HiSilicon Kirin 710 vs Unisoc SC7731E
The HiSilicon Kirin 710 and Unisoc SC7731E are two processors with different specifications. Let's compare them based on their CPU cores and architecture, number of cores, instruction set, lithography, and TDP.
Starting with the HiSilicon Kirin 710, it features a powerful architecture with 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, this processor offers great multitasking capabilities. It uses the ARMv8-A instruction set, providing compatibility with modern software and applications. With a 12 nm lithography, the Kirin 710 is quite advanced in terms of manufacturing technology. It contains 5500 million transistors, enabling efficient processing. Moreover, it has a low thermal design power (TDP) of 5 Watts, indicating lower power consumption.
On the other hand, the Unisoc SC7731E has a different architecture, featuring 4x 1.3 GHz Cortex-A7 cores. With only 4 cores, it may not provide the same level of multitasking performance as the Kirin 710. The SC7731E uses the ARMv7-A instruction set, which is slightly older than the ARMv8-A used in the Kirin 710. The lithography of the SC7731E is 28 nm, which is less advanced compared to the Kirin 710. It has a TDP of 7 Watts, indicating higher power consumption compared to the Kirin 710.
In summary, the HiSilicon Kirin 710 outperforms the Unisoc SC7731E in terms of CPU cores, architecture, instruction set, lithography, and TDP. The Kirin 710's use of Cortex-A73 and Cortex-A53 cores, ARMv8-A instruction set, 12 nm lithography, and low TDP make it a more powerful and energy-efficient processor. However, it's important to consider other factors such as GPU performance, memory support, and overall system optimization when choosing a processor for specific use cases.
Starting with the HiSilicon Kirin 710, it features a powerful architecture with 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, this processor offers great multitasking capabilities. It uses the ARMv8-A instruction set, providing compatibility with modern software and applications. With a 12 nm lithography, the Kirin 710 is quite advanced in terms of manufacturing technology. It contains 5500 million transistors, enabling efficient processing. Moreover, it has a low thermal design power (TDP) of 5 Watts, indicating lower power consumption.
On the other hand, the Unisoc SC7731E has a different architecture, featuring 4x 1.3 GHz Cortex-A7 cores. With only 4 cores, it may not provide the same level of multitasking performance as the Kirin 710. The SC7731E uses the ARMv7-A instruction set, which is slightly older than the ARMv8-A used in the Kirin 710. The lithography of the SC7731E is 28 nm, which is less advanced compared to the Kirin 710. It has a TDP of 7 Watts, indicating higher power consumption compared to the Kirin 710.
In summary, the HiSilicon Kirin 710 outperforms the Unisoc SC7731E in terms of CPU cores, architecture, instruction set, lithography, and TDP. The Kirin 710's use of Cortex-A73 and Cortex-A53 cores, ARMv8-A instruction set, 12 nm lithography, and low TDP make it a more powerful and energy-efficient processor. However, it's important to consider other factors such as GPU performance, memory support, and overall system optimization when choosing a processor for specific use cases.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 1.3 GHz – Cortex-A7 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv7-A |
Lithography | 12 nm | 28 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 7 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 1 GB |
Memory type | LPDDR4 | LPDDR3 |
Memory frequency | 1866 MHz | 533 MHz |
Memory-bus | 2x32 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-T820 MP1 |
GPU Architecture | Bifrost | Midgard |
GPU frequency | 650 MHz | 600 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 1 |
Shaders | 64 | 4 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 1.2 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 1440x720 |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 8MP |
Max Video Capture | HD@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | |
Peak Upload Speed | 0.15 Gbps | |
Wi-Fi | 4 (802.11n) | 4 (802.11n) |
Bluetooth | 4.2 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2018 Quarter 2 |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 768G vs Samsung Exynos 980
2
Google Tensor G3 vs Apple A15 Bionic
3
MediaTek Dimensity 1100 vs Qualcomm Snapdragon 712
4
HiSilicon Kirin 9000 5G vs Google Tensor G1
5
Apple A10 Fusion vs Qualcomm Snapdragon 685
6
Qualcomm Snapdragon 8 Gen 2 vs Unisoc Tanggula T770 5G
7
MediaTek Helio G37 vs Qualcomm Snapdragon 632
8
MediaTek Dimensity 9200 vs Qualcomm Snapdragon 888
9
Samsung Exynos 2200 vs Qualcomm Snapdragon 670
10
MediaTek Helio P90 vs Unisoc Tiger T310