HiSilicon Kirin 710F vs MediaTek Dimensity 820

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The HiSilicon Kirin 710F and MediaTek Dimensity 820 are both processors commonly used in smartphones. While they have some similarities in terms of the number of cores and architecture, they differ in key specifications.

Starting with the HiSilicon Kirin 710F, it features a combination of four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores clocked at 1.7 GHz. This architecture allows for efficient multitasking and delivers a balance between performance and power usage. With its 12nm lithography, the Kirin 710F is capable of providing smooth performance while minimizing energy consumption. It has a total of 8 cores, supporting the ARMv8-A instruction set. Additionally, it boasts 5500 million transistors, enabling it to handle demanding tasks seamlessly. Its TDP (thermal design power) is quite low at 5 watts, making it an energy-efficient option.

On the other hand, the MediaTek Dimensity 820 offers a more powerful performance. Its architecture consists of four Cortex-A76 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz. The use of Cortex-A76 cores enhances overall performance, while the Cortex-A55 cores are designed for power efficiency. With a smaller 7nm lithography, the Dimensity 820 offers better power efficiency and heat management, resulting in improved battery life. Notably, the Dimensity 820 also incorporates a Neural Processing Unit (NPU), enabling advanced AI capabilities.

In terms of TDP, the Dimensity 820 has a slightly higher power consumption at 10 watts, potentially affecting battery life compared to the Kirin 710F. However, this may be offset by its enhanced performance and AI capabilities.

Overall, both processors offer a decent performance for smartphones, but the MediaTek Dimensity 820 stands out with its more powerful architecture, smaller lithography, and integrated NPU. While the Kirin 710F excels in energy efficiency with its lower TDP, the Dimensity 820 provides a better balance between performance and power usage, making it an attractive option for users seeking top-notch performance in their smartphones.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
4x 2.6 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 7 nm
Number of transistors 5500 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G51 MP4 Mali-G57 MP5
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 650 MHz
GPU boost frequency 1000 MHz
Execution units 4 5
Shaders 64 80
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2019 Quarter 1 2020 May
Partnumber Hi6260 MT6875
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
195573
Dimensity 820
403227

GeekBench 6 Single-Core

Score
Kirin 710F
329
Dimensity 820
615

GeekBench 6 Multi-Core

Score
Kirin 710F
1341
Dimensity 820
1924