MediaTek Dimensity 8050
cpu_s1 It has 8 cores and was announced in 2023 Quarter 2. It has "top.big.LITTLE" cores-set: 1x Cortex-A78, 3x Cortex-A78 (2.6 GHz), 4x Cortex-A55 (2 GHz). The processor is manufactured using a 6 nm process technology and supports 4G, 5G, LPDDR4X.
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 1x 3 GHz – Cortex-A78 3x 2.6 GHz – Cortex-A78 4x 2 GHz – Cortex-A55 |
| Number of cores | 8 |
| Instruction Set | ARMv8.2-A |
| Lithography | 6 nm |
| Neural Processing | MediaTek APU 570 |
Memory (RAM)
| Max amount | up to 16 GB |
| Memory type | LPDDR4X |
| Memory frequency | 2133 MHz |
| Memory-bus | 4x16 bit |
Graphics
| GPU name | Mali-G77 MP9 |
| GPU Architecture | Mali Valhall |
| GPU frequency | 886 MHz |
| Execution units | 9 |
| Shaders | 288 |
| OpenCL API | 2.0 |
| Vulkan API | 1.3 |
Camera, Video, Display
| Max screen resolution | 2520x1080 |
| Max camera resolution | 1x 200MP |
| Max Video Capture | 4K@60fps |
| Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes |
| 5G network | Yes |
| Peak Download Speed | 4.7 Gbps |
| Peak Upload Speed | 2.5 Gbps |
| Wi-Fi | 6 (802.11ax) |
| Bluetooth | 5.2 |
| Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
| Launch Date | 2023 Quarter 2 |
| Partnumber | MT6893, MT6893Z_T/CZA |
| Vertical Segment | Mobiles |
| Positioning | Mid-end |
Popular comparisons:
1
MediaTek Dimensity 8400 vs MediaTek MT6737
2
Apple A12 Bionic vs MediaTek Helio G100
3
Unisoc Tiger T620 vs MediaTek Dimensity 1100
4
Qualcomm Snapdragon 425 vs MediaTek Dimensity 1300
5
Samsung Exynos 9820 vs Samsung Exynos 980
6
Google Tensor G2 vs MediaTek Helio G25
7
Qualcomm Snapdragon 821 vs Unisoc Tiger T710
8
Apple M2 (iPad) vs HiSilicon Kirin 8000
9
MediaTek Helio G81 vs Qualcomm Snapdragon 7 Plus Gen 3
10
MediaTek Dimensity 1200 vs HiSilicon Kirin 710