HiSilicon Kirin 710F vs MediaTek Dimensity 700

The HiSilicon Kirin 710F and the MediaTek Dimensity 700 are two processors that cater to the mid-range smartphone market. Both of these processors offer a decent performance but have their own unique specifications that set them apart.

Starting with the HiSilicon Kirin 710F, it features an 8-core configuration with a combination of powerful Cortex-A73 cores running at 2.2 GHz and efficient Cortex-A53 cores clocked at 1.7 GHz. This architecture allows for a balance between performance and power efficiency. With a lithography of 12 nm, the processor achieves a TDP of 5 Watts, which helps in reducing power consumption.

On the other hand, the MediaTek Dimensity 700 also employs an 8-core setup. It includes two powerful Cortex-A76 cores clocked at 2.2 GHz and six Cortex-A55 cores operating at 2 GHz. This configuration emphasizes an optimized performance for demanding tasks. The Dimensity 700 stands out with its 7 nm lithography, which signifies improved power efficiency. However, the trade-off for this enhanced performance is a slightly higher TDP of 10 Watts.

Both processors operate with ARMv8 instruction set architecture, which ensures compatibility and optimization for a wide range of software. In terms of transistor count, the HiSilicon Kirin 710F houses 5500 million transistors, whereas the exact number for the MediaTek Dimensity 700 is not specified.

While the HiSilicon Kirin 710F excels in power efficiency with its lower TDP, the MediaTek Dimensity 700 focuses on delivering stronger performance with its faster clock speeds. The Kirin 710F, with its 12 nm lithography, may struggle to keep up against the Dimensity 700's 7 nm lithography in terms of efficiency.

In conclusion, the HiSilicon Kirin 710F and the MediaTek Dimensity 700 have their own unique set of specifications. The Kirin 710F emphasizes power efficiency with its lower TDP and 12 nm lithography, while the Dimensity 700 prioritizes performance with its faster clock speeds and 7 nm lithography. Ultimately, the choice between these two processors depends on the specific requirements and preferences of the smartphone user.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 7 nm
Number of transistors 5500 million
TDP 5 Watt 10 Watt

Memory (RAM)

Max amount up to 6 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit


Storage specification UFS 2.1 UFS 2.2


GPU name Mali-G51 MP4 Mali-G57 MP2
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 950 MHz
GPU boost frequency 1000 MHz
Execution units 4 2
Shaders 64 32
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@90Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 64MP, 2x 16MP
Max Video Capture 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou

Supplemental Information

Launch Date 2019 Quarter 1 2021 Quarter 1
Partnumber Hi6260 MT6833V/ZA, MT6833V/NZA
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
Dimensity 700

GeekBench 6 Single-Core

Kirin 710F
Dimensity 700

GeekBench 6 Multi-Core

Kirin 710F
Dimensity 700