Unisoc Tanggula T770 5G vs Unisoc Tiger T700
The Unisoc Tiger T700 and Unisoc Tanggula T770 5G are processors that offer different specifications aimed at different user needs.
Starting with the Unisoc Tiger T700, it features an architecture that includes 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. With a total of 8 cores, this processor can handle multiple tasks efficiently. It has an instruction set of ARMv8.2-A, making it compatible with modern applications. The Tiger T700 is built using a 12 nm lithography process, resulting in a balance between power efficiency and performance. With a TDP (Thermal Design Power) of 10 Watts, it ensures that the processor operates within acceptable thermal limits.
Moving on to the Unisoc Tanggula T770 5G, it offers a different set of specifications. This processor boasts an architecture that includes 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. With a total of 8 cores, it provides a mix of high-performance and power-efficient cores. Like the Tiger T700, it also supports the ARMv8.2-A instruction set. However, the Tanggula T770 5G is built using a more advanced 6 nm lithography process, which can translate into improved power efficiency and overall performance. Additionally, it features a Neural Processing Unit (NPU), which can enhance AI-related tasks.
In summary, while both processors have 8 cores and support ARMv8.2-A instruction set, the Unisoc Tanggula T770 5G stands out with its more powerful architecture, lower lithography (6 nm), lower TDP (5 Watts), and the inclusion of an NPU. These enhancements make the Tanggula T770 5G suitable for users who require higher performance, improved power efficiency, and AI capabilities. On the other hand, the Unisoc Tiger T700 offers a balanced set of specifications with a 12 nm lithography and slightly higher TDP of 10 Watts, which can be well-suited for general-purpose usage.
Starting with the Unisoc Tiger T700, it features an architecture that includes 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. With a total of 8 cores, this processor can handle multiple tasks efficiently. It has an instruction set of ARMv8.2-A, making it compatible with modern applications. The Tiger T700 is built using a 12 nm lithography process, resulting in a balance between power efficiency and performance. With a TDP (Thermal Design Power) of 10 Watts, it ensures that the processor operates within acceptable thermal limits.
Moving on to the Unisoc Tanggula T770 5G, it offers a different set of specifications. This processor boasts an architecture that includes 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. With a total of 8 cores, it provides a mix of high-performance and power-efficient cores. Like the Tiger T700, it also supports the ARMv8.2-A instruction set. However, the Tanggula T770 5G is built using a more advanced 6 nm lithography process, which can translate into improved power efficiency and overall performance. Additionally, it features a Neural Processing Unit (NPU), which can enhance AI-related tasks.
In summary, while both processors have 8 cores and support ARMv8.2-A instruction set, the Unisoc Tanggula T770 5G stands out with its more powerful architecture, lower lithography (6 nm), lower TDP (5 Watts), and the inclusion of an NPU. These enhancements make the Tanggula T770 5G suitable for users who require higher performance, improved power efficiency, and AI capabilities. On the other hand, the Unisoc Tiger T700 offers a balanced set of specifications with a 12 nm lithography and slightly higher TDP of 10 Watts, which can be well-suited for general-purpose usage.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 6 nm | 12 nm |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 32 GB | up to 4 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G52 MP2 |
GPU Architecture | Valhall | Bifrost |
GPU frequency | 850 MHz | 850 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080@120Hz | 2400x1080 |
Max camera resolution | 1x 108MP, 2x 24MP | 1x 48MP |
Max Video Capture | FullHD@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.7 Gbps | 0.3 Gbps |
Peak Upload Speed | 1.5 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 February | 2021 March |
Partnumber | T770, Tiger T7520 | T700 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
Popular comparisons:
1
Samsung Exynos 8890 vs Apple A12 Bionic
2
Unisoc Tiger T710 vs Samsung Exynos 7870
3
Qualcomm Snapdragon 820 vs Qualcomm Snapdragon 821
4
Samsung Exynos 7420 vs Samsung Exynos 9610
5
Qualcomm Snapdragon 845 vs HiSilicon Kirin 970
6
MediaTek Dimensity 7200 vs Qualcomm Snapdragon 870
7
Samsung Exynos 980 vs Samsung Exynos 1280
8
MediaTek Dimensity 900 vs Samsung Exynos 2200
9
MediaTek Dimensity 6020 vs Apple A11 Bionic
10
MediaTek Helio P65 vs MediaTek Dimensity 800