HiSilicon Kirin 710 vs MediaTek Dimensity 930
The HiSilicon Kirin 710 and MediaTek Dimensity 930 are two processors that have their own unique specifications and features. Let's compare them based on their specifications.
Starting with the HiSilicon Kirin 710, it features an architecture with 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores, giving it a total of 8 cores. It operates on the ARMv8-A instruction set and has a lithography of 12 nm. With a TDP of 5 Watt, the Kirin 710 is designed to consume less power during operation. It also includes a total of 5500 million transistors.
On the other hand, the MediaTek Dimensity 930 has its own set of features. Its architecture consists of 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores, totaling to 8 cores like the Kirin 710. However, it operates on the ARMv8.2-A instruction set, which indicates more advanced features and capabilities. The Dimensity 930 also has a smaller lithography of 6 nm, suggesting better power efficiency compared to the Kirin 710. It has a slightly higher TDP of 10 Watt and also boasts a Neural Processing Unit (NPU), which can enhance AI and machine learning capabilities.
Overall, both processors have their strengths and weaknesses. The HiSilicon Kirin 710 focuses on power efficiency with its lower TDP and utilizes a balanced combination of Cortex-A73 and Cortex-A53 cores. On the other hand, the MediaTek Dimensity 930 offers a more advanced instruction set, a smaller lithography, and the inclusion of an NPU for improved AI performance. Depending on the specific use case and requirements, users can choose the processor that suits their needs best.
Starting with the HiSilicon Kirin 710, it features an architecture with 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores, giving it a total of 8 cores. It operates on the ARMv8-A instruction set and has a lithography of 12 nm. With a TDP of 5 Watt, the Kirin 710 is designed to consume less power during operation. It also includes a total of 5500 million transistors.
On the other hand, the MediaTek Dimensity 930 has its own set of features. Its architecture consists of 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores, totaling to 8 cores like the Kirin 710. However, it operates on the ARMv8.2-A instruction set, which indicates more advanced features and capabilities. The Dimensity 930 also has a smaller lithography of 6 nm, suggesting better power efficiency compared to the Kirin 710. It has a slightly higher TDP of 10 Watt and also boasts a Neural Processing Unit (NPU), which can enhance AI and machine learning capabilities.
Overall, both processors have their strengths and weaknesses. The HiSilicon Kirin 710 focuses on power efficiency with its lower TDP and utilizes a balanced combination of Cortex-A73 and Cortex-A53 cores. On the other hand, the MediaTek Dimensity 930 offers a more advanced instruction set, a smaller lithography, and the inclusion of an NPU for improved AI performance. Depending on the specific use case and requirements, users can choose the processor that suits their needs best.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 6 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G51 MP4 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 650 MHz | 800 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | |
Shaders | 64 | |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 108MP, 1x 64MP |
Max Video Capture | 2K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2022 Quarter 3 |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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