HiSilicon Kirin 710 vs MediaTek Dimensity 800
The HiSilicon Kirin 710 and MediaTek Dimensity 800 are two processors with their own unique specifications.
Starting with the HiSilicon Kirin 710, it features a total of 8 CPU cores, divided into 4 Cortex-A73 cores running at 2.2 GHz and 4 Cortex-A53 cores running at 1.7 GHz. The architecture used is ARMv8-A, and the lithography is set at 12 nm. With 5500 million transistors, this processor has an efficiency of 5 watts.
On the other hand, the MediaTek Dimensity 800 offers a different set of specifications. It has a total of 4 CPU cores, 4x Cortex-A76 cores running at 2.0 GHz and 4x Cortex-A55 cores running at 2.0 GHz as well. The architecture used is ARMv8.2-A. Unlike the Kirin 710, the Dimensity 800 has a smaller lithography of 7 nm. It has a higher TDP of 10 watts, indicating a higher power consumption. Additionally, the Dimensity 800 also has a Neural Processing Unit (NPU) which the Kirin 710 lacks.
In terms of their specifications, the HiSilicon Kirin 710 has more CPU cores (8 compared to 4) and a lower TDP (5 watts compared to 10 watts). However, the MediaTek Dimensity 800 has a smaller lithography (7 nm compared to 12 nm) and includes a Neural Processing Unit for enhanced AI capabilities. These differences highlight the varying strengths and focus of each processor.
Ultimately, the choice between the HiSilicon Kirin 710 and MediaTek Dimensity 800 depends on the specific requirements and priorities of the user. Whether it is power efficiency, performance, or AI capabilities, both processors offer unique features that can cater to different needs.
Starting with the HiSilicon Kirin 710, it features a total of 8 CPU cores, divided into 4 Cortex-A73 cores running at 2.2 GHz and 4 Cortex-A53 cores running at 1.7 GHz. The architecture used is ARMv8-A, and the lithography is set at 12 nm. With 5500 million transistors, this processor has an efficiency of 5 watts.
On the other hand, the MediaTek Dimensity 800 offers a different set of specifications. It has a total of 4 CPU cores, 4x Cortex-A76 cores running at 2.0 GHz and 4x Cortex-A55 cores running at 2.0 GHz as well. The architecture used is ARMv8.2-A. Unlike the Kirin 710, the Dimensity 800 has a smaller lithography of 7 nm. It has a higher TDP of 10 watts, indicating a higher power consumption. Additionally, the Dimensity 800 also has a Neural Processing Unit (NPU) which the Kirin 710 lacks.
In terms of their specifications, the HiSilicon Kirin 710 has more CPU cores (8 compared to 4) and a lower TDP (5 watts compared to 10 watts). However, the MediaTek Dimensity 800 has a smaller lithography (7 nm compared to 12 nm) and includes a Neural Processing Unit for enhanced AI capabilities. These differences highlight the varying strengths and focus of each processor.
Ultimately, the choice between the HiSilicon Kirin 710 and MediaTek Dimensity 800 depends on the specific requirements and priorities of the user. Whether it is power efficiency, performance, or AI capabilities, both processors offer unique features that can cater to different needs.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 650 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | 4K@30FPS | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2020 Quarter 2 |
Partnumber | Hi6260 | MT6873, MT6873V |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
Popular comparisons:
1
Qualcomm Snapdragon 712 vs MediaTek Dimensity 6100 Plus
2
MediaTek Dimensity 9200 vs MediaTek Dimensity 7050
3
Unisoc Tiger T618 vs HiSilicon Kirin 810
4
Apple A12 Bionic vs MediaTek Dimensity 1050
5
Samsung Exynos 2200 vs Qualcomm Snapdragon 690
6
MediaTek Dimensity 8020 vs MediaTek Dimensity 720
7
Qualcomm Snapdragon 480 Plus vs MediaTek Helio G95
8
MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 670
9
Qualcomm Snapdragon 7 Plus Gen 2 vs Qualcomm Snapdragon 480
10
Qualcomm Snapdragon 660 vs Qualcomm Snapdragon 8 Gen 2