HiSilicon Kirin 710A vs MediaTek Dimensity 700
When comparing the specifications of the HiSilicon Kirin 710A and the MediaTek Dimensity 700 processors, several key differences become apparent.
Starting with the CPU cores and architecture, the HiSilicon Kirin 710A features a combination of 4 Cortex-A73 cores clocked at 2.0 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. In contrast, the MediaTek Dimensity 700 has 2 Cortex-A76 cores clocked at 2.2 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. The difference in architecture could indicate varying performance capabilities.
Both processors have 8 cores in total, allowing for smooth multitasking and efficient processing of various tasks. However, the HiSilicon Kirin 710A utilizes an ARMv8-A instruction set, while the MediaTek Dimensity 700 employs the ARMv8.2-A instruction set. This difference suggests potential variations in software compatibility and optimization for specific tasks.
Another significant distinction lies in the lithography process used during manufacturing. The HiSilicon Kirin 710A is built on a 14 nm process, while the MediaTek Dimensity 700 utilizes a more advanced 7 nm process. A smaller lithography generally indicates enhanced power efficiency and potentially improved performance.
In terms of power consumption, the HiSilicon Kirin 710A has a TDP (Thermal Design Power) of 5 Watts, while the MediaTek Dimensity 700 has a slightly higher TDP of 10 Watts. This implies that the HiSilicon Kirin 710A may have better energy efficiency, resulting in longer battery life for devices that incorporate this processor.
In summary, the HiSilicon Kirin 710A and MediaTek Dimensity 700 processors differ in various aspects. The HiSilicon Kirin 710A offers a combination of Cortex-A73 and Cortex-A53 cores, operates with a 14 nm lithography, and has a lower TDP of 5 Watts. In contrast, the MediaTek Dimensity 700 has a combination of Cortex-A76 and Cortex-A55 cores, operates with a more advanced 7 nm lithography, and has a slightly higher TDP of 10 Watts. These variations in specifications may result in differences in performance, power efficiency, and software optimization, making them suitable for distinct use cases and target markets.
Starting with the CPU cores and architecture, the HiSilicon Kirin 710A features a combination of 4 Cortex-A73 cores clocked at 2.0 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. In contrast, the MediaTek Dimensity 700 has 2 Cortex-A76 cores clocked at 2.2 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. The difference in architecture could indicate varying performance capabilities.
Both processors have 8 cores in total, allowing for smooth multitasking and efficient processing of various tasks. However, the HiSilicon Kirin 710A utilizes an ARMv8-A instruction set, while the MediaTek Dimensity 700 employs the ARMv8.2-A instruction set. This difference suggests potential variations in software compatibility and optimization for specific tasks.
Another significant distinction lies in the lithography process used during manufacturing. The HiSilicon Kirin 710A is built on a 14 nm process, while the MediaTek Dimensity 700 utilizes a more advanced 7 nm process. A smaller lithography generally indicates enhanced power efficiency and potentially improved performance.
In terms of power consumption, the HiSilicon Kirin 710A has a TDP (Thermal Design Power) of 5 Watts, while the MediaTek Dimensity 700 has a slightly higher TDP of 10 Watts. This implies that the HiSilicon Kirin 710A may have better energy efficiency, resulting in longer battery life for devices that incorporate this processor.
In summary, the HiSilicon Kirin 710A and MediaTek Dimensity 700 processors differ in various aspects. The HiSilicon Kirin 710A offers a combination of Cortex-A73 and Cortex-A53 cores, operates with a 14 nm lithography, and has a lower TDP of 5 Watts. In contrast, the MediaTek Dimensity 700 has a combination of Cortex-A76 and Cortex-A55 cores, operates with a more advanced 7 nm lithography, and has a slightly higher TDP of 10 Watts. These variations in specifications may result in differences in performance, power efficiency, and software optimization, making them suitable for distinct use cases and target markets.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 14 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP2 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 950 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@90Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 64MP, 2x 16MP |
Max Video Capture | 4K@30fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2021 Quarter 1 |
Partnumber | Hi6260 | MT6833V/ZA, MT6833V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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