MediaTek Dimensity 800 vs Unisoc Tanggula T770 5G
The Unisoc Tanggula T770 5G and the MediaTek Dimensity 800 are both processors designed for mobile devices, offering different specifications to cater to various user needs.
In terms of CPU cores and architecture, the Unisoc Tanggula T770 5G features a more diverse configuration with 8 cores. It consists of 1x 2.5 GHz Cortex-A76, 3x 2.2 GHz Cortex-A76, and 4x 2.0 GHz Cortex-A55 cores. This configuration allows for a balance between performance and power efficiency, providing a smooth user experience. On the other hand, the MediaTek Dimensity 800 has 4x 2.0 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55 cores. While it also offers good performance, it may not have the same level of multitasking capabilities as the Tanggula T770.
In terms of instruction set, both processors support ARMv8.2-A, ensuring compatibility with the latest software and applications.
When it comes to lithography, the Unisoc Tanggula T770 5G takes the lead with a 6 nm process, which allows for better power efficiency and thermal management compared to the Dimensity 800's 7 nm process. This means that the Tanggula T770 may have a slight edge in terms of power consumption and heat output.
In terms of TDP (Thermal Design Power), the Unisoc Tanggula T770 5G has a lower TDP of 5 Watts compared to the MediaTek Dimensity 800's 10 Watts. This indicates that the Tanggula T770 may generate less heat and offer better power efficiency.
Both processors also feature a Neural Processing Unit (NPU), which enhances AI capabilities for tasks such as image recognition and voice commands, improving overall user experience.
In summary, the Unisoc Tanggula T770 5G offers a higher core count, better lithography, lower TDP, and similar NPU capabilities compared to the MediaTek Dimensity 800. However, the Dimensity 800 may still provide a smooth performance for everyday tasks with its 4x 2.0 GHz Cortex-A76 and Cortex-A55 cores. Ultimately, the choice between these two processors would depend on the specific needs and priorities of the user.
In terms of CPU cores and architecture, the Unisoc Tanggula T770 5G features a more diverse configuration with 8 cores. It consists of 1x 2.5 GHz Cortex-A76, 3x 2.2 GHz Cortex-A76, and 4x 2.0 GHz Cortex-A55 cores. This configuration allows for a balance between performance and power efficiency, providing a smooth user experience. On the other hand, the MediaTek Dimensity 800 has 4x 2.0 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55 cores. While it also offers good performance, it may not have the same level of multitasking capabilities as the Tanggula T770.
In terms of instruction set, both processors support ARMv8.2-A, ensuring compatibility with the latest software and applications.
When it comes to lithography, the Unisoc Tanggula T770 5G takes the lead with a 6 nm process, which allows for better power efficiency and thermal management compared to the Dimensity 800's 7 nm process. This means that the Tanggula T770 may have a slight edge in terms of power consumption and heat output.
In terms of TDP (Thermal Design Power), the Unisoc Tanggula T770 5G has a lower TDP of 5 Watts compared to the MediaTek Dimensity 800's 10 Watts. This indicates that the Tanggula T770 may generate less heat and offer better power efficiency.
Both processors also feature a Neural Processing Unit (NPU), which enhances AI capabilities for tasks such as image recognition and voice commands, improving overall user experience.
In summary, the Unisoc Tanggula T770 5G offers a higher core count, better lithography, lower TDP, and similar NPU capabilities compared to the MediaTek Dimensity 800. However, the Dimensity 800 may still provide a smooth performance for everyday tasks with its 4x 2.0 GHz Cortex-A76 and Cortex-A55 cores. Ultimately, the choice between these two processors would depend on the specific needs and priorities of the user.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 4 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 10 Watt | 5 Watt |
Neural Processing | NPU | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 32 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP4 | Mali-G57 MP6 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 650 MHz | 850 MHz |
Execution units | 4 | 6 |
Shaders | 64 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2160x1080@120Hz |
Max camera resolution | 1x 80MP, 1x 32MP + 1x 16MP | 1x 108MP, 2x 24MP |
Max Video Capture | 4K@30FPS | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 2.7 Gbps |
Peak Upload Speed | 1.2 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 2 | 2021 February |
Partnumber | MT6873, MT6873V | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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