HiSilicon Kirin 980 vs MediaTek Dimensity 920
The HiSilicon Kirin 980 and MediaTek Dimensity 920 are both powerful processors designed for mobile devices. Let's compare their specifications to see how they stack up against each other.
Starting with the HiSilicon Kirin 980, it features a CPU architecture consisting of 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. With a total of 8 cores, it offers a versatile performance for various tasks. The processor is built on a 7 nm lithography process and has approximately 6900 million transistors. This efficient design allows it to operate with a TDP of only 6 Watts. Additionally, the HiSilicon Kirin 980 includes the HiSilicon Dual NPU, which enhances its neural processing capabilities.
On the other hand, the MediaTek Dimensity 920 features a CPU architecture with 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Like the Kirin 980, it also has 8 cores, enabling it to handle demanding tasks effectively. The Dimensity 920 is built on a 6 nm lithography process, making it more advanced in terms of manufacturing technology compared to the Kirin 980. However, this leads to a slightly higher TDP of 10 Watts. The Dimensity 920 also incorporates an NPU for neural processing, further improving its capabilities.
In terms of raw CPU performance, both processors offer powerful architectures, with the Kirin 980 having a slight advantage in clock speeds. The Dimensity 920, on the other hand, benefits from a more advanced lithography process, which can result in improved power efficiency and potentially better overall performance.
It's important to note that benchmark scores and real-life performance may vary, as there are other factors to consider, such as GPU performance, software optimization, and overall system integration. Both processors have their strengths and will provide excellent performance in their respective devices. Ultimately, the choice between the HiSilicon Kirin 980 and MediaTek Dimensity 920 may come down to personal preference and the specific requirements of the device they are integrated into.
Starting with the HiSilicon Kirin 980, it features a CPU architecture consisting of 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. With a total of 8 cores, it offers a versatile performance for various tasks. The processor is built on a 7 nm lithography process and has approximately 6900 million transistors. This efficient design allows it to operate with a TDP of only 6 Watts. Additionally, the HiSilicon Kirin 980 includes the HiSilicon Dual NPU, which enhances its neural processing capabilities.
On the other hand, the MediaTek Dimensity 920 features a CPU architecture with 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Like the Kirin 980, it also has 8 cores, enabling it to handle demanding tasks effectively. The Dimensity 920 is built on a 6 nm lithography process, making it more advanced in terms of manufacturing technology compared to the Kirin 980. However, this leads to a slightly higher TDP of 10 Watts. The Dimensity 920 also incorporates an NPU for neural processing, further improving its capabilities.
In terms of raw CPU performance, both processors offer powerful architectures, with the Kirin 980 having a slight advantage in clock speeds. The Dimensity 920, on the other hand, benefits from a more advanced lithography process, which can result in improved power efficiency and potentially better overall performance.
It's important to note that benchmark scores and real-life performance may vary, as there are other factors to consider, such as GPU performance, software optimization, and overall system integration. Both processors have their strengths and will provide excellent performance in their respective devices. Ultimately, the choice between the HiSilicon Kirin 980 and MediaTek Dimensity 920 may come down to personal preference and the specific requirements of the device they are integrated into.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 7 nm | 6 nm |
| Number of transistors | 6900 million | |
| TDP | 6 Watt | 10 Watt |
| Neural Processing | HiSilicon Dual NPU | NPU |
Memory (RAM)
| Max amount | up to 8 GB | up to 16 GB |
| Memory type | LPDDR4X | LPDDR5 |
| Memory frequency | 2133 MHz | 3200 MHz |
| Memory-bus | 4x16 bit | 4x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
| GPU name | Mali-G76 MP10 | Mali-G68 MP4 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 720 MHz | 950 MHz |
| Execution units | 10 | 4 |
| Shaders | 160 | 96 |
| DirectX | 12 | 12 |
| OpenCL API | 2.1 | 2.0 |
| OpenGL API | ES 3.2 | ES 3.2 |
| Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
| Max screen resolution | 3120x1440 | 2520x1080@120Hz |
| Max camera resolution | 1x 48MP, 2x 32MP | 1x 108MP, 2x 20MP |
| Max Video Capture | 4K@30fps | 4K@30fps |
| Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 1.4 Gbps | 2.77 Gbps |
| Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
| Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
| Bluetooth | 5.0 | 5.2 |
| Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
| Launch Date | 2018 Quarter 4 | 2021 Quarter 3 |
| Partnumber | MT6877T | |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Flagship | Mid-end |
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