HiSilicon Kirin 710A vs HiSilicon Kirin 810
The HiSilicon Kirin 710A and HiSilicon Kirin 810 are both processors from HiSilicon, a semiconductor company owned by Huawei Technologies. While both processors have their unique specifications, they are targeted at different market segments.
Starting with the HiSilicon Kirin 710A, it features an octa-core CPU architecture consisting of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. The CPU cores are based on the ARMv8-A instruction set and constructed using 14 nm lithography. This processor boasts 5500 million transistors and has a thermal design power (TDP) of 5 watts.
On the other hand, the HiSilicon Kirin 810 also has an octa-core CPU architecture. It comprises 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. The CPU cores are based on the ARMv8.2-A instruction set and are fabricated using a more advanced 7 nm lithography process. Additionally, this processor has a higher transistor count of 6900 million compared to the Kirin 710A. It also includes a Neural Processing Unit (NPU) called Ascend D100 Lite, which uses HUAWEI Da Vinci Architecture.
The key differentiating factors between these processors lie in their architecture, lithography process, and transistor count. The Kirin 810 outperforms the Kirin 710A in terms of CPU performance, as it utilizes the more advanced Cortex-A76 cores. Additionally, the 7 nm lithography process offers better power efficiency and potentially higher clock speeds compared to the 14 nm process used in the Kirin 710A.
However, it's worth noting that the Kirin 810 is a more recent processor and is likely to be found in more high-end or flagship smartphones, while the Kirin 710A is more likely to be present in mid-range or budget-friendly devices. Therefore, one should consider their specific needs and budget when choosing between these processors.
Starting with the HiSilicon Kirin 710A, it features an octa-core CPU architecture consisting of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. The CPU cores are based on the ARMv8-A instruction set and constructed using 14 nm lithography. This processor boasts 5500 million transistors and has a thermal design power (TDP) of 5 watts.
On the other hand, the HiSilicon Kirin 810 also has an octa-core CPU architecture. It comprises 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. The CPU cores are based on the ARMv8.2-A instruction set and are fabricated using a more advanced 7 nm lithography process. Additionally, this processor has a higher transistor count of 6900 million compared to the Kirin 710A. It also includes a Neural Processing Unit (NPU) called Ascend D100 Lite, which uses HUAWEI Da Vinci Architecture.
The key differentiating factors between these processors lie in their architecture, lithography process, and transistor count. The Kirin 810 outperforms the Kirin 710A in terms of CPU performance, as it utilizes the more advanced Cortex-A76 cores. Additionally, the 7 nm lithography process offers better power efficiency and potentially higher clock speeds compared to the 14 nm process used in the Kirin 710A.
However, it's worth noting that the Kirin 810 is a more recent processor and is likely to be found in more high-end or flagship smartphones, while the Kirin 710A is more likely to be present in mid-range or budget-friendly devices. Therefore, one should consider their specific needs and budget when choosing between these processors.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 14 nm | 7 nm |
Number of transistors | 5500 million | 6900 million |
TDP | 5 Watt | 5 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G52 MP6 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 820 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 6 |
Shaders | 64 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2019 Quarter 2 |
Partnumber | Hi6260 | Hi6280 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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