HiSilicon Kirin 710 vs MediaTek Dimensity 800
The HiSilicon Kirin 710 and MediaTek Dimensity 800 are two processors with their own unique specifications.
Starting with the HiSilicon Kirin 710, it features a total of 8 CPU cores, divided into 4 Cortex-A73 cores running at 2.2 GHz and 4 Cortex-A53 cores running at 1.7 GHz. The architecture used is ARMv8-A, and the lithography is set at 12 nm. With 5500 million transistors, this processor has an efficiency of 5 watts.
On the other hand, the MediaTek Dimensity 800 offers a different set of specifications. It has a total of 4 CPU cores, 4x Cortex-A76 cores running at 2.0 GHz and 4x Cortex-A55 cores running at 2.0 GHz as well. The architecture used is ARMv8.2-A. Unlike the Kirin 710, the Dimensity 800 has a smaller lithography of 7 nm. It has a higher TDP of 10 watts, indicating a higher power consumption. Additionally, the Dimensity 800 also has a Neural Processing Unit (NPU) which the Kirin 710 lacks.
In terms of their specifications, the HiSilicon Kirin 710 has more CPU cores (8 compared to 4) and a lower TDP (5 watts compared to 10 watts). However, the MediaTek Dimensity 800 has a smaller lithography (7 nm compared to 12 nm) and includes a Neural Processing Unit for enhanced AI capabilities. These differences highlight the varying strengths and focus of each processor.
Ultimately, the choice between the HiSilicon Kirin 710 and MediaTek Dimensity 800 depends on the specific requirements and priorities of the user. Whether it is power efficiency, performance, or AI capabilities, both processors offer unique features that can cater to different needs.
Starting with the HiSilicon Kirin 710, it features a total of 8 CPU cores, divided into 4 Cortex-A73 cores running at 2.2 GHz and 4 Cortex-A53 cores running at 1.7 GHz. The architecture used is ARMv8-A, and the lithography is set at 12 nm. With 5500 million transistors, this processor has an efficiency of 5 watts.
On the other hand, the MediaTek Dimensity 800 offers a different set of specifications. It has a total of 4 CPU cores, 4x Cortex-A76 cores running at 2.0 GHz and 4x Cortex-A55 cores running at 2.0 GHz as well. The architecture used is ARMv8.2-A. Unlike the Kirin 710, the Dimensity 800 has a smaller lithography of 7 nm. It has a higher TDP of 10 watts, indicating a higher power consumption. Additionally, the Dimensity 800 also has a Neural Processing Unit (NPU) which the Kirin 710 lacks.
In terms of their specifications, the HiSilicon Kirin 710 has more CPU cores (8 compared to 4) and a lower TDP (5 watts compared to 10 watts). However, the MediaTek Dimensity 800 has a smaller lithography (7 nm compared to 12 nm) and includes a Neural Processing Unit for enhanced AI capabilities. These differences highlight the varying strengths and focus of each processor.
Ultimately, the choice between the HiSilicon Kirin 710 and MediaTek Dimensity 800 depends on the specific requirements and priorities of the user. Whether it is power efficiency, performance, or AI capabilities, both processors offer unique features that can cater to different needs.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
| Number of cores | 8 | 4 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 12 nm | 7 nm |
| Number of transistors | 5500 million | |
| TDP | 5 Watt | 10 Watt |
| Neural Processing | NPU |
Memory (RAM)
| Max amount | up to 6 GB | up to 16 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 2133 MHz |
| Memory-bus | 2x32 bit | 2x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G57 MP4 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 1000 MHz | 650 MHz |
| Execution units | 4 | 4 |
| Shaders | 64 | 64 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 2520x1080@120Hz |
| Max camera resolution | 1x 40MP, 2x 24MP | 1x 80MP, 1x 32MP + 1x 16MP |
| Max Video Capture | 4K@30FPS | |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
| Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
| Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
| Bluetooth | 4.2 | 5.1 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
| Launch Date | 2018 Quarter 3 | 2020 Quarter 2 |
| Partnumber | Hi6260 | MT6873, MT6873V |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Mid-end |
Popular comparisons:
1
Qualcomm Snapdragon 7 Gen 1 vs MediaTek Dimensity 900
2
HiSilicon Kirin 9010 vs MediaTek Dimensity 7360
3
MediaTek Dimensity 810 vs Samsung Exynos 1480
4
Qualcomm Snapdragon 821 vs Qualcomm Snapdragon 7 Plus Gen 3
5
HiSilicon Kirin 710F vs MediaTek Helio G25
6
HiSilicon Kirin 9000 5G vs MediaTek Dimensity 8400
7
Apple A17 Pro vs MediaTek Helio G90
8
Unisoc T9100 vs MediaTek Dimensity 9200
9
Qualcomm Snapdragon 678 vs Qualcomm Snapdragon 888 Plus
10
Qualcomm Snapdragon 845 vs HiSilicon Kirin 9000E 5G