MediaTek Dimensity 920 vs Unisoc Tiger T700
The Unisoc Tiger T700 and MediaTek Dimensity 920 are both processors with their own unique set of specifications.
Starting with the Unisoc Tiger T700, it features an architecture that consists of 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. With a total of 8 cores, this processor offers a decent amount of power for various tasks. It operates on the ARMv8.2-A instruction set and has a lithography of 12 nm. The thermal design power (TDP) is 10 watts, indicating its energy efficiency.
On the other hand, the MediaTek Dimensity 920 processor has a more powerful architecture. It consists of 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This combination allows for more efficient multitasking and processing of demanding applications. Like the Unisoc Tiger T700, it operates on the ARMv8.2-A instruction set. However, it has a smaller lithography of 6 nm, which generally implies better power efficiency. Another notable feature of the Dimensity 920 is the inclusion of a Neural Processing Unit (NPU), which enhances AI and machine learning capabilities.
In terms of core count, both processors have 8 cores, providing sufficient power for most tasks. However, the Dimensity 920 boasts a more advanced architecture with its Cortex-A78 cores, offering potentially higher performance. Additionally, the smaller lithography of 6 nm suggests that the Dimensity 920 may offer better power efficiency and potentially generate less heat.
Ultimately, the choice between the Unisoc Tiger T700 and MediaTek Dimensity 920 depends on specific requirements and preferences. The Tiger T700 may be suitable for those seeking an affordable and energy-efficient option, while the Dimensity 920 might be more appealing to those who prioritize higher performance and AI capabilities. Careful evaluation of the intended use case and a consideration of these specifications can help make an informed decision.
Starting with the Unisoc Tiger T700, it features an architecture that consists of 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores. With a total of 8 cores, this processor offers a decent amount of power for various tasks. It operates on the ARMv8.2-A instruction set and has a lithography of 12 nm. The thermal design power (TDP) is 10 watts, indicating its energy efficiency.
On the other hand, the MediaTek Dimensity 920 processor has a more powerful architecture. It consists of 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This combination allows for more efficient multitasking and processing of demanding applications. Like the Unisoc Tiger T700, it operates on the ARMv8.2-A instruction set. However, it has a smaller lithography of 6 nm, which generally implies better power efficiency. Another notable feature of the Dimensity 920 is the inclusion of a Neural Processing Unit (NPU), which enhances AI and machine learning capabilities.
In terms of core count, both processors have 8 cores, providing sufficient power for most tasks. However, the Dimensity 920 boasts a more advanced architecture with its Cortex-A78 cores, offering potentially higher performance. Additionally, the smaller lithography of 6 nm suggests that the Dimensity 920 may offer better power efficiency and potentially generate less heat.
Ultimately, the choice between the Unisoc Tiger T700 and MediaTek Dimensity 920 depends on specific requirements and preferences. The Tiger T700 may be suitable for those seeking an affordable and energy-efficient option, while the Dimensity 920 might be more appealing to those who prioritize higher performance and AI capabilities. Careful evaluation of the intended use case and a consideration of these specifications can help make an informed decision.
CPU cores and architecture
Architecture | 2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 6 nm | 12 nm |
TDP | 10 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 4 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 3200 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.1 |
Graphics
GPU name | Mali-G68 MP4 | Mali-G52 MP2 |
GPU Architecture | Valhall | Bifrost |
GPU frequency | 950 MHz | 850 MHz |
Execution units | 4 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2400x1080 |
Max camera resolution | 1x 108MP, 2x 20MP | 1x 48MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 0.3 Gbps |
Peak Upload Speed | 1.2 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 Quarter 3 | 2021 March |
Partnumber | MT6877T | T700 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
HiSilicon Kirin 710F vs HiSilicon Kirin 990 4G
2
MediaTek Dimensity 720 vs MediaTek Dimensity 820
3
Unisoc Tanggula T740 5G vs Qualcomm Snapdragon 765G
4
MediaTek Dimensity 1080 vs Qualcomm Snapdragon 712
5
MediaTek Helio G35 vs MediaTek Helio G96
6
Samsung Exynos 2100 vs Qualcomm Snapdragon 865
7
Unisoc Tiger T612 vs Qualcomm Snapdragon 821
8
Samsung Exynos 9610 vs Apple A12 Bionic
9
MediaTek Dimensity 1300 vs Samsung Exynos 980
10
HiSilicon Kirin 9000E 5G vs Qualcomm Snapdragon 835