Apple M3 (iPad)
cpu_s1 It has 4 cores and was announced in 2023 Quarter 4. It has "big.LITTLE" cores-set: 4x (4.05 GHz). The processor is manufactured using a 3 nm process technology and supports 4G, 5G, LPDDR5.
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 4.05 GHz |
| Number of cores | 4 |
| Instruction Set | ARMv8.6-A |
| Lithography | 3 nm |
| Number of transistors | 25000 million |
| TDP | 20 Watt |
| Neural Processing | Apple Neural Engine |
Memory (RAM)
| Max amount | up to 24 GB |
| Memory type | LPDDR5 |
| Memory frequency | 3200 MHz |
| Memory-bus | 4x16 bit |
Camera, Video, Display
| Max screen resolution | 2732x2048 |
| Max camera resolution | 1x 48MP |
| Max Video Capture | 4K@60fps |
| Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes |
| 5G network | Yes |
| Peak Download Speed | 7.5 Gbps |
| Peak Upload Speed | 3.5 Gbps |
| Wi-Fi | 6 (802.11ax) |
| Bluetooth | 5.3 |
| Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
| Launch Date | 2023 Quarter 4 |
| Vertical Segment | Tablets |
| Positioning | Flagship |
Popular comparisons:
1
Samsung Exynos 850 vs Qualcomm Snapdragon 7 Plus Gen 3
2
MediaTek Dimensity 7050 vs MediaTek Dimensity 6080
3
MediaTek Helio P22 vs MediaTek Helio A22
4
MediaTek Dimensity 7025 vs Qualcomm Snapdragon 685
5
Qualcomm Snapdragon 625 vs Samsung Exynos 1330
6
MediaTek Dimensity 8350 vs MediaTek Dimensity 7030
7
Qualcomm Snapdragon 888 vs Samsung Exynos 2400
8
MediaTek Helio G80 vs MediaTek Dimensity 6300
9
Qualcomm Snapdragon 675 vs MediaTek Helio G36
10
HiSilicon Kirin 970 vs Qualcomm Snapdragon 439