HiSilicon Kirin 710 vs MediaTek Dimensity 900

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The HiSilicon Kirin 710 and MediaTek Dimensity 900 are two processors that offer different specifications and features. Let's compare them based on their specifications.

Starting with the CPU cores and architecture, the Kirin 710 is equipped with a combination of 4x Cortex-A73 cores clocked at 2.2 GHz and 4x Cortex-A53 cores clocked at 1.7 GHz. On the other hand, the Dimensity 900 consists of 2x Cortex-A78 cores clocked at 2.4 GHz and 6x Cortex-A55 cores clocked at 2.0 GHz.

Both processors have 8 cores, but the Dimensity 900 offers a faster clock speed for its high-performance cores, which can potentially provide better overall processing power.

Moving on to the instruction set, the Kirin 710 supports ARMv8-A, which is a widely used instruction set architecture. The Dimensity 900 supports ARMv8.2-A, bringing some additional features and improvements to the table.

In terms of lithography, the Kirin 710 is built on a 12 nm process, while the Dimensity 900 utilizes a more advanced 6 nm process. A smaller lithography typically translates to better power efficiency and potentially improved performance.

When it comes to the number of transistors, the Dimensity 900 takes the lead with 10000 million transistors, compared to the 5500 million transistors found in the Kirin 710. This higher transistor count can indicate a more complex and capable processor design.

Regarding their thermal design power (TDP), the Kirin 710 has a lower TDP of 5 Watts, while the Dimensity 900 has a higher TDP of 10 Watts. This means that the Kirin 710 may offer better power efficiency, leading to longer battery life in devices that use it.

Additionally, the Dimensity 900 boasts a Neural Processing Unit (NPU), which can greatly enhance AI-related tasks and improve overall performance in certain applications.

In summary, the MediaTek Dimensity 900 outshines the HiSilicon Kirin 710 in several aspects, including its more advanced lithography, higher transistor count, and the inclusion of an NPU. However, the Kirin 710 still holds its own with its lower TDP and support for the widely-used ARMv8-A instruction set. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the device being designed.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 6 nm
Number of transistors 5500 million 10000 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1866 MHz 3200 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G51 MP4 Mali-G68 MP4
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 900 MHz
GPU boost frequency 1000 MHz
Execution units 4 4
Shaders 64 64
DirectX 12 12
OpenCL API 2.0 2.0
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 40MP, 2x 24MP 1x 108MP, 2x 20MP
Max Video Capture 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2018 Quarter 3 2021 Quarter 1
Partnumber Hi6260 MT6877
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710
195573
Dimensity 900
435318

GeekBench 6 Single-Core

Score
Kirin 710
329
Dimensity 900
704

GeekBench 6 Multi-Core

Score
Kirin 710
1341
Dimensity 900
2139