MediaTek Dimensity 810 vs Unisoc Tiger T310
The Unisoc Tiger T310 and MediaTek Dimensity 810 are two processors that offer different specifications and features. Let's compare them based on their specifications.
In terms of CPU cores and architecture, the Unisoc Tiger T310 has a 4-core design with an architecture consisting of 1x 2 GHz Cortex-A75 and 3x 1.8 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 810 possesses 8 cores with 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. This indicates that the Dimensity 810 has a wider range of cores, allowing for more efficient multitasking and better performance.
Regarding their instruction sets, both processors adopt the ARMv8.2-A instruction set, ensuring compatibility with a wide range of software and applications.
Moving on to the lithography, the Unisoc Tiger T310 has a lithography of 12 nm. In contrast, the MediaTek Dimensity 810 boasts a more advanced lithography of 6 nm, which generally indicates better power efficiency and potentially higher performance.
The MediaTek Dimensity 810 also stands out with its impressive number of transistors, reaching 12000 million. This suggests a higher level of complexity and potential for greater processing power compared to the Unisoc Tiger T310.
Furthermore, the Dimensity 810 boasts a TDP (Thermal Design Power) of 8 Watts, indicating a relatively low power consumption. It also incorporates Neural Processing Units (NPU) for advanced machine learning and AI capabilities. The Unisoc Tiger T310, however, does not specify such features.
In conclusion, while the Unisoc Tiger T310 offers a decent configuration with its 4-core setup and Cortex-A75 architecture, the MediaTek Dimensity 810 surpasses it in terms of performance and power efficiency. With its 8-core design, higher transistor count, advanced lithography, lower TDP, and added NPU, the Dimensity 810 appears to be a more powerful and feature-rich processor.
In terms of CPU cores and architecture, the Unisoc Tiger T310 has a 4-core design with an architecture consisting of 1x 2 GHz Cortex-A75 and 3x 1.8 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 810 possesses 8 cores with 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. This indicates that the Dimensity 810 has a wider range of cores, allowing for more efficient multitasking and better performance.
Regarding their instruction sets, both processors adopt the ARMv8.2-A instruction set, ensuring compatibility with a wide range of software and applications.
Moving on to the lithography, the Unisoc Tiger T310 has a lithography of 12 nm. In contrast, the MediaTek Dimensity 810 boasts a more advanced lithography of 6 nm, which generally indicates better power efficiency and potentially higher performance.
The MediaTek Dimensity 810 also stands out with its impressive number of transistors, reaching 12000 million. This suggests a higher level of complexity and potential for greater processing power compared to the Unisoc Tiger T310.
Furthermore, the Dimensity 810 boasts a TDP (Thermal Design Power) of 8 Watts, indicating a relatively low power consumption. It also incorporates Neural Processing Units (NPU) for advanced machine learning and AI capabilities. The Unisoc Tiger T310, however, does not specify such features.
In conclusion, while the Unisoc Tiger T310 offers a decent configuration with its 4-core setup and Cortex-A75 architecture, the MediaTek Dimensity 810 surpasses it in terms of performance and power efficiency. With its 8-core design, higher transistor count, advanced lithography, lower TDP, and added NPU, the Dimensity 810 appears to be a more powerful and feature-rich processor.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
1x 2 GHz – Cortex-A75 3x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 6 nm | 12 nm |
Number of transistors | 12000 million | |
TDP | 8 Watt | |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 4 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1333 MHz |
Memory-bus | 2x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.2 | eMMC 5.1 |
Graphics
GPU name | Mali-G57 MP2 | Imagination PowerVR GE8300 |
GPU Architecture | Mali Valhall | PowerVR Rogue |
GPU frequency | 950 MHz | 660 MHz |
Execution units | 2 | 2 |
Shaders | 32 | 32 |
DirectX | 12 | 10 |
OpenCL API | 2.1 | 3.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 1600x720 |
Max camera resolution | 1x 64MP, 2x 16MP | 1x 16MP + 1x 8MP |
Max Video Capture | 2K@30FPS | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 0.3 Gbps |
Peak Upload Speed | 1.2 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 Quarter 3 | 2019 April |
Partnumber | MT6833V/PNZA, MT6833P | T310 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
Popular comparisons:
1
Qualcomm Snapdragon 4s Gen 2 vs Qualcomm Snapdragon 780G
2
Google Tensor G1 vs Qualcomm Snapdragon 690
3
MediaTek Dimensity 820 vs Qualcomm Snapdragon 720G
4
Samsung Exynos 8895 vs MediaTek Dimensity 800
5
Apple A18 Pro vs Samsung Exynos 9820
6
Qualcomm Snapdragon 835 vs Qualcomm Snapdragon 730G
7
Qualcomm Snapdragon 4 Gen 1 vs Qualcomm Snapdragon 888 Plus
8
HiSilicon Kirin 950 vs Unisoc Tanggula T740 5G
9
Apple A10 Fusion vs Qualcomm Snapdragon 7 Plus Gen 2
10
Qualcomm Snapdragon 768G vs Unisoc SC9832E