73 cores with a clock speed of 2.2 GHz and four Cortex-A53 cores running at 1.7 GHz. This combination allows for a balanced performance between power and efficiency. The instruction set supported by the Kirin 710F is ARMv8-A, offering compatibility with various software applications. With a lithography of 12 nm, this processor packs around 5,500 million transistors. Additionally, the TDP (Thermal Design Power) is rated at 5 Watts, ensuring efficient power management.
On the other hand, the MediaTek Dimensity 920 also features eight cores. It adopts a different architectural configuration, with two high-performance Cortex-A78 cores reaching a clock speed of 2.5 GHz, and six energy-efficient Cortex-A55 cores operating at 2.0 GHz. This arrangement offers a higher overall performance potential. Supporting ARMv8.2-A instruction set, the Dimensity 920 boasts a more advanced architecture compared to the Kirin 710F. The lithography of the Dimensity 920 is even more impressive, with a 6 nm manufacturing process, allowing for better power efficiency and performance gains. This processor also features a TDP of 10 Watts and incorporates an NPU (Neural Processing Unit), enabling enhanced AI and machine learning capabilities.
Overall, both processors excel in different aspects. The HiSilicon Kirin 710F focuses on a balanced performance and power efficiency, making it suitable for mid-range mobile devices. On the other hand, the MediaTek Dimensity 920 offers higher performance potential, especially with its powerful Cortex-A78 cores and advanced architecture. With its 6 nm lithography and added NPU, the Dimensity 920 is geared towards high-end smartphones that require AI capabilities.
Ultimately, the choice between these processors depends on the specific requirements of the device and the desired level of performance. Each processor has its own strengths and can offer an optimized user experience in different scenarios.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 6 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G68 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 950 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 4 |
Shaders | 64 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2021 Quarter 3 |
Partnumber | Hi6260 | MT6877T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Samsung Exynos 8890 vs MediaTek Helio G35
2
Unisoc Tiger T606 vs Qualcomm Snapdragon 632
3
Unisoc Tiger T610 vs Google Tensor G2
4
Unisoc Tiger T616 vs Qualcomm Snapdragon 820
5
MediaTek Dimensity 810 vs Qualcomm Snapdragon 670
6
Apple A15 Bionic vs HiSilicon Kirin 935
7
Samsung Exynos 8895 vs Qualcomm Snapdragon 7 Plus Gen 2
8
Qualcomm Snapdragon 675 vs MediaTek Dimensity 1000 Plus
9
Qualcomm Snapdragon 695 vs MediaTek Dimensity 9000
10
Qualcomm Snapdragon 865 Plus vs Samsung Exynos 7880