Intel Core Ultra 5 322
The Intel Core Ultra 5 322 is a 6-cores CPU (2 P-cores + 4 E-threads) laptop x86-64 processor built on a 2 nm process, featuring a 2.5 GHz base frequency with up to 4.4 GHz max turbo, 12M L3 Cache (shared) and integrated graphics Intel Graphics 4 Xe3. It supports DDR5-6400, LPDDR5x-7467 memory and PCIe 5.0.
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Cinebench 2024 Single-Core
Score
Cinebench 2024 Multi-Core
Score
Cinebench R23 Single-Core
Score
Cinebench R23 Multi-Core
Score
Essentials
| Platform | Laptop |
| Lithography | 2 nm |
| Launch Date | 2026 Quarter 1 |
CPU cores and architecture
| Performance Cores | 2 |
| Performance Threads | 2 |
| Performance Base frequency | 2.5 GHz |
| Performance Boost frequency | 4.4 GHz |
| Efficient Cores | 4 |
| Efficient Threads | 4 |
| Efficient Base frequency | 1.9 GHz |
| Efficient Boost frequency | 3.3 GHz |
| L3 Cache | 12M |
| Overclocking | Yes |
Memory Specifications
| Memory Types | DDR5-6400 LPDDR5x-7467 |
| Max Memory Size | 128 GB |
| Memory Channels | 2 |
| ECC Support | Yes |
GPU Specifications
| GPU Name | Intel Graphics 4 Xe3 |
| Max Frequency | 2300 MHz |
Package
| Socket | Other |
| Max. Operating Temperature | 100 |
PCI Express
| PCI Express Version | 5.0 |
| PCI Express Lanes | 12 |
Popular comparisons:
1
MediaTek Dimensity 8020 vs MediaTek Helio G90
2
MediaTek Dimensity 9000 vs Unisoc Tiger T700
3
MediaTek Helio P70 vs Qualcomm Snapdragon 730G
4
MediaTek Helio G70 vs MediaTek Dimensity 9000 Plus
5
Qualcomm Snapdragon 845 vs MediaTek Helio G25
6
MediaTek Dimensity 1050 vs MediaTek Dimensity 7030
7
MediaTek Dimensity 8500 vs Unisoc T9100
8
Qualcomm Snapdragon 662 vs MediaTek Dimensity 930
9
Qualcomm Snapdragon 7s Gen 3 vs Samsung Exynos 7420
10
Qualcomm Snapdragon 632 vs HiSilicon Kirin 820 5G