HiSilicon Kirin 710A vs HiSilicon Kirin 820 5G
The HiSilicon Kirin 710A and Kirin 820 5G are two processors with different specifications. Let's compare them based on their specifications.
Starting with the HiSilicon Kirin 710A, it has a total of 8 CPU cores. Its architecture consists of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. The instruction set is ARMv8-A, and it operates on a 14 nm lithography. With 5500 million transistors, it consumes a relatively low TDP of 5 Watts.
Moving on to the HiSilicon Kirin 820 5G, it also features 8 CPU cores. The architecture includes 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. It supports the ARMv8.2-A instruction set and operates on a more advanced 7 nm lithography. With 6 Watts TDP, it is slightly higher than the Kirin 710A. Additionally, it boasts a neural processing unit called Ascend D110 Lite with HUAWEI Da Vinci Architecture, enhancing its AI capabilities.
Comparing the two processors, the Kirin 820 5G exhibits a more advanced architecture and lithography. Its Cortex-A76 cores offer higher clock speeds compared to the Kirin 710A's Cortex-A73 cores, potentially resulting in better performance. The instruction set of the Kirin 820 5G is also slightly more advanced. However, both processors have 8 CPU cores, providing a significant amount of processing power.
In terms of power consumption, the Kirin 710A consumes a lower TDP of 5 Watts compared to the Kirin 820 5G's 6 Watts. This could make the Kirin 710A a more energy-efficient option.
Additionally, the Kirin 820 5G stands out with its Ascend D110 Lite neural processing unit, which can enhance AI-related tasks and performance.
Overall, the HiSilicon Kirin 820 5G offers a more advanced architecture, higher clock speeds, and additional AI capabilities compared to the Kirin 710A. However, the Kirin 710A consumes less power, which might be essential for certain devices. The choice between these processors would depend on the specific requirements and priorities of the device or application they will be used in.
Starting with the HiSilicon Kirin 710A, it has a total of 8 CPU cores. Its architecture consists of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. The instruction set is ARMv8-A, and it operates on a 14 nm lithography. With 5500 million transistors, it consumes a relatively low TDP of 5 Watts.
Moving on to the HiSilicon Kirin 820 5G, it also features 8 CPU cores. The architecture includes 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. It supports the ARMv8.2-A instruction set and operates on a more advanced 7 nm lithography. With 6 Watts TDP, it is slightly higher than the Kirin 710A. Additionally, it boasts a neural processing unit called Ascend D110 Lite with HUAWEI Da Vinci Architecture, enhancing its AI capabilities.
Comparing the two processors, the Kirin 820 5G exhibits a more advanced architecture and lithography. Its Cortex-A76 cores offer higher clock speeds compared to the Kirin 710A's Cortex-A73 cores, potentially resulting in better performance. The instruction set of the Kirin 820 5G is also slightly more advanced. However, both processors have 8 CPU cores, providing a significant amount of processing power.
In terms of power consumption, the Kirin 710A consumes a lower TDP of 5 Watts compared to the Kirin 820 5G's 6 Watts. This could make the Kirin 710A a more energy-efficient option.
Additionally, the Kirin 820 5G stands out with its Ascend D110 Lite neural processing unit, which can enhance AI-related tasks and performance.
Overall, the HiSilicon Kirin 820 5G offers a more advanced architecture, higher clock speeds, and additional AI capabilities compared to the Kirin 710A. However, the Kirin 710A consumes less power, which might be essential for certain devices. The choice between these processors would depend on the specific requirements and priorities of the device or application they will be used in.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 14 nm | 7 nm |
| Number of transistors | 5500 million | |
| TDP | 5 Watt | 6 Watt |
| Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
| Max amount | up to 6 GB | up to 12 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 2133 MHz |
| Memory-bus | 2x32 bit | 4x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G57 MP6 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 1000 MHz | 850 MHz |
| Execution units | 4 | 6 |
| Shaders | 64 | 96 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | |
| Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP, 2x 20MP |
| Max Video Capture | 4K@30fps | 4K@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 1.6 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
| Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
| Bluetooth | 5.1 | 5.1 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
| Launch Date | 2020 Quarter 4 | 2020 March |
| Partnumber | Hi6260 | |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Mid-end |
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