HiSilicon Kirin 710 vs Unisoc Tiger T612
The HiSilicon Kirin 710 and the Unisoc Tiger T612 are two processors that have distinct specifications. Let's compare them and see how they differ from each other.
Starting with the HiSilicon Kirin 710, it features a CPU architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This means it has a total of 8 cores, providing a balance between power and efficiency. The instruction set used is the ARMv8-A, which ensures compatibility with modern applications and software. With a lithography of 12 nm, it offers a relatively smaller form factor, leading to more energy efficiency. The processor consists of around 5500 million transistors, indicating a good level of complexity. The thermal design power (TDP) of the processor is 5 Watt, further highlighting its efficiency.
On the other hand, the Unisoc Tiger T612 has a slightly different CPU architecture. It contains 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores, resulting in a similar total of 8 cores like the Kirin 710. However, the use of Cortex-A75 cores suggests a focus on performance, as these cores are known for their higher processing power. Just like the Kirin 710, the Tiger T612 also adopts the ARMv8.2-A instruction set, providing compatibility with modern applications. With a lithography of 12 nm, it shares the same energy efficiency advantage as the Kirin 710. However, it has a slightly higher TDP of 10 Watt, indicating a potentially higher power consumption.
In summary, the HiSilicon Kirin 710 and the Unisoc Tiger T612 have some key differences in their specifications. The Kirin 710 utilizes a combination of Cortex-A73 and Cortex-A53 cores, with a TDP of 5 Watt, while the Tiger T612 relies on Cortex-A75 and Cortex-A55 cores, with a slightly higher TDP of 10 Watt. These differences suggest that the Kirin 710 may lean towards a more balanced and energy-efficient performance, while the Tiger T612 may emphasize greater processing power. The choice between these processors would depend on the specific needs and priorities of the user or the device they are going to be used in.
Starting with the HiSilicon Kirin 710, it features a CPU architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This means it has a total of 8 cores, providing a balance between power and efficiency. The instruction set used is the ARMv8-A, which ensures compatibility with modern applications and software. With a lithography of 12 nm, it offers a relatively smaller form factor, leading to more energy efficiency. The processor consists of around 5500 million transistors, indicating a good level of complexity. The thermal design power (TDP) of the processor is 5 Watt, further highlighting its efficiency.
On the other hand, the Unisoc Tiger T612 has a slightly different CPU architecture. It contains 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores, resulting in a similar total of 8 cores like the Kirin 710. However, the use of Cortex-A75 cores suggests a focus on performance, as these cores are known for their higher processing power. Just like the Kirin 710, the Tiger T612 also adopts the ARMv8.2-A instruction set, providing compatibility with modern applications. With a lithography of 12 nm, it shares the same energy efficiency advantage as the Kirin 710. However, it has a slightly higher TDP of 10 Watt, indicating a potentially higher power consumption.
In summary, the HiSilicon Kirin 710 and the Unisoc Tiger T612 have some key differences in their specifications. The Kirin 710 utilizes a combination of Cortex-A73 and Cortex-A53 cores, with a TDP of 5 Watt, while the Tiger T612 relies on Cortex-A75 and Cortex-A55 cores, with a slightly higher TDP of 10 Watt. These differences suggest that the Kirin 710 may lean towards a more balanced and energy-efficient performance, while the Tiger T612 may emphasize greater processing power. The choice between these processors would depend on the specific needs and priorities of the user or the device they are going to be used in.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1600 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP1 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 650 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 1 |
Shaders | 64 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2400x1080 |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 50MP |
Max Video Capture | FullHD@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2022 January |
Partnumber | Hi6260 | T612 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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