HiSilicon Kirin 710F vs HiSilicon Kirin 820 5G

VS
The HiSilicon Kirin 710F and the HiSilicon Kirin 820 5G are two processors manufactured by HiSilicon, a subsidiary of Huawei. These processors power a number of smartphones and other devices, and while they have some similarities, they also have key differences in their specifications.

Starting with the Kirin 710F, this processor features an architecture that consists of 4x Cortex-A73 cores clocked at 2.2 GHz and 4x Cortex-A53 cores clocked at 1.7 GHz. With a total of 8 cores, it offers a balanced combination of performance and power efficiency. It is based on the ARMv8-A instruction set and has a lithography of 12 nm, which means it is manufactured using a 12-nanometer manufacturing process. The Kirin 710F has a TDP (Thermal Design Power) of 5 watts, indicating its power consumption.

On the other hand, the Kirin 820 5G features a more advanced architecture. It has 1x Cortex-A76 core clocked at 2.36 GHz, 3x Cortex-A76 cores clocked at 2.22 GHz, and 4x Cortex-A55 cores clocked at 1.84 GHz. This combination provides a higher level of performance compared to the Kirin 710F. The Kirin 820 5G uses the ARMv8.2-A instruction set and has a lithography of 7 nm, making it more power-efficient. It has a slightly higher TDP of 6 watts. Additionally, the Kirin 820 5G incorporates Neural Processing with Ascend D110 Lite and Huawei Da Vinci Architecture, which enables advanced AI capabilities and enhances overall performance.

In summary, the HiSilicon Kirin 820 5G outperforms the Kirin 710F in terms of its architecture, featuring more powerful Cortex-A76 cores. It also benefits from a more advanced manufacturing process, resulting in improved power efficiency. The Kirin 820 5G's integration of Neural Processing with Ascend D110 Lite and Da Vinci Architecture further enhances its capabilities. However, both processors are capable of delivering solid performance, so the choice between them ultimately depends on the specific requirements and budget of the device in which they are used.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 7 nm
Number of transistors 5500 million
TDP 5 Watt 6 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 6 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G51 MP4 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 850 MHz
GPU boost frequency 1000 MHz
Execution units 4 6
Shaders 64 96
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080
Max camera resolution 1x 48MP, 2x 24MP 1x 48MP, 2x 20MP
Max Video Capture 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 1.6 Gbps
Peak Upload Speed 0.15 Gbps 0.2 Gbps
Wi-Fi 4 (802.11n) 6 (802.11ax)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2019 Quarter 1 2020 March
Partnumber Hi6260
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
195573
Kirin 820 5G
387656

GeekBench 6 Single-Core

Score
Kirin 710F
329
Kirin 820 5G
640

GeekBench 6 Multi-Core

Score
Kirin 710F
1341
Kirin 820 5G
2436