HiSilicon Kirin 710F vs MediaTek Dimensity 810

The HiSilicon Kirin 710F and the MediaTek Dimensity 810 are two processors commonly found in smartphones and other devices. While they both have their own unique specifications, let's compare them side by side.

In terms of CPU cores and architecture, the Kirin 710F features 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Dimensity 810 boasts 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. The Kirin 710F has a slightly higher clock speed for its A73 cores, while the Dimensity 810 has a higher clock speed for its A76 cores.

Both processors have 8 cores, but the Dimensity 810 utilizes ARMv8.2-A instruction set, while the Kirin 710F uses ARMv8-A. This means that the Dimensity 810 supports an updated version of the ARM instruction set, potentially offering better performance in certain tasks.

Moving on to lithography, the Kirin 710F is fabricated on a 12 nm process, while the Dimensity 810 uses a more advanced 6 nm process. A smaller lithography generally translates to better power efficiency and potentially higher performance.

In terms of transistor count, the Dimensity 810 clearly takes the lead with 12000 million transistors, compared to the Kirin 710F's 5500 million transistors. With more transistors, the Dimensity 810 is likely to offer better overall performance.

Lastly, the Dimensity 810 sets itself apart from the Kirin 710F with the inclusion of a Neural Processing Unit (NPU). An NPU assists with artificial intelligence (AI) tasks, enabling faster and more efficient processing of AI-related functions.

In terms of power consumption, the Kirin 710F has a TDP (Thermal Design Power) of 5 Watts, while the Dimensity 810 has a slightly higher TDP of 8 Watts. Though the Dimensity 810 consumes more power, it's important to note that power consumption can vary based on factors such as workload and device optimization.

Overall, both the HiSilicon Kirin 710F and the MediaTek Dimensity 810 have their own strengths and weaknesses. The Dimensity 810 offers a more advanced fabrication process, higher transistor count, and the inclusion of an NPU for AI tasks. However, the Kirin 710F still holds its own with a decent clock speed, lower power consumption, and compatibility with the widely used ARMv8-A instruction set.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 6 nm
Number of transistors 5500 million 12000 million
TDP 5 Watt 8 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit


Storage specification UFS 2.1 UFS 2.2


GPU name Mali-G51 MP4 Mali-G57 MP2
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 950 MHz
GPU boost frequency 1000 MHz
Execution units 4 2
Shaders 64 32
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 64MP, 2x 16MP
Max Video Capture 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou

Supplemental Information

Launch Date 2019 Quarter 1 2021 Quarter 3
Partnumber Hi6260 MT6833V/PNZA, MT6833P
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
Dimensity 810

GeekBench 6 Single-Core

Kirin 710F
Dimensity 810

GeekBench 6 Multi-Core

Kirin 710F
Dimensity 810