HiSilicon Kirin 710F vs HiSilicon Kirin 820 5G
The HiSilicon Kirin 710F and the HiSilicon Kirin 820 5G are two processors manufactured by HiSilicon, a subsidiary of Huawei. These processors power a number of smartphones and other devices, and while they have some similarities, they also have key differences in their specifications.
Starting with the Kirin 710F, this processor features an architecture that consists of 4x Cortex-A73 cores clocked at 2.2 GHz and 4x Cortex-A53 cores clocked at 1.7 GHz. With a total of 8 cores, it offers a balanced combination of performance and power efficiency. It is based on the ARMv8-A instruction set and has a lithography of 12 nm, which means it is manufactured using a 12-nanometer manufacturing process. The Kirin 710F has a TDP (Thermal Design Power) of 5 watts, indicating its power consumption.
On the other hand, the Kirin 820 5G features a more advanced architecture. It has 1x Cortex-A76 core clocked at 2.36 GHz, 3x Cortex-A76 cores clocked at 2.22 GHz, and 4x Cortex-A55 cores clocked at 1.84 GHz. This combination provides a higher level of performance compared to the Kirin 710F. The Kirin 820 5G uses the ARMv8.2-A instruction set and has a lithography of 7 nm, making it more power-efficient. It has a slightly higher TDP of 6 watts. Additionally, the Kirin 820 5G incorporates Neural Processing with Ascend D110 Lite and Huawei Da Vinci Architecture, which enables advanced AI capabilities and enhances overall performance.
In summary, the HiSilicon Kirin 820 5G outperforms the Kirin 710F in terms of its architecture, featuring more powerful Cortex-A76 cores. It also benefits from a more advanced manufacturing process, resulting in improved power efficiency. The Kirin 820 5G's integration of Neural Processing with Ascend D110 Lite and Da Vinci Architecture further enhances its capabilities. However, both processors are capable of delivering solid performance, so the choice between them ultimately depends on the specific requirements and budget of the device in which they are used.
Starting with the Kirin 710F, this processor features an architecture that consists of 4x Cortex-A73 cores clocked at 2.2 GHz and 4x Cortex-A53 cores clocked at 1.7 GHz. With a total of 8 cores, it offers a balanced combination of performance and power efficiency. It is based on the ARMv8-A instruction set and has a lithography of 12 nm, which means it is manufactured using a 12-nanometer manufacturing process. The Kirin 710F has a TDP (Thermal Design Power) of 5 watts, indicating its power consumption.
On the other hand, the Kirin 820 5G features a more advanced architecture. It has 1x Cortex-A76 core clocked at 2.36 GHz, 3x Cortex-A76 cores clocked at 2.22 GHz, and 4x Cortex-A55 cores clocked at 1.84 GHz. This combination provides a higher level of performance compared to the Kirin 710F. The Kirin 820 5G uses the ARMv8.2-A instruction set and has a lithography of 7 nm, making it more power-efficient. It has a slightly higher TDP of 6 watts. Additionally, the Kirin 820 5G incorporates Neural Processing with Ascend D110 Lite and Huawei Da Vinci Architecture, which enables advanced AI capabilities and enhances overall performance.
In summary, the HiSilicon Kirin 820 5G outperforms the Kirin 710F in terms of its architecture, featuring more powerful Cortex-A76 cores. It also benefits from a more advanced manufacturing process, resulting in improved power efficiency. The Kirin 820 5G's integration of Neural Processing with Ascend D110 Lite and Da Vinci Architecture further enhances its capabilities. However, both processors are capable of delivering solid performance, so the choice between them ultimately depends on the specific requirements and budget of the device in which they are used.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP6 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 850 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 6 |
Shaders | 64 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2020 March |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Unisoc Tanggula T770 5G vs MediaTek Dimensity 1200
2
HiSilicon Kirin 990 5G vs MediaTek Dimensity 6100 Plus
3
Qualcomm Snapdragon 765G vs Qualcomm Snapdragon 835
4
Qualcomm Snapdragon 730G vs Qualcomm Snapdragon 675
5
Qualcomm Snapdragon 8 Plus Gen 1 vs MediaTek Dimensity 820
6
Unisoc SC7731E vs MediaTek Helio P90
7
MediaTek Helio G35 vs MediaTek Dimensity 1050
8
Google Tensor G3 vs MediaTek Dimensity 900
9
HiSilicon Kirin 810 vs Samsung Exynos 2100
10
Qualcomm Snapdragon 732G vs MediaTek Helio G25