HiSilicon Kirin 710 vs Unisoc Tanggula T770 5G

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The HiSilicon Kirin 710 and the Unisoc Tanggula T770 5G are both processors commonly used in smartphones. Let's compare their specifications to see how they stack up against each other.

Starting with the HiSilicon Kirin 710, it features a total of 8 cores, divided into 4 Cortex-A73 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. The processor's architecture is ARMv8-A, and it is fabricated using a 12 nm lithography process. With a total of 5500 million transistors, the Kirin 710 has a relatively low TDP of 5 Watts.

On the other hand, the Unisoc Tanggula T770 5G also boasts 8 cores, consisting of 1 Cortex-A76 core clocked at 2.5 GHz, 3 Cortex-A76 cores clocked at 2.2 GHz, and 4 Cortex-A55 cores clocked at 2.0 GHz. Similar to the Kirin 710, the T770 5G utilizes ARMv8.2-A architecture. However, it stands out with its more advanced 6 nm lithography process. Just like its counterpart, the T770 5G has a TDP of 5 Watts but comes with the added benefit of a Neural Processing Unit (NPU).

In terms of raw power, the Tanggula T770 5G seems to have the edge. Its faster clock speeds on the Cortex-A76 cores may result in improved performance compared to the Kirin 710. Moreover, the addition of the NPU could enhance machine learning capabilities and AI performance on devices using this processor.

However, it's essential to consider that specifications alone do not tell the whole story. Real-world performance depends on several factors such as optimizations, software, thermal management, and overall system integration. So, it is recommended to thoroughly evaluate devices using these processors through reviews and benchmarks to get a better understanding of their actual performance.

In conclusion, the HiSilicon Kirin 710 and the Unisoc Tanggula T770 5G are both capable processors, but the T770 5G offers slightly more advanced features and potentially higher performance with its faster clock speeds and inclusion of the NPU. However, it's crucial to consider a comprehensive analysis of each processor's performance before making any final judgments.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
1x 2.5 GHz – Cortex-A76
3x 2.2 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 6 nm
Number of transistors 5500 million
TDP 5 Watt 5 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 32 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G51 MP4 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 850 MHz
GPU boost frequency 1000 MHz
Execution units 4 6
Shaders 64 96
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2160x1080@120Hz
Max camera resolution 1x 40MP, 2x 24MP 1x 108MP, 2x 24MP
Max Video Capture FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.7 Gbps
Peak Upload Speed 0.15 Gbps 1.5 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.0
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2018 Quarter 3 2021 February
Partnumber Hi6260 T770, Tiger T7520
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710
195573
Tanggula T770 5G
342190

GeekBench 6 Single-Core

Score
Kirin 710
329
Tanggula T770 5G
659

GeekBench 6 Multi-Core

Score
Kirin 710
1341
Tanggula T770 5G
2635