HiSilicon Kirin 710 vs MediaTek Dimensity 900
The HiSilicon Kirin 710 and MediaTek Dimensity 900 are two processors that offer different specifications and features. Let's compare them based on their specifications.
Starting with the CPU cores and architecture, the Kirin 710 is equipped with a combination of 4x Cortex-A73 cores clocked at 2.2 GHz and 4x Cortex-A53 cores clocked at 1.7 GHz. On the other hand, the Dimensity 900 consists of 2x Cortex-A78 cores clocked at 2.4 GHz and 6x Cortex-A55 cores clocked at 2.0 GHz.
Both processors have 8 cores, but the Dimensity 900 offers a faster clock speed for its high-performance cores, which can potentially provide better overall processing power.
Moving on to the instruction set, the Kirin 710 supports ARMv8-A, which is a widely used instruction set architecture. The Dimensity 900 supports ARMv8.2-A, bringing some additional features and improvements to the table.
In terms of lithography, the Kirin 710 is built on a 12 nm process, while the Dimensity 900 utilizes a more advanced 6 nm process. A smaller lithography typically translates to better power efficiency and potentially improved performance.
When it comes to the number of transistors, the Dimensity 900 takes the lead with 10000 million transistors, compared to the 5500 million transistors found in the Kirin 710. This higher transistor count can indicate a more complex and capable processor design.
Regarding their thermal design power (TDP), the Kirin 710 has a lower TDP of 5 Watts, while the Dimensity 900 has a higher TDP of 10 Watts. This means that the Kirin 710 may offer better power efficiency, leading to longer battery life in devices that use it.
Additionally, the Dimensity 900 boasts a Neural Processing Unit (NPU), which can greatly enhance AI-related tasks and improve overall performance in certain applications.
In summary, the MediaTek Dimensity 900 outshines the HiSilicon Kirin 710 in several aspects, including its more advanced lithography, higher transistor count, and the inclusion of an NPU. However, the Kirin 710 still holds its own with its lower TDP and support for the widely-used ARMv8-A instruction set. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the device being designed.
Starting with the CPU cores and architecture, the Kirin 710 is equipped with a combination of 4x Cortex-A73 cores clocked at 2.2 GHz and 4x Cortex-A53 cores clocked at 1.7 GHz. On the other hand, the Dimensity 900 consists of 2x Cortex-A78 cores clocked at 2.4 GHz and 6x Cortex-A55 cores clocked at 2.0 GHz.
Both processors have 8 cores, but the Dimensity 900 offers a faster clock speed for its high-performance cores, which can potentially provide better overall processing power.
Moving on to the instruction set, the Kirin 710 supports ARMv8-A, which is a widely used instruction set architecture. The Dimensity 900 supports ARMv8.2-A, bringing some additional features and improvements to the table.
In terms of lithography, the Kirin 710 is built on a 12 nm process, while the Dimensity 900 utilizes a more advanced 6 nm process. A smaller lithography typically translates to better power efficiency and potentially improved performance.
When it comes to the number of transistors, the Dimensity 900 takes the lead with 10000 million transistors, compared to the 5500 million transistors found in the Kirin 710. This higher transistor count can indicate a more complex and capable processor design.
Regarding their thermal design power (TDP), the Kirin 710 has a lower TDP of 5 Watts, while the Dimensity 900 has a higher TDP of 10 Watts. This means that the Kirin 710 may offer better power efficiency, leading to longer battery life in devices that use it.
Additionally, the Dimensity 900 boasts a Neural Processing Unit (NPU), which can greatly enhance AI-related tasks and improve overall performance in certain applications.
In summary, the MediaTek Dimensity 900 outshines the HiSilicon Kirin 710 in several aspects, including its more advanced lithography, higher transistor count, and the inclusion of an NPU. However, the Kirin 710 still holds its own with its lower TDP and support for the widely-used ARMv8-A instruction set. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the device being designed.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 6 nm |
Number of transistors | 5500 million | 10000 million |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G68 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 900 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2021 Quarter 1 |
Partnumber | Hi6260 | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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