HiSilicon Kirin 710 vs HiSilicon Kirin 980
The HiSilicon Kirin 710 and Kirin 980 are two processors manufactured by HiSilicon Technologies, a subsidiary of Huawei. Both processors offer impressive specifications and are commonly used in smartphones and other mobile devices.
Starting with the HiSilicon Kirin 710, it features an architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This octa-core processor provides a balanced combination of power and efficiency for smooth performance. It operates on the ARMv8-A instruction set and utilizes a 12 nm lithography, resulting in a compact and energy-efficient design. The Kirin 710 boasts a total of 5500 million transistors and has a thermal design power (TDP) of 5 watts.
On the other hand, the HiSilicon Kirin 980 is a more advanced processor in terms of specifications. It is equipped with an architecture consisting of 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This octa-core processor offers a higher clock speed and improved performance compared to the Kirin 710. Similar to its predecessor, the Kirin 980 also operates on the ARMv8-A instruction set but takes advantage of a more advanced 7 nm lithography. It packs a higher number of transistors, with a total of 6900 million, and has a slightly increased TDP of 6 watts. Additionally, the Kirin 980 boasts the HiSilicon Dual NPU (Neural Processing Unit) for enhanced AI and machine learning capabilities.
Overall, while both the HiSilicon Kirin 710 and Kirin 980 are powerful processors, the Kirin 980 surpasses its predecessor in terms of performance and advanced features. It offers faster clock speeds, a more advanced lithography, and an additional neural processing unit for improved AI capabilities. However, it is important to note that the Kirin 710 still provides excellent performance and efficiency, making it a suitable choice for entry-level and mid-range devices.
Starting with the HiSilicon Kirin 710, it features an architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This octa-core processor provides a balanced combination of power and efficiency for smooth performance. It operates on the ARMv8-A instruction set and utilizes a 12 nm lithography, resulting in a compact and energy-efficient design. The Kirin 710 boasts a total of 5500 million transistors and has a thermal design power (TDP) of 5 watts.
On the other hand, the HiSilicon Kirin 980 is a more advanced processor in terms of specifications. It is equipped with an architecture consisting of 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This octa-core processor offers a higher clock speed and improved performance compared to the Kirin 710. Similar to its predecessor, the Kirin 980 also operates on the ARMv8-A instruction set but takes advantage of a more advanced 7 nm lithography. It packs a higher number of transistors, with a total of 6900 million, and has a slightly increased TDP of 6 watts. Additionally, the Kirin 980 boasts the HiSilicon Dual NPU (Neural Processing Unit) for enhanced AI and machine learning capabilities.
Overall, while both the HiSilicon Kirin 710 and Kirin 980 are powerful processors, the Kirin 980 surpasses its predecessor in terms of performance and advanced features. It offers faster clock speeds, a more advanced lithography, and an additional neural processing unit for improved AI capabilities. However, it is important to note that the Kirin 710 still provides excellent performance and efficiency, making it a suitable choice for entry-level and mid-range devices.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8-A |
| Lithography | 12 nm | 7 nm |
| Number of transistors | 5500 million | 6900 million |
| TDP | 5 Watt | 6 Watt |
| Neural Processing | HiSilicon Dual NPU |
Memory (RAM)
| Max amount | up to 6 GB | up to 8 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 2133 MHz |
| Memory-bus | 2x32 bit | 4x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G76 MP10 |
| GPU Architecture | Mali Bifrost | Mali Bifrost |
| GPU frequency | 1000 MHz | 720 MHz |
| Execution units | 4 | 10 |
| Shaders | 64 | 160 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 3120x1440 |
| Max camera resolution | 1x 40MP, 2x 24MP | 1x 48MP, 2x 32MP |
| Max Video Capture | 4K@30fps | |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 1.4 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
| Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
| Bluetooth | 4.2 | 5.0 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2018 Quarter 3 | 2018 Quarter 4 |
| Partnumber | Hi6260 | |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Flagship |
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