MediaTek Dimensity 820 vs Unisoc Tanggula T740 5G
The Unisoc Tanggula T740 5G and MediaTek Dimensity 820 are both powerful processors with impressive specifications. Let's compare these two processors based on their specifications.
In terms of CPU architecture, the Unisoc Tanggula T740 5G features a combination of 4 Cortex-A75 cores running at 1.8 GHz and 4 Cortex-A55 cores also running at 1.8 GHz. On the other hand, the MediaTek Dimensity 820 offers 4 Cortex-A76 cores clocked at 2.6 GHz along with 4 Cortex-A55 cores clocked at 2.0 GHz. Both processors employ the ARMv8.2-A instruction set, enabling efficient and optimized performance.
When it comes to the number of cores, both processors have 8 cores, allowing for multitasking and smooth operation. This ensures that the processors can handle demanding tasks and run multiple applications simultaneously without compromising performance.
In terms of lithography, the Unisoc Tanggula T740 5G is built on a 12 nm process, whereas the MediaTek Dimensity 820 utilizes a more advanced 7 nm process. The smaller lithography of the Dimensity 820 results in improved power efficiency and better heat dissipation, leading to better overall performance.
Regarding neural processing capabilities, the Unisoc Tanggula T740 5G offers a dual NPU (Neural Processing Unit), which enhances artificial intelligence and machine learning tasks. On the other hand, the MediaTek Dimensity 820 comes with a single NPU designed to handle neural processing tasks effectively.
Additionally, the MediaTek Dimensity 820 specifies a TDP (Thermal Design Power) of 10 Watts. This provides an insight into the power consumption and heat output of the processor during intensive tasks, ensuring efficient handling and thermal management.
In conclusion, while both processors offer impressive specifications, the MediaTek Dimensity 820 takes the lead in terms of more powerful CPU cores, smaller lithography, and specified TDP. However, the Unisoc Tanggula T740 5G stands out with its dual NPU, which can be advantageous for certain AI and machine learning applications. Ultimately, the choice between these two processors depends on the specific requirements of the intended usage scenario.
In terms of CPU architecture, the Unisoc Tanggula T740 5G features a combination of 4 Cortex-A75 cores running at 1.8 GHz and 4 Cortex-A55 cores also running at 1.8 GHz. On the other hand, the MediaTek Dimensity 820 offers 4 Cortex-A76 cores clocked at 2.6 GHz along with 4 Cortex-A55 cores clocked at 2.0 GHz. Both processors employ the ARMv8.2-A instruction set, enabling efficient and optimized performance.
When it comes to the number of cores, both processors have 8 cores, allowing for multitasking and smooth operation. This ensures that the processors can handle demanding tasks and run multiple applications simultaneously without compromising performance.
In terms of lithography, the Unisoc Tanggula T740 5G is built on a 12 nm process, whereas the MediaTek Dimensity 820 utilizes a more advanced 7 nm process. The smaller lithography of the Dimensity 820 results in improved power efficiency and better heat dissipation, leading to better overall performance.
Regarding neural processing capabilities, the Unisoc Tanggula T740 5G offers a dual NPU (Neural Processing Unit), which enhances artificial intelligence and machine learning tasks. On the other hand, the MediaTek Dimensity 820 comes with a single NPU designed to handle neural processing tasks effectively.
Additionally, the MediaTek Dimensity 820 specifies a TDP (Thermal Design Power) of 10 Watts. This provides an insight into the power consumption and heat output of the processor during intensive tasks, ensuring efficient handling and thermal management.
In conclusion, while both processors offer impressive specifications, the MediaTek Dimensity 820 takes the lead in terms of more powerful CPU cores, smaller lithography, and specified TDP. However, the Unisoc Tanggula T740 5G stands out with its dual NPU, which can be advantageous for certain AI and machine learning applications. Ultimately, the choice between these two processors depends on the specific requirements of the intended usage scenario.
CPU cores and architecture
Architecture | 4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
TDP | 10 Watt | |
Neural Processing | NPU | Dual NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 2x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 2.1 |
Graphics
GPU name | Mali-G57 MP5 | Imagination PowerVR GM9446 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 650 MHz | 800 MHz |
Execution units | 5 | |
Shaders | 80 | |
DirectX | 12 | |
OpenCL API | 2.1 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.1 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2960x1440@60Hz |
Max camera resolution | 1x 80MP, 1x 32MP + 1x 16MP | 1x 64MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 1.5 Gbps |
Peak Upload Speed | 1.2 Gbps | 0.75 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 May | 2020 Quarter 1 |
Partnumber | MT6875 | T740, Tiger T7510 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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