Unisoc SC7731E vs Unisoc Tanggula T770 5G
The Unisoc SC7731E and Unisoc Tanggula T770 5G are two processors with varying specifications.
The Unisoc SC7731E is equipped with a quad-core Cortex-A7 architecture, with each core running at a speed of 1.3 GHz. It operates on ARMv7-A instruction set and has a lithography of 28 nm. The TDP (thermal design power) of the SC7731E is 7 Watts.
In contrast, the Unisoc Tanggula T770 5G comes with a more advanced architecture. It features an octa-core setup consisting of one 2.5 GHz Cortex-A76 core, three 2.2 GHz Cortex-A76 cores, and four 2.0 GHz Cortex-A55 cores. The instruction set utilized by the T770 5G is ARMv8.2-A. The processor has a smaller lithography of just 6 nm, indicating improved efficiency. Additionally, it has a lower TDP of 5 Watts, which means it consumes less power compared to the SC7731E.
One notable feature of the Tanggula T770 5G is its Neural Processing Unit (NPU). This specialized component is designed to accelerate and enhance artificial intelligence-related tasks, providing improved performance in tasks such as image recognition or language processing.
In terms of performance, the Tanggula T770 5G outshines the SC7731E due to its more powerful architecture and increased number of cores. The T770 5G offers superior processing capabilities, allowing for smoother multitasking and faster execution of complex tasks.
However, it is important to note that the choice of processor ultimately depends on the intended usage and requirements. If power efficiency and cost-effectiveness are priorities, the SC7731E may be a suitable option. On the other hand, the Tanggula T770 5G's advanced architecture and NPU make it more suitable for demanding tasks and next-generation connectivity needs.
It's essential to consider these specifications and factors when choosing a processor for a particular device or application, ensuring optimal performance and efficiency.
The Unisoc SC7731E is equipped with a quad-core Cortex-A7 architecture, with each core running at a speed of 1.3 GHz. It operates on ARMv7-A instruction set and has a lithography of 28 nm. The TDP (thermal design power) of the SC7731E is 7 Watts.
In contrast, the Unisoc Tanggula T770 5G comes with a more advanced architecture. It features an octa-core setup consisting of one 2.5 GHz Cortex-A76 core, three 2.2 GHz Cortex-A76 cores, and four 2.0 GHz Cortex-A55 cores. The instruction set utilized by the T770 5G is ARMv8.2-A. The processor has a smaller lithography of just 6 nm, indicating improved efficiency. Additionally, it has a lower TDP of 5 Watts, which means it consumes less power compared to the SC7731E.
One notable feature of the Tanggula T770 5G is its Neural Processing Unit (NPU). This specialized component is designed to accelerate and enhance artificial intelligence-related tasks, providing improved performance in tasks such as image recognition or language processing.
In terms of performance, the Tanggula T770 5G outshines the SC7731E due to its more powerful architecture and increased number of cores. The T770 5G offers superior processing capabilities, allowing for smoother multitasking and faster execution of complex tasks.
However, it is important to note that the choice of processor ultimately depends on the intended usage and requirements. If power efficiency and cost-effectiveness are priorities, the SC7731E may be a suitable option. On the other hand, the Tanggula T770 5G's advanced architecture and NPU make it more suitable for demanding tasks and next-generation connectivity needs.
It's essential to consider these specifications and factors when choosing a processor for a particular device or application, ensuring optimal performance and efficiency.
CPU cores and architecture
Architecture | 4x 1.3 GHz – Cortex-A7 | 1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 4 | 8 |
Instruction Set | ARMv7-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
TDP | 7 Watt | 5 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 1 GB | up to 32 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 533 MHz | 2133 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | eMMC 5.1 | UFS 3.1 |
Graphics
GPU name | Mali-T820 MP1 | Mali-G57 MP6 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 600 MHz | 850 MHz |
Execution units | 1 | 6 |
Shaders | 4 | 96 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 1440x720 | 2160x1080@120Hz |
Max camera resolution | 1x 8MP | 1x 108MP, 2x 24MP |
Max Video Capture | HD@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) | H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.7 Gbps | |
Peak Upload Speed | 1.5 Gbps | |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 2 | 2021 February |
Partnumber | T770, Tiger T7520 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Low-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Samsung Exynos 9610 vs MediaTek Dimensity 8100
2
Samsung Exynos 9611 vs Qualcomm Snapdragon 636
3
HiSilicon Kirin 710 vs Qualcomm Snapdragon 8 Gen 1
4
Samsung Exynos 2200 vs MediaTek Dimensity 9200 Plus
5
Apple A16 Bionic vs Samsung Exynos 980
6
Qualcomm Snapdragon 8 Gen 2 vs Samsung Exynos 7884B
7
Qualcomm Snapdragon 8 Plus Gen 1 vs MediaTek Dimensity 7200
8
MediaTek Dimensity 820 vs HiSilicon Kirin 990 4G
9
Unisoc Tiger T606 vs Qualcomm Snapdragon 821
10
MediaTek Helio G25 vs HiSilicon Kirin 9000 5G