HiSilicon Kirin 710 vs MediaTek Dimensity 810

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The HiSilicon Kirin 710 and MediaTek Dimensity 810 are both processors used in mobile devices. While they have similarities, there are key differences in their specifications.

In terms of CPU cores and architecture, the Kirin 710 features 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This combination provides a balance between high performance and power efficiency. On the other hand, the Dimensity 810 boasts 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. This configuration prioritizes performance, particularly with the powerful A76 cores.

Both processors have 8 cores, indicating their ability to handle multiple tasks simultaneously. They also share the ARMv8-A instruction set, ensuring compatibility with modern software.

However, there are notable differences in other specifications. The Kirin 710 is built on a 12 nm lithography, meaning that its transistors are more densely packed. It contains 5500 million transistors, facilitating efficient data processing. The Dimensity 810, on the other hand, employs a 6 nm lithography, making it more advanced and efficient than the Kirin 710. It houses 12000 million transistors, indicating its ability to handle more complex operations.

The power consumption of these processors also differs. The Kirin 710 has a TDP (Thermal Design Power) of 5 Watt, suggesting it operates within a lower power range. In comparison, the Dimensity 810 has a TDP of 8 Watt, indicating that it consumes more power.

A unique feature of the Dimensity 810 is its Neural Processing Unit (NPU). This component enhances tasks related to artificial intelligence and machine learning, giving it an advantage in those areas compared to the Kirin 710.

In summary, the Dimensity 810 outperforms the Kirin 710 in certain areas. Its more advanced lithography, higher transistor count, and specialized NPU make it better suited for demanding tasks. However, the Kirin 710 strikes a balance between performance and power efficiency. Ultimately, the choice between these processors depends on the specific requirements and preferences of the user.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 6 nm
Number of transistors 5500 million 12000 million
TDP 5 Watt 8 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G51 MP4 Mali-G57 MP2
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 950 MHz
GPU boost frequency 1000 MHz
Execution units 4 2
Shaders 64 32
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 40MP, 2x 24MP 1x 64MP, 2x 16MP
Max Video Capture 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2018 Quarter 3 2021 Quarter 3
Partnumber Hi6260 MT6833V/PNZA, MT6833P
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710
195573
Dimensity 810
356915

GeekBench 6 Single-Core

Score
Kirin 710
329
Dimensity 810
584

GeekBench 6 Multi-Core

Score
Kirin 710
1341
Dimensity 810
1662