HiSilicon Kirin 710 vs MediaTek Dimensity 800U
The HiSilicon Kirin 710 and MediaTek Dimensity 800U are two processors that are commonly found in mid-range smartphones. While both processors have their strengths and weaknesses, understanding their specifications can help in determining which one might be a better fit for a particular device.
Let's begin with the HiSilicon Kirin 710. This processor features a combination of Cortex-A73 and Cortex-A53 cores, with four of each. The Cortex-A73 cores operate at a clock speed of 2.2 GHz, while the Cortex-A53 cores operate at 1.7 GHz. This ensures a balance between performance and power efficiency. The Kirin 710 is built using a 12 nm fabrication process and has a total of 5500 million transistors. With a TDP of 5 Watts, it offers decent power management capabilities.
Moving on to the MediaTek Dimensity 800U, this processor offers a different architecture than the Kirin 710. It consists of two Cortex-A76 cores clocked at 2.4 GHz for high-performance tasks, and six Cortex-A55 cores clocked at 2.0 GHz for power efficiency. This combination allows for smooth multitasking and improved performance. Additionally, the Dimensity 800U is manufactured using a more advanced 7 nm lithography process, which usually results in improved power efficiency. Another notable feature of the Dimensity 800U is its Neural Processing Unit (NPU), which enhances AI capabilities.
In terms of raw specifications, the MediaTek Dimensity 800U appears to have the upper hand. With its higher clock speeds, more advanced fabrication process, and the inclusion of an NPU, it offers better performance and power efficiency compared to the HiSilicon Kirin 710. However, it's important to note that real-world performance is not solely determined by specifications. Factors such as software optimization, thermal management, and other hardware components also play a crucial role.
In conclusion, both the HiSilicon Kirin 710 and MediaTek Dimensity 800U have their own advantages, but the Dimensity 800U stands out with its more powerful architecture, advanced manufacturing process, and Neural Processing Unit. However, it's necessary to consider other aspects of a device's hardware and software ecosystem before making a final decision.
Let's begin with the HiSilicon Kirin 710. This processor features a combination of Cortex-A73 and Cortex-A53 cores, with four of each. The Cortex-A73 cores operate at a clock speed of 2.2 GHz, while the Cortex-A53 cores operate at 1.7 GHz. This ensures a balance between performance and power efficiency. The Kirin 710 is built using a 12 nm fabrication process and has a total of 5500 million transistors. With a TDP of 5 Watts, it offers decent power management capabilities.
Moving on to the MediaTek Dimensity 800U, this processor offers a different architecture than the Kirin 710. It consists of two Cortex-A76 cores clocked at 2.4 GHz for high-performance tasks, and six Cortex-A55 cores clocked at 2.0 GHz for power efficiency. This combination allows for smooth multitasking and improved performance. Additionally, the Dimensity 800U is manufactured using a more advanced 7 nm lithography process, which usually results in improved power efficiency. Another notable feature of the Dimensity 800U is its Neural Processing Unit (NPU), which enhances AI capabilities.
In terms of raw specifications, the MediaTek Dimensity 800U appears to have the upper hand. With its higher clock speeds, more advanced fabrication process, and the inclusion of an NPU, it offers better performance and power efficiency compared to the HiSilicon Kirin 710. However, it's important to note that real-world performance is not solely determined by specifications. Factors such as software optimization, thermal management, and other hardware components also play a crucial role.
In conclusion, both the HiSilicon Kirin 710 and MediaTek Dimensity 800U have their own advantages, but the Dimensity 800U stands out with its more powerful architecture, advanced manufacturing process, and Neural Processing Unit. However, it's necessary to consider other aspects of a device's hardware and software ecosystem before making a final decision.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP3 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 850 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 3 |
Shaders | 64 | 48 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30FPS | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2020 Quarter 3 |
Partnumber | Hi6260 | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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