Intel Core Ultra 5 336H
The Intel Core Ultra 5 336H is a 12-cores CPU (4 P-cores + 8 E-threads) laptop x86-64 processor built on a 2 nm process, featuring a 1.9 GHz base frequency with up to 4.6 GHz max turbo, 18M L3 Cache (shared) and integrated graphics Intel Xe3 Graphics. It supports DDR5-7200, LPDDR5x-8533 memory and PCIe 5.0.
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Cinebench 2024 Single-Core
Score
Cinebench 2024 Multi-Core
Score
Cinebench R23 Single-Core
Score
Cinebench R23 Multi-Core
Score
Essentials
| Platform | Laptop |
| Lithography | 2 nm |
| Launch Date | 2026 Quarter 1 |
CPU cores and architecture
| Performance Cores | 4 |
| Performance Threads | 4 |
| Performance Base frequency | 1.9 GHz |
| Performance Boost frequency | 4.6 GHz |
| Efficient Cores | 8 |
| Efficient Threads | 8 |
| Efficient Base frequency | 1.5 GHz |
| Efficient Boost frequency | 3.6 GHz |
| L2 Cache | 2560K |
| L3 Cache | 18M |
| Overclocking | Yes |
Memory Specifications
| Memory Types | DDR5-7200 LPDDR5x-8533 |
| Max Memory Size | 128 GB |
| Memory Channels | 2 |
| ECC Support | Yes |
GPU Specifications
| GPU Name | Intel Xe3 Graphics |
| Max Frequency | 2300 MHz |
Package
| Socket | Other |
| Max. Operating Temperature | 100 |
PCI Express
| PCI Express Version | 5.0 |
| PCI Express Lanes | 20 |
Popular comparisons:
1
Qualcomm Snapdragon 480 vs HiSilicon Kirin 9030 Pro
2
MediaTek Dimensity 1000 vs Apple A18
3
Qualcomm Snapdragon 8 Gen 5 vs Samsung Exynos 2600
4
MediaTek Dimensity 810 vs HiSilicon Kirin 990 4G
5
Qualcomm Snapdragon 636 vs MediaTek Helio G25
6
Qualcomm Snapdragon 7 Plus Gen 2 vs Qualcomm Snapdragon 7 Gen 4
7
MediaTek Dimensity 8400 vs MediaTek Dimensity 800U
8
MediaTek Dimensity 7400 vs MediaTek Dimensity 8000
9
Qualcomm Snapdragon 4s Gen 2 vs Qualcomm Snapdragon 8 Elite (Gen 4)
10
Unisoc Tiger T710 vs MediaTek Dimensity 9300 Plus