MediaTek Dimensity 900 vs Unisoc Tanggula T770 5G
The Unisoc Tanggula T770 5G and the MediaTek Dimensity 900 are both powerful processors with their own set of specifications.
In terms of CPU cores and architecture, the Tanggula T770 5G features a combination of Cortex-A76 and Cortex-A55 cores. It has 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. On the other hand, the Dimensity 900 also has a combination of cores but with a different configuration. It consists of 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores.
Both processors have 8 cores in total, offering efficient multitasking capabilities. They also share the same instruction set, ARMv8.2-A, ensuring compatibility with a wide range of software and applications. Furthermore, both processors are fabricated on a 6 nm lithography process, which contributes to their power efficiency and overall performance.
When it comes to neural processing, both processors incorporate NPUs (Neural Processing Units), which enhance their AI capabilities and enable various AI-powered features such as facial recognition and intelligent camera functions.
However, there are a few differences between these processors. The Dimensity 900 boasts a higher clock speed, with its Cortex-A78 cores running at 2.4 GHz compared to the Tanggula T770 5G's 2.5 GHz Cortex-A76 core. Additionally, the Dimensity 900 includes a significantly larger number of transistors — 10,000 million — suggesting a more complex and powerful design.
On the other hand, the Tanggula T770 5G offers a lower thermal design power (TDP) of 5 watts, indicating better power efficiency compared to the Dimensity 900's TDP of 10 watts.
In conclusion, both the Unisoc Tanggula T770 5G and the MediaTek Dimensity 900 are capable processors with similar CPU architecture and lithography. While the Tanggula T770 5G excels in terms of power efficiency with a lower TDP, the Dimensity 900 offers a higher clock speed and a larger number of transistors, potentially providing better performance for certain tasks. Ultimately, the choice between these processors depends on the specific needs and preferences of the user.
In terms of CPU cores and architecture, the Tanggula T770 5G features a combination of Cortex-A76 and Cortex-A55 cores. It has 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. On the other hand, the Dimensity 900 also has a combination of cores but with a different configuration. It consists of 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores.
Both processors have 8 cores in total, offering efficient multitasking capabilities. They also share the same instruction set, ARMv8.2-A, ensuring compatibility with a wide range of software and applications. Furthermore, both processors are fabricated on a 6 nm lithography process, which contributes to their power efficiency and overall performance.
When it comes to neural processing, both processors incorporate NPUs (Neural Processing Units), which enhance their AI capabilities and enable various AI-powered features such as facial recognition and intelligent camera functions.
However, there are a few differences between these processors. The Dimensity 900 boasts a higher clock speed, with its Cortex-A78 cores running at 2.4 GHz compared to the Tanggula T770 5G's 2.5 GHz Cortex-A76 core. Additionally, the Dimensity 900 includes a significantly larger number of transistors — 10,000 million — suggesting a more complex and powerful design.
On the other hand, the Tanggula T770 5G offers a lower thermal design power (TDP) of 5 watts, indicating better power efficiency compared to the Dimensity 900's TDP of 10 watts.
In conclusion, both the Unisoc Tanggula T770 5G and the MediaTek Dimensity 900 are capable processors with similar CPU architecture and lithography. While the Tanggula T770 5G excels in terms of power efficiency with a lower TDP, the Dimensity 900 offers a higher clock speed and a larger number of transistors, potentially providing better performance for certain tasks. Ultimately, the choice between these processors depends on the specific needs and preferences of the user.
CPU cores and architecture
Architecture | 2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 6 nm | 6 nm |
Number of transistors | 10000 million | |
TDP | 10 Watt | 5 Watt |
Neural Processing | NPU | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 32 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 3200 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 3.1 |
Graphics
GPU name | Mali-G68 MP4 | Mali-G57 MP6 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 900 MHz | 850 MHz |
Execution units | 4 | 6 |
Shaders | 64 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2160x1080@120Hz |
Max camera resolution | 1x 108MP, 2x 20MP | 1x 108MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 2.7 Gbps |
Peak Upload Speed | 1.2 Gbps | 1.5 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 Quarter 1 | 2021 February |
Partnumber | MT6877 | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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