HiSilicon Kirin 710 vs Unisoc Tanggula T770 5G
The HiSilicon Kirin 710 and the Unisoc Tanggula T770 5G are both processors commonly used in smartphones. Let's compare their specifications to see how they stack up against each other.
Starting with the HiSilicon Kirin 710, it features a total of 8 cores, divided into 4 Cortex-A73 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. The processor's architecture is ARMv8-A, and it is fabricated using a 12 nm lithography process. With a total of 5500 million transistors, the Kirin 710 has a relatively low TDP of 5 Watts.
On the other hand, the Unisoc Tanggula T770 5G also boasts 8 cores, consisting of 1 Cortex-A76 core clocked at 2.5 GHz, 3 Cortex-A76 cores clocked at 2.2 GHz, and 4 Cortex-A55 cores clocked at 2.0 GHz. Similar to the Kirin 710, the T770 5G utilizes ARMv8.2-A architecture. However, it stands out with its more advanced 6 nm lithography process. Just like its counterpart, the T770 5G has a TDP of 5 Watts but comes with the added benefit of a Neural Processing Unit (NPU).
In terms of raw power, the Tanggula T770 5G seems to have the edge. Its faster clock speeds on the Cortex-A76 cores may result in improved performance compared to the Kirin 710. Moreover, the addition of the NPU could enhance machine learning capabilities and AI performance on devices using this processor.
However, it's essential to consider that specifications alone do not tell the whole story. Real-world performance depends on several factors such as optimizations, software, thermal management, and overall system integration. So, it is recommended to thoroughly evaluate devices using these processors through reviews and benchmarks to get a better understanding of their actual performance.
In conclusion, the HiSilicon Kirin 710 and the Unisoc Tanggula T770 5G are both capable processors, but the T770 5G offers slightly more advanced features and potentially higher performance with its faster clock speeds and inclusion of the NPU. However, it's crucial to consider a comprehensive analysis of each processor's performance before making any final judgments.
Starting with the HiSilicon Kirin 710, it features a total of 8 cores, divided into 4 Cortex-A73 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. The processor's architecture is ARMv8-A, and it is fabricated using a 12 nm lithography process. With a total of 5500 million transistors, the Kirin 710 has a relatively low TDP of 5 Watts.
On the other hand, the Unisoc Tanggula T770 5G also boasts 8 cores, consisting of 1 Cortex-A76 core clocked at 2.5 GHz, 3 Cortex-A76 cores clocked at 2.2 GHz, and 4 Cortex-A55 cores clocked at 2.0 GHz. Similar to the Kirin 710, the T770 5G utilizes ARMv8.2-A architecture. However, it stands out with its more advanced 6 nm lithography process. Just like its counterpart, the T770 5G has a TDP of 5 Watts but comes with the added benefit of a Neural Processing Unit (NPU).
In terms of raw power, the Tanggula T770 5G seems to have the edge. Its faster clock speeds on the Cortex-A76 cores may result in improved performance compared to the Kirin 710. Moreover, the addition of the NPU could enhance machine learning capabilities and AI performance on devices using this processor.
However, it's essential to consider that specifications alone do not tell the whole story. Real-world performance depends on several factors such as optimizations, software, thermal management, and overall system integration. So, it is recommended to thoroughly evaluate devices using these processors through reviews and benchmarks to get a better understanding of their actual performance.
In conclusion, the HiSilicon Kirin 710 and the Unisoc Tanggula T770 5G are both capable processors, but the T770 5G offers slightly more advanced features and potentially higher performance with its faster clock speeds and inclusion of the NPU. However, it's crucial to consider a comprehensive analysis of each processor's performance before making any final judgments.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 12 nm | 6 nm |
| Number of transistors | 5500 million | |
| TDP | 5 Watt | 5 Watt |
| Neural Processing | NPU |
Memory (RAM)
| Max amount | up to 6 GB | up to 32 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 2133 MHz |
| Memory-bus | 2x32 bit | 4x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G57 MP6 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 1000 MHz | 850 MHz |
| Execution units | 4 | 6 |
| Shaders | 64 | 96 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 2160x1080@120Hz |
| Max camera resolution | 1x 40MP, 2x 24MP | 1x 108MP, 2x 24MP |
| Max Video Capture | FullHD@30fps | |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 2.7 Gbps |
| Peak Upload Speed | 0.15 Gbps | 1.5 Gbps |
| Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
| Bluetooth | 4.2 | 5.0 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2018 Quarter 3 | 2021 February |
| Partnumber | Hi6260 | T770, Tiger T7520 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Mid-end |
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