MediaTek Dimensity 9400e
The Dimensity 9400e is one of MediaTek flagship CPU. It has 8 cores and was announced in 2025 Quarter 2. It has "top.big.LITTLE" cores-set: 1x Cortex-X4, 3x Cortex-X4 (2.85 GHz), 4x Cortex-A720 (2 GHz). The processor is manufactured using a 4 nm process technology and supports 4G, 5G, LPDDR5X.

GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 3.4 GHz – Cortex-X4 3x 2.85 GHz – Cortex-X4 4x 2 GHz – Cortex-A720 |
Number of cores | 8 |
Instruction Set | ARMv9.2-A |
Lithography | 4 nm |
Number of transistors | 22700 million |
Neural Processing | MediaTek NPU 790 |
Memory (RAM)
Max amount | up to 24 GB |
Memory type | LPDDR5X |
Memory frequency | 4266 MHz |
Memory-bus | 4x16 bit |
Graphics
GPU name | Mali-G720 MP12 |
GPU Architecture | Mali Valhall |
GPU frequency | 1300 MHz |
Execution units | 12 |
Shaders | 1536 |
DirectX | 12 |
OpenCL API | 3.0 |
Vulkan API | 1.3 |
Camera, Video, Display
Max screen resolution | 3840x2160 |
Max camera resolution | 1x 320MP |
Max Video Capture | 8K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes |
5G network | Yes |
Peak Download Speed | 7.3 Gbps |
Wi-Fi | 7 (802.11be) |
Bluetooth | 6.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2025 Quarter 2 |
Vertical Segment | Mobiles |
Positioning | Flagship |
Popular comparisons:
1
MediaTek Dimensity 7200 vs HiSilicon Kirin 710
2
Qualcomm Snapdragon 7 Gen 1 vs Qualcomm Snapdragon 4s Gen 2
3
Qualcomm Snapdragon 678 vs MediaTek Dimensity 9000 Plus
4
Qualcomm Snapdragon 730G vs MediaTek Dimensity 9400 Plus
5
MediaTek Helio G50 vs Qualcomm Snapdragon 675
6
Qualcomm Snapdragon 7 Plus Gen 3 vs Samsung Exynos 980
7
Apple A11 Bionic vs HiSilicon Kirin 9000E 5G
8
Qualcomm Snapdragon 7 Gen 3 vs Unisoc Tanggula T770 5G
9
HiSilicon Kirin 9000 5G vs Qualcomm Snapdragon 778G Plus
10
Unisoc T820 vs HiSilicon Kirin 990 4G