HiSilicon Kirin 710F vs MediaTek Dimensity 700
The HiSilicon Kirin 710F and the MediaTek Dimensity 700 are two processors that cater to the mid-range smartphone market. Both of these processors offer a decent performance but have their own unique specifications that set them apart.
Starting with the HiSilicon Kirin 710F, it features an 8-core configuration with a combination of powerful Cortex-A73 cores running at 2.2 GHz and efficient Cortex-A53 cores clocked at 1.7 GHz. This architecture allows for a balance between performance and power efficiency. With a lithography of 12 nm, the processor achieves a TDP of 5 Watts, which helps in reducing power consumption.
On the other hand, the MediaTek Dimensity 700 also employs an 8-core setup. It includes two powerful Cortex-A76 cores clocked at 2.2 GHz and six Cortex-A55 cores operating at 2 GHz. This configuration emphasizes an optimized performance for demanding tasks. The Dimensity 700 stands out with its 7 nm lithography, which signifies improved power efficiency. However, the trade-off for this enhanced performance is a slightly higher TDP of 10 Watts.
Both processors operate with ARMv8 instruction set architecture, which ensures compatibility and optimization for a wide range of software. In terms of transistor count, the HiSilicon Kirin 710F houses 5500 million transistors, whereas the exact number for the MediaTek Dimensity 700 is not specified.
While the HiSilicon Kirin 710F excels in power efficiency with its lower TDP, the MediaTek Dimensity 700 focuses on delivering stronger performance with its faster clock speeds. The Kirin 710F, with its 12 nm lithography, may struggle to keep up against the Dimensity 700's 7 nm lithography in terms of efficiency.
In conclusion, the HiSilicon Kirin 710F and the MediaTek Dimensity 700 have their own unique set of specifications. The Kirin 710F emphasizes power efficiency with its lower TDP and 12 nm lithography, while the Dimensity 700 prioritizes performance with its faster clock speeds and 7 nm lithography. Ultimately, the choice between these two processors depends on the specific requirements and preferences of the smartphone user.
Starting with the HiSilicon Kirin 710F, it features an 8-core configuration with a combination of powerful Cortex-A73 cores running at 2.2 GHz and efficient Cortex-A53 cores clocked at 1.7 GHz. This architecture allows for a balance between performance and power efficiency. With a lithography of 12 nm, the processor achieves a TDP of 5 Watts, which helps in reducing power consumption.
On the other hand, the MediaTek Dimensity 700 also employs an 8-core setup. It includes two powerful Cortex-A76 cores clocked at 2.2 GHz and six Cortex-A55 cores operating at 2 GHz. This configuration emphasizes an optimized performance for demanding tasks. The Dimensity 700 stands out with its 7 nm lithography, which signifies improved power efficiency. However, the trade-off for this enhanced performance is a slightly higher TDP of 10 Watts.
Both processors operate with ARMv8 instruction set architecture, which ensures compatibility and optimization for a wide range of software. In terms of transistor count, the HiSilicon Kirin 710F houses 5500 million transistors, whereas the exact number for the MediaTek Dimensity 700 is not specified.
While the HiSilicon Kirin 710F excels in power efficiency with its lower TDP, the MediaTek Dimensity 700 focuses on delivering stronger performance with its faster clock speeds. The Kirin 710F, with its 12 nm lithography, may struggle to keep up against the Dimensity 700's 7 nm lithography in terms of efficiency.
In conclusion, the HiSilicon Kirin 710F and the MediaTek Dimensity 700 have their own unique set of specifications. The Kirin 710F emphasizes power efficiency with its lower TDP and 12 nm lithography, while the Dimensity 700 prioritizes performance with its faster clock speeds and 7 nm lithography. Ultimately, the choice between these two processors depends on the specific requirements and preferences of the smartphone user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP2 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 1000 MHz | 950 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@90Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 64MP, 2x 16MP |
Max Video Capture | 2K@30FPS | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2021 Quarter 1 |
Partnumber | Hi6260 | MT6833V/ZA, MT6833V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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