HiSilicon Kirin 710 vs HiSilicon Kirin 9000 5G

VS
The HiSilicon Kirin 710 and HiSilicon Kirin 9000 5G are two processors that cater to different segments of users. Let's compare their specifications to understand their differences.

Starting with the HiSilicon Kirin 710, it has an architecture of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This processor boasts 8 cores, providing decent multitasking capabilities. It operates on the ARMv8-A instruction set and has a lithography of 12 nm. With a transistor count of 5500 million, the Kirin 710 offers a good balance of power efficiency and performance within its TDP of 5 Watts.

On the other hand, the HiSilicon Kirin 9000 5G is a more powerful and cutting-edge processor. It features an architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. With its ARMv8.2-A instruction set, this processor is optimized for high-performance tasks. The Kirin 9000 5G operates at a lithography of 5 nm and boasts an impressive transistor count of 15300 million. Despite being more powerful, it has a slightly higher TDP of 6 Watts.

In addition to increased performance, the Kirin 9000 5G also excels in neural processing. It incorporates Ascend Lite (2x) and Ascend Tiny (1x) neural processing units, along with HUAWEI Da Vinci Architecture 2.0. These enhancements enable the processor to handle artificial intelligence tasks efficiently.

Overall, while both processors offer decent performance, the HiSilicon Kirin 9000 5G outshines the Kirin 710 in terms of raw power and efficiency. It features a more advanced architecture, a smaller lithography, a higher transistor count, and specialized neural processing capabilities. However, it's important to note that the Kirin 9000 5G is targeted at high-end devices, while the Kirin 710 caters to mid-range smartphones.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 5 nm
Number of transistors 5500 million 15300 million
TDP 5 Watt 6 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1866 MHz 2750 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G51 MP4 Mali-G78 MP24
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 760 MHz
GPU boost frequency 1000 MHz
Execution units 4 24
Shaders 64 384
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 3840x2160
Max camera resolution 1x 40MP, 2x 24MP
Max Video Capture 4K@60fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 4.6 Gbps
Peak Upload Speed 0.15 Gbps 2.5 Gbps
Wi-Fi 4 (802.11n) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC

Supplemental Information

Launch Date 2018 Quarter 3 2020 October
Partnumber Hi6260
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 710
195573
Kirin 9000 5G
762886

GeekBench 6 Single-Core

Score
Kirin 710
329
Kirin 9000 5G
1062

GeekBench 6 Multi-Core

Score
Kirin 710
1341
Kirin 9000 5G
3724