Qualcomm Snapdragon 4 Gen 4
The Snapdragon 4 Gen 4 is one of Qualcomm low-end CPU. It has 6 cores and was announced in 2025 Quarter 4. It has "big.LITTLE" cores-set: 6x Cortex-A55 (2 GHz). The processor is manufactured using a 4 nm process technology and supports 4G, 5G, LPDDR5.
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 6x 2 GHz – Cortex-A55 |
| Number of cores | 6 |
| Instruction Set | ARMv8.2-A |
| Lithography | 4 nm |
| TDP | 4 Watt |
| Neural Processing | NPU |
Memory (RAM)
| Max amount | up to 8 GB |
| Memory type | LPDDR5 |
| Memory frequency | 3200 MHz |
| Memory-bus | 2x16 bit |
Camera, Video, Display
| Max screen resolution | 2520x1200 |
| Max camera resolution | 1x 108MP, 2x 16MP |
| Max Video Capture | FullHD+@60fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes |
| 5G network | Yes |
| Peak Download Speed | 2.5 Gbps |
| Peak Upload Speed | 0.9 Gbps |
| Wi-Fi | 5 (802.11ac) |
| Bluetooth | 5.1 |
| Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
| Launch Date | 2025 Quarter 4 |
| Partnumber | SM4450-AF |
| Vertical Segment | Mobiles |
| Positioning | Low-end |
Popular comparisons:
1
Google Tensor G2 vs Google Tensor G3
2
HiSilicon Kirin 8020 vs Qualcomm Snapdragon 690
3
HiSilicon Kirin 990 5G vs MediaTek Dimensity 700
4
Qualcomm Snapdragon 8 Gen 1 vs MediaTek Dimensity 9000 Plus
5
Qualcomm Snapdragon 430 vs Qualcomm Snapdragon 6 Gen 3
6
Unisoc Tanggula T740 5G vs MediaTek Helio G37
7
Google Tensor G4 vs Unisoc Tanggula T770 5G
8
HiSilicon Kirin 9000E 5G vs Apple M5 (iPad)
9
Samsung Exynos 9609 vs MediaTek Dimensity 6080
10
HiSilicon Kirin 955 vs MediaTek Dimensity 1000