HiSilicon Kirin 710 vs HiSilicon Kirin 960
The HiSilicon Kirin 710 and HiSilicon Kirin 960 are two processors commonly used in smartphones and other mobile devices. Let's compare their specifications to determine which one may be more superior.
Starting with the HiSilicon Kirin 710, it features a 12 nm lithography, which is more advanced than the Kirin 960's 16 nm lithography. This indicates that the Kirin 710 may be more efficient and have better power management capabilities.
In terms of CPU cores and architecture, both processors have 8 cores. However, the Kirin 710 has a configuration of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Kirin 960 boasts 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53 cores. The Kirin 960 has slightly higher clock speeds, which suggests it may offer better performance and faster processing capabilities.
Moving on to the instruction set, both processors support ARMv8-A, which is the latest ARM architecture. This allows for enhanced performance, improved efficiency, and compatibility with modern software and applications.
When it comes to the number of transistors, the Kirin 710 has 5500 million transistors, while the Kirin 960 has 4000 million. Generally, a higher number of transistors indicates a more capable and powerful processor. In this area, the Kirin 710 seems to have the advantage.
Lastly, both processors have a 5 Watt Thermal Design Power (TDP), which refers to the maximum amount of heat a processor generates under normal operating conditions. This suggests both processors have similar power consumption, contributing to longer battery life.
In summary, the HiSilicon Kirin 710 and Kirin 960 processors have their own strengths and weaknesses. The Kirin 710 may have a more advanced lithography, a higher number of transistors, and slightly lower clock speeds. On the other hand, the Kirin 960 offers slightly higher clock speeds and is based on a more power-hungry lithography. Overall, the choice between these processors will depend on the specific requirements and preferences of the device and its users.
Starting with the HiSilicon Kirin 710, it features a 12 nm lithography, which is more advanced than the Kirin 960's 16 nm lithography. This indicates that the Kirin 710 may be more efficient and have better power management capabilities.
In terms of CPU cores and architecture, both processors have 8 cores. However, the Kirin 710 has a configuration of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Kirin 960 boasts 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53 cores. The Kirin 960 has slightly higher clock speeds, which suggests it may offer better performance and faster processing capabilities.
Moving on to the instruction set, both processors support ARMv8-A, which is the latest ARM architecture. This allows for enhanced performance, improved efficiency, and compatibility with modern software and applications.
When it comes to the number of transistors, the Kirin 710 has 5500 million transistors, while the Kirin 960 has 4000 million. Generally, a higher number of transistors indicates a more capable and powerful processor. In this area, the Kirin 710 seems to have the advantage.
Lastly, both processors have a 5 Watt Thermal Design Power (TDP), which refers to the maximum amount of heat a processor generates under normal operating conditions. This suggests both processors have similar power consumption, contributing to longer battery life.
In summary, the HiSilicon Kirin 710 and Kirin 960 processors have their own strengths and weaknesses. The Kirin 710 may have a more advanced lithography, a higher number of transistors, and slightly lower clock speeds. On the other hand, the Kirin 960 offers slightly higher clock speeds and is based on a more power-hungry lithography. Overall, the choice between these processors will depend on the specific requirements and preferences of the device and its users.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 12 nm | 16 nm |
Number of transistors | 5500 million | 4000 million |
TDP | 5 Watt | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 6 GB |
Memory type | LPDDR4 | LPDDR4 |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G71 MP8 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 900 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 8 |
Shaders | 64 | 128 |
DirectX | 12 | 11.3 |
OpenCL API | 2.0 | 1.2 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 20MP, 2x 12MP |
Max Video Capture | 4K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2016 October |
Partnumber | Hi6260 | Hi3660 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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