HiSilicon Kirin 710F vs MediaTek Dimensity 820
The HiSilicon Kirin 710F and MediaTek Dimensity 820 are both processors commonly used in smartphones. While they have some similarities in terms of the number of cores and architecture, they differ in key specifications.
Starting with the HiSilicon Kirin 710F, it features a combination of four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores clocked at 1.7 GHz. This architecture allows for efficient multitasking and delivers a balance between performance and power usage. With its 12nm lithography, the Kirin 710F is capable of providing smooth performance while minimizing energy consumption. It has a total of 8 cores, supporting the ARMv8-A instruction set. Additionally, it boasts 5500 million transistors, enabling it to handle demanding tasks seamlessly. Its TDP (thermal design power) is quite low at 5 watts, making it an energy-efficient option.
On the other hand, the MediaTek Dimensity 820 offers a more powerful performance. Its architecture consists of four Cortex-A76 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz. The use of Cortex-A76 cores enhances overall performance, while the Cortex-A55 cores are designed for power efficiency. With a smaller 7nm lithography, the Dimensity 820 offers better power efficiency and heat management, resulting in improved battery life. Notably, the Dimensity 820 also incorporates a Neural Processing Unit (NPU), enabling advanced AI capabilities.
In terms of TDP, the Dimensity 820 has a slightly higher power consumption at 10 watts, potentially affecting battery life compared to the Kirin 710F. However, this may be offset by its enhanced performance and AI capabilities.
Overall, both processors offer a decent performance for smartphones, but the MediaTek Dimensity 820 stands out with its more powerful architecture, smaller lithography, and integrated NPU. While the Kirin 710F excels in energy efficiency with its lower TDP, the Dimensity 820 provides a better balance between performance and power usage, making it an attractive option for users seeking top-notch performance in their smartphones.
Starting with the HiSilicon Kirin 710F, it features a combination of four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores clocked at 1.7 GHz. This architecture allows for efficient multitasking and delivers a balance between performance and power usage. With its 12nm lithography, the Kirin 710F is capable of providing smooth performance while minimizing energy consumption. It has a total of 8 cores, supporting the ARMv8-A instruction set. Additionally, it boasts 5500 million transistors, enabling it to handle demanding tasks seamlessly. Its TDP (thermal design power) is quite low at 5 watts, making it an energy-efficient option.
On the other hand, the MediaTek Dimensity 820 offers a more powerful performance. Its architecture consists of four Cortex-A76 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz. The use of Cortex-A76 cores enhances overall performance, while the Cortex-A55 cores are designed for power efficiency. With a smaller 7nm lithography, the Dimensity 820 offers better power efficiency and heat management, resulting in improved battery life. Notably, the Dimensity 820 also incorporates a Neural Processing Unit (NPU), enabling advanced AI capabilities.
In terms of TDP, the Dimensity 820 has a slightly higher power consumption at 10 watts, potentially affecting battery life compared to the Kirin 710F. However, this may be offset by its enhanced performance and AI capabilities.
Overall, both processors offer a decent performance for smartphones, but the MediaTek Dimensity 820 stands out with its more powerful architecture, smaller lithography, and integrated NPU. While the Kirin 710F excels in energy efficiency with its lower TDP, the Dimensity 820 provides a better balance between performance and power usage, making it an attractive option for users seeking top-notch performance in their smartphones.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 12 nm | 7 nm |
| Number of transistors | 5500 million | |
| TDP | 5 Watt | 10 Watt |
| Neural Processing | NPU |
Memory (RAM)
| Max amount | up to 6 GB | up to 16 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 2133 MHz |
| Memory-bus | 2x32 bit | 2x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G57 MP5 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 1000 MHz | 650 MHz |
| Execution units | 4 | 5 |
| Shaders | 64 | 80 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 2520x1080@120Hz |
| Max camera resolution | 1x 48MP, 2x 24MP | 1x 80MP, 1x 32MP + 1x 16MP |
| Max Video Capture | 4K@30fps | |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
| Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
| Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
| Bluetooth | 4.2 | 5.1 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
| Launch Date | 2019 Quarter 1 | 2020 May |
| Partnumber | Hi6260 | MT6875 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Mid-end |
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