HiSilicon Kirin 710F vs MediaTek Dimensity 810
The HiSilicon Kirin 710F and the MediaTek Dimensity 810 are two processors commonly found in smartphones and other devices. While they both have their own unique specifications, let's compare them side by side.
In terms of CPU cores and architecture, the Kirin 710F features 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Dimensity 810 boasts 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. The Kirin 710F has a slightly higher clock speed for its A73 cores, while the Dimensity 810 has a higher clock speed for its A76 cores.
Both processors have 8 cores, but the Dimensity 810 utilizes ARMv8.2-A instruction set, while the Kirin 710F uses ARMv8-A. This means that the Dimensity 810 supports an updated version of the ARM instruction set, potentially offering better performance in certain tasks.
Moving on to lithography, the Kirin 710F is fabricated on a 12 nm process, while the Dimensity 810 uses a more advanced 6 nm process. A smaller lithography generally translates to better power efficiency and potentially higher performance.
In terms of transistor count, the Dimensity 810 clearly takes the lead with 12000 million transistors, compared to the Kirin 710F's 5500 million transistors. With more transistors, the Dimensity 810 is likely to offer better overall performance.
Lastly, the Dimensity 810 sets itself apart from the Kirin 710F with the inclusion of a Neural Processing Unit (NPU). An NPU assists with artificial intelligence (AI) tasks, enabling faster and more efficient processing of AI-related functions.
In terms of power consumption, the Kirin 710F has a TDP (Thermal Design Power) of 5 Watts, while the Dimensity 810 has a slightly higher TDP of 8 Watts. Though the Dimensity 810 consumes more power, it's important to note that power consumption can vary based on factors such as workload and device optimization.
Overall, both the HiSilicon Kirin 710F and the MediaTek Dimensity 810 have their own strengths and weaknesses. The Dimensity 810 offers a more advanced fabrication process, higher transistor count, and the inclusion of an NPU for AI tasks. However, the Kirin 710F still holds its own with a decent clock speed, lower power consumption, and compatibility with the widely used ARMv8-A instruction set.
In terms of CPU cores and architecture, the Kirin 710F features 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Dimensity 810 boasts 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. The Kirin 710F has a slightly higher clock speed for its A73 cores, while the Dimensity 810 has a higher clock speed for its A76 cores.
Both processors have 8 cores, but the Dimensity 810 utilizes ARMv8.2-A instruction set, while the Kirin 710F uses ARMv8-A. This means that the Dimensity 810 supports an updated version of the ARM instruction set, potentially offering better performance in certain tasks.
Moving on to lithography, the Kirin 710F is fabricated on a 12 nm process, while the Dimensity 810 uses a more advanced 6 nm process. A smaller lithography generally translates to better power efficiency and potentially higher performance.
In terms of transistor count, the Dimensity 810 clearly takes the lead with 12000 million transistors, compared to the Kirin 710F's 5500 million transistors. With more transistors, the Dimensity 810 is likely to offer better overall performance.
Lastly, the Dimensity 810 sets itself apart from the Kirin 710F with the inclusion of a Neural Processing Unit (NPU). An NPU assists with artificial intelligence (AI) tasks, enabling faster and more efficient processing of AI-related functions.
In terms of power consumption, the Kirin 710F has a TDP (Thermal Design Power) of 5 Watts, while the Dimensity 810 has a slightly higher TDP of 8 Watts. Though the Dimensity 810 consumes more power, it's important to note that power consumption can vary based on factors such as workload and device optimization.
Overall, both the HiSilicon Kirin 710F and the MediaTek Dimensity 810 have their own strengths and weaknesses. The Dimensity 810 offers a more advanced fabrication process, higher transistor count, and the inclusion of an NPU for AI tasks. However, the Kirin 710F still holds its own with a decent clock speed, lower power consumption, and compatibility with the widely used ARMv8-A instruction set.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 6 nm |
Number of transistors | 5500 million | 12000 million |
TDP | 5 Watt | 8 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP2 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 950 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 64MP, 2x 16MP |
Max Video Capture | 2K@30FPS | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2021 Quarter 3 |
Partnumber | Hi6260 | MT6833V/PNZA, MT6833P |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 1300 vs MediaTek Dimensity 8000
2
MediaTek Dimensity 800 vs MediaTek Dimensity 9000 Plus
3
MediaTek Dimensity 9000 vs Qualcomm Snapdragon 695
4
Qualcomm Snapdragon 855 vs Qualcomm Snapdragon 821
5
MediaTek Dimensity 6100 Plus vs Qualcomm Snapdragon 632
6
Qualcomm Snapdragon 8 Gen 1 vs Samsung Exynos 9609
7
Qualcomm Snapdragon 820 vs Qualcomm Snapdragon 845
8
Qualcomm Snapdragon 678 vs Apple A10 Fusion
9
MediaTek Dimensity 1100 vs Samsung Exynos 7884B
10
HiSilicon Kirin 9000E 5G vs HiSilicon Kirin 950