HiSilicon Kirin 710 vs HiSilicon Kirin 710F
The two processors being compared are the HiSilicon Kirin 710 and the HiSilicon Kirin 710F. Both processors have similar specifications, indicating that they are closely related.
In terms of CPU cores and architecture, both processors have the same architecture with 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This configuration provides a balance between high-performance and power efficiency.
Additionally, both processors have 8 cores, giving them the ability to handle multiple tasks simultaneously. This is beneficial for multitasking and running demanding applications smoothly.
Both processors also support the ARMv8-A instruction set. This instruction set is widely used in modern processors and ensures compatibility with a wide range of software and applications.
In terms of manufacturing process, both processors have a lithography of 12 nm. This indicates that they are fabricated using a more advanced and efficient manufacturing process compared to older processors.
Furthermore, both processors have 5500 million transistors. Transistors are crucial components that help in performing calculations and executing instructions in a processor. The higher the number of transistors, the more powerful and efficient the processor tends to be.
Lastly, both processors have a TDP (thermal design power) rating of 5 watts. TDP represents the maximum amount of heat dissipation required to operate the processor at its full potential. A lower TDP indicates better power efficiency and less heat generation, which is crucial for mobile devices.
Overall, the HiSilicon Kirin 710 and the HiSilicon Kirin 710F share similar specifications, suggesting that they are closely related. These processors provide a balance between performance and power efficiency, making them suitable for a wide range of mobile devices.
In terms of CPU cores and architecture, both processors have the same architecture with 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This configuration provides a balance between high-performance and power efficiency.
Additionally, both processors have 8 cores, giving them the ability to handle multiple tasks simultaneously. This is beneficial for multitasking and running demanding applications smoothly.
Both processors also support the ARMv8-A instruction set. This instruction set is widely used in modern processors and ensures compatibility with a wide range of software and applications.
In terms of manufacturing process, both processors have a lithography of 12 nm. This indicates that they are fabricated using a more advanced and efficient manufacturing process compared to older processors.
Furthermore, both processors have 5500 million transistors. Transistors are crucial components that help in performing calculations and executing instructions in a processor. The higher the number of transistors, the more powerful and efficient the processor tends to be.
Lastly, both processors have a TDP (thermal design power) rating of 5 watts. TDP represents the maximum amount of heat dissipation required to operate the processor at its full potential. A lower TDP indicates better power efficiency and less heat generation, which is crucial for mobile devices.
Overall, the HiSilicon Kirin 710 and the HiSilicon Kirin 710F share similar specifications, suggesting that they are closely related. These processors provide a balance between performance and power efficiency, making them suitable for a wide range of mobile devices.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 12 nm | 12 nm |
Number of transistors | 5500 million | 5500 million |
TDP | 5 Watt | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 6 GB |
Memory type | LPDDR4 | LPDDR4 |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G51 MP4 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 650 MHz |
GPU boost frequency | 1000 MHz | 1000 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2340x1080 |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 48MP, 2x 24MP |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 4 (802.11n) | 4 (802.11n) |
Bluetooth | 4.2 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2019 Quarter 1 |
Partnumber | Hi6260 | Hi6260 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Samsung Exynos 7904 vs Unisoc Tanggula T740 5G
2
MediaTek Helio G80 vs HiSilicon Kirin 810
3
Samsung Exynos 2200 vs Qualcomm Snapdragon 8 Plus Gen 1
4
Qualcomm Snapdragon 710 vs MediaTek Dimensity 8000
5
Unisoc Tiger T310 vs Unisoc Tiger T618
6
HiSilicon Kirin 9000 5G vs MediaTek Helio G37
7
Samsung Exynos 990 vs HiSilicon Kirin 980
8
Samsung Exynos 7884B vs MediaTek Helio P90
9
Samsung Exynos 9609 vs Qualcomm Snapdragon 778G Plus
10
Qualcomm Snapdragon 888 vs Qualcomm Snapdragon 712