HiSilicon Kirin 710A vs HiSilicon Kirin 970
The HiSilicon Kirin 710A and the HiSilicon Kirin 970 are both processors designed by HiSilicon, but they differ in terms of their specifications.
Starting with the HiSilicon Kirin 710A, this processor boasts a total of 8 cores, split between 4 Cortex-A73 cores clocked at 2.0 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. The processor is based on the ARMv8-A instruction set and is built using a 14 nm lithography process. It houses 5500 million transistors and has a thermal design power (TDP) of 5 Watts.
On the other hand, the HiSilicon Kirin 970 also features 8 cores, but with a slightly different configuration. It consists of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. Similar to the Kirin 710A, this processor utilizes the ARMv8-A instruction set. However, it is built using a more advanced 10 nm lithography process. It also contains 5500 million transistors but has a higher TDP of 9 Watts. Additionally, the Kirin 970 is equipped with the HiSilicon NPU (Neural Processing Unit), which enhances its capabilities in AI-related tasks.
In summary, the HiSilicon Kirin 710A and the HiSilicon Kirin 970 have comparable CPU configurations, with 8 cores in total. The Kirin 710A operates at slightly lower clock speeds but has a lower TDP compared to the Kirin 970. However, the Kirin 970 boasts a more advanced lithography process, enabling better power efficiency. Furthermore, the Kirin 970 comes equipped with the HiSilicon NPU, giving it an edge in AI-related tasks. Ultimately, the choice between these two processors depends on the desired balance of performance, power consumption, and AI capabilities.
Starting with the HiSilicon Kirin 710A, this processor boasts a total of 8 cores, split between 4 Cortex-A73 cores clocked at 2.0 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. The processor is based on the ARMv8-A instruction set and is built using a 14 nm lithography process. It houses 5500 million transistors and has a thermal design power (TDP) of 5 Watts.
On the other hand, the HiSilicon Kirin 970 also features 8 cores, but with a slightly different configuration. It consists of 4 Cortex-A73 cores clocked at 2.4 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. Similar to the Kirin 710A, this processor utilizes the ARMv8-A instruction set. However, it is built using a more advanced 10 nm lithography process. It also contains 5500 million transistors but has a higher TDP of 9 Watts. Additionally, the Kirin 970 is equipped with the HiSilicon NPU (Neural Processing Unit), which enhances its capabilities in AI-related tasks.
In summary, the HiSilicon Kirin 710A and the HiSilicon Kirin 970 have comparable CPU configurations, with 8 cores in total. The Kirin 710A operates at slightly lower clock speeds but has a lower TDP compared to the Kirin 970. However, the Kirin 970 boasts a more advanced lithography process, enabling better power efficiency. Furthermore, the Kirin 970 comes equipped with the HiSilicon NPU, giving it an edge in AI-related tasks. Ultimately, the choice between these two processors depends on the desired balance of performance, power consumption, and AI capabilities.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 14 nm | 10 nm |
Number of transistors | 5500 million | 5500 million |
TDP | 5 Watt | 9 Watt |
Neural Processing | HiSilicon NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4 |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G72 MP12 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 750 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 12 |
Shaders | 64 | 192 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2340x1080 |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.2 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2017 September |
Partnumber | Hi6260 | Hi3670 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 732G vs Qualcomm Snapdragon 8 Gen 1
2
Google Tensor G2 vs MediaTek Dimensity 920
3
MediaTek Helio P70 vs Qualcomm Snapdragon 720G
4
Qualcomm Snapdragon 7 Plus Gen 2 vs MediaTek Helio G90
5
Google Tensor G1 vs MediaTek Dimensity 930
6
Apple A13 Bionic vs Apple A10 Fusion
7
Samsung Exynos 7420 vs Qualcomm Snapdragon 6 Gen 1
8
Qualcomm Snapdragon 750G vs Qualcomm Snapdragon 632
9
Qualcomm Snapdragon 7 Gen 1 vs Qualcomm Snapdragon 670
10
Samsung Exynos 850 vs Qualcomm Snapdragon 662