HiSilicon Kirin 710 vs MediaTek Dimensity 720

The HiSilicon Kirin 710 and the MediaTek Dimensity 720 are two processors commonly found in modern smartphones. While both processors offer efficient performance, they differ in terms of their specifications.

Starting with the HiSilicon Kirin 710, it features a combination of four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores clocked at 1.7 GHz. With a total of eight cores, this processor offers a balance between power and efficiency. The Kirin 710 employs the ARMv8-A instruction set and is fabricated using a 12 nm lithography process. It consists of approximately 5500 million transistors. One notable specification of the Kirin 710 is its low TDP (Thermal Design Power) of only 5 Watts, indicating its ability to deliver performance without consuming excessive power.

On the other hand, the MediaTek Dimensity 720 takes a slightly different approach. It incorporates two Cortex-A76 cores clocked at 2.2 GHz and six Cortex-A55 cores clocked at 2 GHz. Like the Kirin 710, it also features eight cores. However, the Dimensity 720 operates on the ARMv8.2-A instruction set. The Dimensity 720 adopts a more advanced 7 nm lithography process, allowing for better power efficiency and thermal management. Additionally, it boasts a TDP of 10 Watts, indicating a slightly higher power consumption compared to the Kirin 710. One significant feature of the Dimensity 720 is the addition of a Neural Processing Unit (NPU), which enhances the device's capabilities in terms of artificial intelligence and machine learning tasks.

In summary, both the HiSilicon Kirin 710 and MediaTek Dimensity 720 offer a decent balance between performance and energy efficiency. However, they differ in terms of their core architecture, fabrication process, instruction set, and additional features. These specifications influence the overall capabilities and performance of smartphones equipped with these processors, with the Kirin 710 emphasizing power efficiency and the Dimensity 720 offering enhanced AI capabilities through its NPU.