HiSilicon Kirin 710 vs MediaTek Dimensity 810
The HiSilicon Kirin 710 and MediaTek Dimensity 810 are both processors used in mobile devices. While they have similarities, there are key differences in their specifications.
In terms of CPU cores and architecture, the Kirin 710 features 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This combination provides a balance between high performance and power efficiency. On the other hand, the Dimensity 810 boasts 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. This configuration prioritizes performance, particularly with the powerful A76 cores.
Both processors have 8 cores, indicating their ability to handle multiple tasks simultaneously. They also share the ARMv8-A instruction set, ensuring compatibility with modern software.
However, there are notable differences in other specifications. The Kirin 710 is built on a 12 nm lithography, meaning that its transistors are more densely packed. It contains 5500 million transistors, facilitating efficient data processing. The Dimensity 810, on the other hand, employs a 6 nm lithography, making it more advanced and efficient than the Kirin 710. It houses 12000 million transistors, indicating its ability to handle more complex operations.
The power consumption of these processors also differs. The Kirin 710 has a TDP (Thermal Design Power) of 5 Watt, suggesting it operates within a lower power range. In comparison, the Dimensity 810 has a TDP of 8 Watt, indicating that it consumes more power.
A unique feature of the Dimensity 810 is its Neural Processing Unit (NPU). This component enhances tasks related to artificial intelligence and machine learning, giving it an advantage in those areas compared to the Kirin 710.
In summary, the Dimensity 810 outperforms the Kirin 710 in certain areas. Its more advanced lithography, higher transistor count, and specialized NPU make it better suited for demanding tasks. However, the Kirin 710 strikes a balance between performance and power efficiency. Ultimately, the choice between these processors depends on the specific requirements and preferences of the user.
In terms of CPU cores and architecture, the Kirin 710 features 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This combination provides a balance between high performance and power efficiency. On the other hand, the Dimensity 810 boasts 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. This configuration prioritizes performance, particularly with the powerful A76 cores.
Both processors have 8 cores, indicating their ability to handle multiple tasks simultaneously. They also share the ARMv8-A instruction set, ensuring compatibility with modern software.
However, there are notable differences in other specifications. The Kirin 710 is built on a 12 nm lithography, meaning that its transistors are more densely packed. It contains 5500 million transistors, facilitating efficient data processing. The Dimensity 810, on the other hand, employs a 6 nm lithography, making it more advanced and efficient than the Kirin 710. It houses 12000 million transistors, indicating its ability to handle more complex operations.
The power consumption of these processors also differs. The Kirin 710 has a TDP (Thermal Design Power) of 5 Watt, suggesting it operates within a lower power range. In comparison, the Dimensity 810 has a TDP of 8 Watt, indicating that it consumes more power.
A unique feature of the Dimensity 810 is its Neural Processing Unit (NPU). This component enhances tasks related to artificial intelligence and machine learning, giving it an advantage in those areas compared to the Kirin 710.
In summary, the Dimensity 810 outperforms the Kirin 710 in certain areas. Its more advanced lithography, higher transistor count, and specialized NPU make it better suited for demanding tasks. However, the Kirin 710 strikes a balance between performance and power efficiency. Ultimately, the choice between these processors depends on the specific requirements and preferences of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 6 nm |
Number of transistors | 5500 million | 12000 million |
TDP | 5 Watt | 8 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP2 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 1000 MHz | 950 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 64MP, 2x 16MP |
Max Video Capture | 2K@30FPS | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2021 Quarter 3 |
Partnumber | Hi6260 | MT6833V/PNZA, MT6833P |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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