HiSilicon Kirin 710A vs Unisoc Tiger T310
Compared to the HiSilicon Kirin 710A, the Unisoc Tiger T310 has some notable differences in terms of specifications.
Starting with the CPU cores and architecture, the Kirin 710A comprises four Cortex-A73 cores clocked at 2.0 GHz and four Cortex-A53 cores clocked at 1.7 GHz. In contrast, the Tiger T310 consists of one Cortex-A75 core clocked at 2.0 GHz and three Cortex-A55 cores clocked at 1.8 GHz. This indicates that the Kirin 710A offers a higher number of cores compared to the Tiger T310.
Moving on to the instruction set, the Kirin 710A follows the ARMv8-A instruction set, while the Tiger T310 utilizes the ARMv8.2-A instruction set. It is worth noting that the ARMv8.2-A instruction set offers more advanced features and optimizations compared to the ARMv8-A instruction set adopted by the Kirin 710A.
In terms of lithography, the Kirin 710A is manufactured using a 14 nm process, while the Tiger T310 employs a 12 nm process. A lower nm value generally translates to improved power efficiency and potentially higher performance.
Furthermore, the Kirin 710A consists of 5,500 million transistors, whereas the transistors count for the Tiger T310 is not specified. This implies that the Kirin 710A potentially has a higher transistor count, which can positively impact the processor's performance.
Lastly, the TDP (Thermal Design Power) for the Kirin 710A is specified as 5 Watts, whereas the TDP for the Tiger T310 is not mentioned. A lower TDP generally indicates better power efficiency and lower heat dissipation.
In summary, the HiSilicon Kirin 710A offers a higher number of cores, while the Unisoc Tiger T310 adopts a more advanced instruction set. The Kirin 710A utilizes a 14 nm process and has a specified TDP, while the Tiger T310 uses a 12 nm process and has unspecified TDP. However, without detailed information on the Tiger T310's transistor count and TDP, it is difficult to make a comprehensive comparison solely based on the provided specifications.
Starting with the CPU cores and architecture, the Kirin 710A comprises four Cortex-A73 cores clocked at 2.0 GHz and four Cortex-A53 cores clocked at 1.7 GHz. In contrast, the Tiger T310 consists of one Cortex-A75 core clocked at 2.0 GHz and three Cortex-A55 cores clocked at 1.8 GHz. This indicates that the Kirin 710A offers a higher number of cores compared to the Tiger T310.
Moving on to the instruction set, the Kirin 710A follows the ARMv8-A instruction set, while the Tiger T310 utilizes the ARMv8.2-A instruction set. It is worth noting that the ARMv8.2-A instruction set offers more advanced features and optimizations compared to the ARMv8-A instruction set adopted by the Kirin 710A.
In terms of lithography, the Kirin 710A is manufactured using a 14 nm process, while the Tiger T310 employs a 12 nm process. A lower nm value generally translates to improved power efficiency and potentially higher performance.
Furthermore, the Kirin 710A consists of 5,500 million transistors, whereas the transistors count for the Tiger T310 is not specified. This implies that the Kirin 710A potentially has a higher transistor count, which can positively impact the processor's performance.
Lastly, the TDP (Thermal Design Power) for the Kirin 710A is specified as 5 Watts, whereas the TDP for the Tiger T310 is not mentioned. A lower TDP generally indicates better power efficiency and lower heat dissipation.
In summary, the HiSilicon Kirin 710A offers a higher number of cores, while the Unisoc Tiger T310 adopts a more advanced instruction set. The Kirin 710A utilizes a 14 nm process and has a specified TDP, while the Tiger T310 uses a 12 nm process and has unspecified TDP. However, without detailed information on the Tiger T310's transistor count and TDP, it is difficult to make a comprehensive comparison solely based on the provided specifications.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 2 GHz – Cortex-A75 3x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 14 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1333 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G51 MP4 | Imagination PowerVR GE8300 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 650 MHz | 660 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 12 | 10 |
OpenCL API | 2.0 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 1600x720 |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 16MP + 1x 8MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2019 April |
Partnumber | Hi6260 | T310 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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