HiSilicon Kirin 710 vs Unisoc Tiger T700
The HiSilicon Kirin 710 and Unisoc Tiger T700 are two processors that offer different specifications and capabilities. Let's compare these processors based on their specifications.
Starting with the HiSilicon Kirin 710, it features an architecture with 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This octa-core setup ensures a balanced performance while handling various tasks. With its ARMv8-A instruction set, it supports the latest advancements and optimizations for software compatibility. The Kirin 710 is built on a 12 nm lithography, which ensures efficient power consumption. It has 5500 million transistors, showcasing a significant level of integration. Additionally, it operates at a TDP of 5 Watts, making it an energy-efficient choice.
On the other hand, the Unisoc Tiger T700 employs an architecture with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. This octa-core configuration features a different combination of core types, potentially leading to variations in task handling efficiency and power consumption. With its ARMv8.2-A instruction set, it also ensures software compatibility. Like the Kirin 710, it utilizes a 12 nm lithography, contributing to power efficiency. However, the Tiger T700 operates at a higher TDP of 10 Watts.
In summary, when comparing these processors, the HiSilicon Kirin 710 offers a more balanced configuration with a mix of high-performance and power-efficient cores. Its lower TDP of 5 Watts suggests better power optimization. On the other hand, the Unisoc Tiger T700 has a different core combination with a higher TDP of 10 Watts. Depending on the specific use case and requirements, each processor may be more suitable. It is essential to consider factors such as power efficiency, performance needs, and software compatibility to make an informed decision when choosing between these two processors.
Starting with the HiSilicon Kirin 710, it features an architecture with 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This octa-core setup ensures a balanced performance while handling various tasks. With its ARMv8-A instruction set, it supports the latest advancements and optimizations for software compatibility. The Kirin 710 is built on a 12 nm lithography, which ensures efficient power consumption. It has 5500 million transistors, showcasing a significant level of integration. Additionally, it operates at a TDP of 5 Watts, making it an energy-efficient choice.
On the other hand, the Unisoc Tiger T700 employs an architecture with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. This octa-core configuration features a different combination of core types, potentially leading to variations in task handling efficiency and power consumption. With its ARMv8.2-A instruction set, it also ensures software compatibility. Like the Kirin 710, it utilizes a 12 nm lithography, contributing to power efficiency. However, the Tiger T700 operates at a higher TDP of 10 Watts.
In summary, when comparing these processors, the HiSilicon Kirin 710 offers a more balanced configuration with a mix of high-performance and power-efficient cores. Its lower TDP of 5 Watts suggests better power optimization. On the other hand, the Unisoc Tiger T700 has a different core combination with a higher TDP of 10 Watts. Depending on the specific use case and requirements, each processor may be more suitable. It is essential to consider factors such as power efficiency, performance needs, and software compatibility to make an informed decision when choosing between these two processors.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G52 MP2 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 850 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2400x1080 |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 48MP |
Max Video Capture | FullHD@60fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2021 March |
Partnumber | Hi6260 | T700 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 1080 vs Qualcomm Snapdragon 680
2
HiSilicon Kirin 955 vs MediaTek Helio G95
3
HiSilicon Kirin 985 5G vs Unisoc SC9863A
4
Qualcomm Snapdragon 695 vs Samsung Exynos 990
5
Samsung Exynos 1330 vs MediaTek Dimensity 1300
6
HiSilicon Kirin 990 5G vs MediaTek Helio G90T
7
Qualcomm Snapdragon 730G vs HiSilicon Kirin 710
8
Apple A12 Bionic vs MediaTek Helio G35
9
Unisoc SC9832E vs Apple A10 Fusion
10
Qualcomm Snapdragon 662 vs MediaTek Helio G36