Unisoc SC9832E vs Unisoc Tiger T610
The Unisoc SC9832E and Unisoc Tiger T610 are two processors that can be compared based on their specifications.
Starting with the Unisoc SC9832E, it features a 28 nm lithography with four CPU cores running at a clock speed of 1.4 GHz. These cores are based on the Cortex-A53 architecture and utilize the ARMv8-A instruction set. The TDP, or thermal design power, of the SC9832E is 7 Watts.
Moving on to the Unisoc Tiger T610, it boasts a more advanced 12 nm lithography. It has a total of eight CPU cores, including two Cortex-A75 cores running at 1.8 GHz and six Cortex-A55 cores also running at 1.8 GHz. The instruction set used by the T610 is ARMv8.2-A. Compared to the SC9832E, the T610 has a slightly higher TDP of 10 Watts.
In terms of CPU architecture, the T610 is more powerful than the SC9832E. The Cortex-A75 cores offer better performance and efficiency compared to the Cortex-A53 cores found in the SC9832E. Additionally, the inclusion of six Cortex-A55 cores in the T610 provides further performance enhancements.
One area where the SC9832E holds an advantage is the manufacturing process. With a 28 nm lithography, it is more power-efficient than the T610's 12 nm lithography. This is reflected in the lower TDP of the SC9832E, as it consumes less power.
In summary, the Unisoc Tiger T610 outperforms the SC9832E in terms of CPU architecture and overall processing power. However, the SC9832E has the advantage of being more power-efficient due to its higher lithography. The choice between these two processors would depend on the specific requirements of the device or application they are intended for.
Starting with the Unisoc SC9832E, it features a 28 nm lithography with four CPU cores running at a clock speed of 1.4 GHz. These cores are based on the Cortex-A53 architecture and utilize the ARMv8-A instruction set. The TDP, or thermal design power, of the SC9832E is 7 Watts.
Moving on to the Unisoc Tiger T610, it boasts a more advanced 12 nm lithography. It has a total of eight CPU cores, including two Cortex-A75 cores running at 1.8 GHz and six Cortex-A55 cores also running at 1.8 GHz. The instruction set used by the T610 is ARMv8.2-A. Compared to the SC9832E, the T610 has a slightly higher TDP of 10 Watts.
In terms of CPU architecture, the T610 is more powerful than the SC9832E. The Cortex-A75 cores offer better performance and efficiency compared to the Cortex-A53 cores found in the SC9832E. Additionally, the inclusion of six Cortex-A55 cores in the T610 provides further performance enhancements.
One area where the SC9832E holds an advantage is the manufacturing process. With a 28 nm lithography, it is more power-efficient than the T610's 12 nm lithography. This is reflected in the lower TDP of the SC9832E, as it consumes less power.
In summary, the Unisoc Tiger T610 outperforms the SC9832E in terms of CPU architecture and overall processing power. However, the SC9832E has the advantage of being more power-efficient due to its higher lithography. The choice between these two processors would depend on the specific requirements of the device or application they are intended for.
CPU cores and architecture
Architecture | 4x 1.4 GHz – Cortex-A53 | 2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 4 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 12 nm |
TDP | 7 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 2 GB | up to 6 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 667 MHz | 1600 MHz |
Memory-bus | 2x16 bit |
Storage
Storage specification | eMMC 5.1 | eMMC 5.1 |
Graphics
GPU name | Mali-T820 MP1 | Mali-G52 MP2 |
GPU Architecture | Midgard | Bifrost |
GPU frequency | 680 MHz | 614.4 MHz |
Execution units | 1 | 2 |
Shaders | 4 | 32 |
DirectX | 11 | 11 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 1440x720 | 2400x1080 |
Max camera resolution | 1x 13MP | 1x 32MP |
Max Video Capture | FullHD@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) | H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.15 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.05 Gbps | 0.1 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 | 2019 June |
Partnumber | T610 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Low-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 1000 vs HiSilicon Kirin 930
2
MediaTek Dimensity 700 vs Qualcomm Snapdragon 768G
3
HiSilicon Kirin 980 vs Qualcomm Snapdragon 7 Gen 1
4
MediaTek Helio G36 vs HiSilicon Kirin 955
5
Qualcomm Snapdragon 765G vs Qualcomm Snapdragon 720G
6
Unisoc Tanggula T770 5G vs HiSilicon Kirin 9000 5G
7
MediaTek Dimensity 8200 vs Apple A10 Fusion
8
Qualcomm Snapdragon 662 vs MediaTek Helio G35
9
Samsung Exynos 9611 vs MediaTek Dimensity 6080
10
Samsung Exynos 1380 vs Qualcomm Snapdragon 685