MediaTek Dimensity 800 vs Unisoc Tanggula T770 5G

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The Unisoc Tanggula T770 5G and the MediaTek Dimensity 800 are both processors designed for mobile devices, offering different specifications to cater to various user needs.

In terms of CPU cores and architecture, the Unisoc Tanggula T770 5G features a more diverse configuration with 8 cores. It consists of 1x 2.5 GHz Cortex-A76, 3x 2.2 GHz Cortex-A76, and 4x 2.0 GHz Cortex-A55 cores. This configuration allows for a balance between performance and power efficiency, providing a smooth user experience. On the other hand, the MediaTek Dimensity 800 has 4x 2.0 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55 cores. While it also offers good performance, it may not have the same level of multitasking capabilities as the Tanggula T770.

In terms of instruction set, both processors support ARMv8.2-A, ensuring compatibility with the latest software and applications.

When it comes to lithography, the Unisoc Tanggula T770 5G takes the lead with a 6 nm process, which allows for better power efficiency and thermal management compared to the Dimensity 800's 7 nm process. This means that the Tanggula T770 may have a slight edge in terms of power consumption and heat output.

In terms of TDP (Thermal Design Power), the Unisoc Tanggula T770 5G has a lower TDP of 5 Watts compared to the MediaTek Dimensity 800's 10 Watts. This indicates that the Tanggula T770 may generate less heat and offer better power efficiency.

Both processors also feature a Neural Processing Unit (NPU), which enhances AI capabilities for tasks such as image recognition and voice commands, improving overall user experience.

In summary, the Unisoc Tanggula T770 5G offers a higher core count, better lithography, lower TDP, and similar NPU capabilities compared to the MediaTek Dimensity 800. However, the Dimensity 800 may still provide a smooth performance for everyday tasks with its 4x 2.0 GHz Cortex-A76 and Cortex-A55 cores. Ultimately, the choice between these two processors would depend on the specific needs and priorities of the user.

CPU cores and architecture

Architecture 4x 2.0 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
1x 2.5 GHz – Cortex-A76
3x 2.2 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 4 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
TDP 10 Watt 5 Watt
Neural Processing NPU NPU

Memory (RAM)

Max amount up to 16 GB up to 32 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 2x16 bit 4x16 bit

Storage

Storage specification UFS 2.2 UFS 3.1

Graphics

GPU name Mali-G57 MP4 Mali-G57 MP6
GPU Architecture Valhall Valhall
GPU frequency 650 MHz 850 MHz
Execution units 4 6
Shaders 64 96
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz 2160x1080@120Hz
Max camera resolution 1x 80MP, 1x 32MP + 1x 16MP 1x 108MP, 2x 24MP
Max Video Capture 4K@30FPS FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 2.77 Gbps 2.7 Gbps
Peak Upload Speed 1.2 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
QZSS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2020 Quarter 2 2021 February
Partnumber MT6873, MT6873V T770, Tiger T7520
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Dimensity 800
325654
Tanggula T770 5G
342190

GeekBench 6 Single-Core

Score
Dimensity 800
514
Tanggula T770 5G
659

GeekBench 6 Multi-Core

Score
Dimensity 800
1882
Tanggula T770 5G
2635