HiSilicon Kirin 710A vs Unisoc Tanggula T770 5G

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The HiSilicon Kirin 710A and the Unisoc Tanggula T770 5G are two processors with different specifications. Let's compare them based on their specifications.

Starting with the HiSilicon Kirin 710A, it features an architecture of 4x 2.0 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53. With a total of eight cores, it offers a balanced combination of high-performance and power-efficient cores. The instruction set supported by this processor is ARMv8-A, which ensures compatibility with a wide range of software. Built on a 14 nm lithography process, it strikes a good balance between power efficiency and performance. Furthermore, it incorporates around 5500 million transistors and has a power consumption of 5 watts.

On the other hand, the Unisoc Tanggula T770 5G boasts an advanced architecture with a combination of Cortex-A76 and Cortex-A55 cores. It features 1x 2.5 GHz Cortex-A76, 3x 2.2 GHz Cortex-A76, and 4x 2.0 GHz Cortex-A55 cores. This configuration provides a powerful processing capability to handle demanding tasks. The instruction set supported by this processor is ARMv8.2-A, which includes enhancements over the ARMv8-A. With a smaller lithography of 6 nm, the Unisoc Tanggula T770 5G offers improved power efficiency and potentially higher performance. It also includes a Neural Processing Unit (NPU), which enables AI-related tasks.

In terms of power consumption, both processors have a TDP of 5 watts, indicating that they are designed to operate within a similar power range.

To summarize, the HiSilicon Kirin 710A and the Unisoc Tanggula T770 5G differ in terms of their CPU architecture, instruction set, lithography process, and the inclusion of an NPU in the latter. While the HiSilicon Kirin 710A offers a balanced combination of performance and power efficiency, the Unisoc Tanggula T770 5G includes more powerful Cortex-A76 cores and an NPU for AI-related tasks. The choice between the two processors would depend on specific requirements and priorities, such as power efficiency, processing power, or AI capabilities.

CPU cores and architecture

Architecture	4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53	1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55
Number of cores	8	8
Instruction Set	ARMv8-A	ARMv8.2-A
Lithography	14 nm	6 nm
Number of transistors	5500 million
TDP	5 Watt	5 Watt
Neural Processing		NPU

Memory (RAM)

Max amount	up to 6 GB	up to 32 GB
Memory type	LPDDR4	LPDDR4X
Memory frequency	1866 MHz	2133 MHz
Memory-bus	2x32 bit	4x16 bit

Storage

Storage specification

UFS 2.1

UFS 3.1

Graphics

GPU name	Mali-G51 MP4	Mali-G57 MP6
GPU Architecture	Bifrost	Valhall
GPU frequency	650 MHz	850 MHz
GPU boost frequency	1000 MHz
Execution units	4	6
Shaders	64	96
DirectX	12	12
OpenCL API	2.0	2.1
OpenGL API		ES 3.2
Vulkan API	1.0	1.2

Camera, Video, Display

Max screen resolution	2340x1080	2160x1080@120Hz
Max camera resolution	1x 48MP, 2x 24MP	1x 108MP, 2x 24MP
Max Video Capture	4K@30fps	FullHD@30fps
Video codec support	H.264 (AVC) H.265 (HEVC) VP8 VP9	H.264 (AVC) H.265 (HEVC)

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	0.6 Gbps	2.7 Gbps
Peak Upload Speed	0.15 Gbps	1.5 Gbps
Wi-Fi	4 (802.11n)	5 (802.11ac)
Bluetooth	5.1	5.0
Satellite navigation	BeiDou GPS GLONASS	BeiDou GPS Galileo GLONASS