Unisoc SC9863A vs Unisoc Tanggula T770 5G
The Unisoc SC9863A and Unisoc Tanggula T770 5G are both processors with their own unique specifications.
Starting with the Unisoc SC9863A, it has a total of 8 cores. The architecture consists of 4x 1.6 GHz Cortex-A55 cores and 4x 1.2 GHz Cortex-A55 cores. It operates on the ARMv8.2-A instruction set and has a lithography of 28 nm. With a TDP (Thermal Design Power) of 3 Watts, it is designed to consume less power during operation. In addition, it features a Neural Processing Unit (NPU), which enhances its capabilities in tasks related to artificial intelligence and machine learning.
On the other hand, the Unisoc Tanggula T770 5G also has 8 cores. Its architecture is composed of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. Similarly, it operates on the ARMv8.2-A instruction set. However, one notable difference is that it has a smaller lithography of 6 nm, which indicates a more advanced manufacturing process. This smaller lithography typically results in improved power efficiency and performance. The TDP of the Tanggula T770 5G is slightly higher at 5 Watts, indicating that it may consume slightly more power compared to the SC9863A. Like the SC9863A, it also features an NPU, which enhances its AI capabilities.
In summary, while both processors have 8 cores and support the ARMv8.2-A instruction set, there are some differences in their architecture, lithography, and power consumption. The SC9863A has a lower TDP of 3 Watts and a lithography of 28 nm, making it more power-efficient but potentially less powerful. On the other hand, the Tanggula T770 5G has a higher TDP of 5 Watts and a smaller lithography of 6 nm, indicating better power efficiency and potentially higher performance. Both processors feature an NPU, showcasing their capability in AI-related tasks. Ultimately, the choice between them would depend on the specific requirements and priorities of the intended use case.
Starting with the Unisoc SC9863A, it has a total of 8 cores. The architecture consists of 4x 1.6 GHz Cortex-A55 cores and 4x 1.2 GHz Cortex-A55 cores. It operates on the ARMv8.2-A instruction set and has a lithography of 28 nm. With a TDP (Thermal Design Power) of 3 Watts, it is designed to consume less power during operation. In addition, it features a Neural Processing Unit (NPU), which enhances its capabilities in tasks related to artificial intelligence and machine learning.
On the other hand, the Unisoc Tanggula T770 5G also has 8 cores. Its architecture is composed of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. Similarly, it operates on the ARMv8.2-A instruction set. However, one notable difference is that it has a smaller lithography of 6 nm, which indicates a more advanced manufacturing process. This smaller lithography typically results in improved power efficiency and performance. The TDP of the Tanggula T770 5G is slightly higher at 5 Watts, indicating that it may consume slightly more power compared to the SC9863A. Like the SC9863A, it also features an NPU, which enhances its AI capabilities.
In summary, while both processors have 8 cores and support the ARMv8.2-A instruction set, there are some differences in their architecture, lithography, and power consumption. The SC9863A has a lower TDP of 3 Watts and a lithography of 28 nm, making it more power-efficient but potentially less powerful. On the other hand, the Tanggula T770 5G has a higher TDP of 5 Watts and a smaller lithography of 6 nm, indicating better power efficiency and potentially higher performance. Both processors feature an NPU, showcasing their capability in AI-related tasks. Ultimately, the choice between them would depend on the specific requirements and priorities of the intended use case.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 1.6 GHz – Cortex-A55 4x 1.2 GHz – Cortex-A55 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
TDP | 3 Watt | 5 Watt |
Neural Processing | NPU | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 32 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | eMMC 5.1 | UFS 3.1 |
Graphics
GPU name | Imagination PowerVR GE8322 | Mali-G57 MP6 |
GPU Architecture | PowerVR Rogue | Mali Valhall |
GPU frequency | 550 MHz | 850 MHz |
Execution units | 4 | 6 |
Shaders | 128 | 96 |
DirectX | 11 | 12 |
OpenCL API | 3.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080 | 2160x1080@120Hz |
Max camera resolution | 1x 16MP + 1x 5MP | 1x 108MP, 2x 24MP |
Max Video Capture | FullHD@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.1 Gbps | 1.5 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 November | 2021 February |
Partnumber | SC9863A | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Low-end | Mid-end |
Popular comparisons:
1
Qualcomm Snapdragon 6s Gen 3 vs Qualcomm Snapdragon 780G
2
Unisoc Tiger T610 vs Samsung Exynos 9610
3
MediaTek Dimensity 7200 vs HiSilicon Kirin 820 5G
4
Qualcomm Snapdragon 678 vs HiSilicon Kirin 930
5
MediaTek Helio G200 vs Qualcomm Snapdragon 778G Plus
6
Qualcomm Snapdragon 860 vs MediaTek Dimensity 8200
7
Qualcomm Snapdragon 630 vs MediaTek Dimensity 900
8
Samsung Exynos 9825 vs Xiaomi Xring O1
9
Qualcomm Snapdragon 7 Plus Gen 2 vs MediaTek Dimensity 6300
10
Qualcomm Snapdragon 6 Gen 4 vs Apple A17 Pro