Unisoc SC9863A vs Unisoc Tanggula T770 5G
The Unisoc SC9863A and Unisoc Tanggula T770 5G are both processors with their own unique specifications.
Starting with the Unisoc SC9863A, it has a total of 8 cores. The architecture consists of 4x 1.6 GHz Cortex-A55 cores and 4x 1.2 GHz Cortex-A55 cores. It operates on the ARMv8.2-A instruction set and has a lithography of 28 nm. With a TDP (Thermal Design Power) of 3 Watts, it is designed to consume less power during operation. In addition, it features a Neural Processing Unit (NPU), which enhances its capabilities in tasks related to artificial intelligence and machine learning.
On the other hand, the Unisoc Tanggula T770 5G also has 8 cores. Its architecture is composed of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. Similarly, it operates on the ARMv8.2-A instruction set. However, one notable difference is that it has a smaller lithography of 6 nm, which indicates a more advanced manufacturing process. This smaller lithography typically results in improved power efficiency and performance. The TDP of the Tanggula T770 5G is slightly higher at 5 Watts, indicating that it may consume slightly more power compared to the SC9863A. Like the SC9863A, it also features an NPU, which enhances its AI capabilities.
In summary, while both processors have 8 cores and support the ARMv8.2-A instruction set, there are some differences in their architecture, lithography, and power consumption. The SC9863A has a lower TDP of 3 Watts and a lithography of 28 nm, making it more power-efficient but potentially less powerful. On the other hand, the Tanggula T770 5G has a higher TDP of 5 Watts and a smaller lithography of 6 nm, indicating better power efficiency and potentially higher performance. Both processors feature an NPU, showcasing their capability in AI-related tasks. Ultimately, the choice between them would depend on the specific requirements and priorities of the intended use case.
Starting with the Unisoc SC9863A, it has a total of 8 cores. The architecture consists of 4x 1.6 GHz Cortex-A55 cores and 4x 1.2 GHz Cortex-A55 cores. It operates on the ARMv8.2-A instruction set and has a lithography of 28 nm. With a TDP (Thermal Design Power) of 3 Watts, it is designed to consume less power during operation. In addition, it features a Neural Processing Unit (NPU), which enhances its capabilities in tasks related to artificial intelligence and machine learning.
On the other hand, the Unisoc Tanggula T770 5G also has 8 cores. Its architecture is composed of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. Similarly, it operates on the ARMv8.2-A instruction set. However, one notable difference is that it has a smaller lithography of 6 nm, which indicates a more advanced manufacturing process. This smaller lithography typically results in improved power efficiency and performance. The TDP of the Tanggula T770 5G is slightly higher at 5 Watts, indicating that it may consume slightly more power compared to the SC9863A. Like the SC9863A, it also features an NPU, which enhances its AI capabilities.
In summary, while both processors have 8 cores and support the ARMv8.2-A instruction set, there are some differences in their architecture, lithography, and power consumption. The SC9863A has a lower TDP of 3 Watts and a lithography of 28 nm, making it more power-efficient but potentially less powerful. On the other hand, the Tanggula T770 5G has a higher TDP of 5 Watts and a smaller lithography of 6 nm, indicating better power efficiency and potentially higher performance. Both processors feature an NPU, showcasing their capability in AI-related tasks. Ultimately, the choice between them would depend on the specific requirements and priorities of the intended use case.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 1.6 GHz – Cortex-A55 4x 1.2 GHz – Cortex-A55 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
TDP | 3 Watt | 5 Watt |
Neural Processing | NPU | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 32 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | eMMC 5.1 | UFS 3.1 |
Graphics
GPU name | Imagination PowerVR GE8322 | Mali-G57 MP6 |
GPU Architecture | PowerVR Rogue | Mali Valhall |
GPU frequency | 550 MHz | 850 MHz |
Execution units | 4 | 6 |
Shaders | 128 | 96 |
DirectX | 11 | 12 |
OpenCL API | 3.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080 | 2160x1080@120Hz |
Max camera resolution | 1x 16MP + 1x 5MP | 1x 108MP, 2x 24MP |
Max Video Capture | FullHD@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.1 Gbps | 1.5 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 November | 2021 February |
Partnumber | SC9863A | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Low-end | Mid-end |
Popular comparisons:
1
Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 8s Gen 3
2
Qualcomm Snapdragon 662 vs Apple M2 (iPad)
3
Qualcomm Snapdragon 439 vs MediaTek Dimensity 9000 Plus
4
MediaTek Helio G96 vs MediaTek Helio P95
5
MediaTek Helio P22 vs Qualcomm Snapdragon 8 Gen 1
6
Apple A14 Bionic vs Unisoc Tiger T616
7
MediaTek Dimensity 930 vs Google Tensor G4
8
Samsung Exynos 1580 vs Unisoc SC7731E
9
Qualcomm Snapdragon 450 vs MediaTek Dimensity 920
10
MediaTek Helio P60 vs HiSilicon Kirin 9020