MediaTek Dimensity 800 vs Unisoc Tanggula T740 5G
The Unisoc Tanggula T740 5G and the MediaTek Dimensity 800 are two processors commonly used in mobile devices. While both processors have similarities, such as their ARMv8.2-A instruction set and Cortex-A55 cores, they also have distinct differences in their specifications.
Starting with the Unisoc Tanggula T740 5G, it features an architecture consisting of 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. With a total of 8 cores, this processor offers a balanced mix of performance and power efficiency. Additionally, it utilizes a 12 nm lithography process, leading to a smaller chip size and potentially improved energy efficiency. It also boasts a dual NPU (Neural Processing Unit), which can accelerate AI (Artificial Intelligence) tasks and improve overall performance in various applications.
In contrast, the MediaTek Dimensity 800 has a slightly different architecture. It includes 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. The focus here appears to be on higher clock speeds for improved performance. This processor employs a more advanced 7 nm lithography process, leading to potentially better energy efficiency compared to the Unisoc Tanggula T740 5G. It also includes an NPU for AI-related tasks.
While the number of cores in the Unisoc Tanggula T740 5G is higher (8 cores) compared to the MediaTek Dimensity 800 (4 cores), the latter uses a higher-performance Cortex-A76 microarchitecture for its main cores. The higher clock speeds of the Dimensity 800's cores can result in improved single-threaded performance and faster response times.
It's worth noting that the TDP (Thermal Design Power) of the Dimensity 800 is specified at 10 Watts, which could indicate a higher power consumption compared to the Unisoc Tanggula T740 5G, although the overall impact on battery life will depend on various factors, including power management capabilities of the devices utilizing these processors.
In conclusion, both the Unisoc Tanggula T740 5G and the MediaTek Dimensity 800 have their own unique specifications and strengths. The Unisoc processor offers a balanced mix of performance and power efficiency with its multiple cores and dual NPU, while the MediaTek processor focuses on higher clock speeds and potentially better energy efficiency with its more advanced lithography process. The specific use case and device requirements will dictate which processor may be more suitable.
Starting with the Unisoc Tanggula T740 5G, it features an architecture consisting of 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. With a total of 8 cores, this processor offers a balanced mix of performance and power efficiency. Additionally, it utilizes a 12 nm lithography process, leading to a smaller chip size and potentially improved energy efficiency. It also boasts a dual NPU (Neural Processing Unit), which can accelerate AI (Artificial Intelligence) tasks and improve overall performance in various applications.
In contrast, the MediaTek Dimensity 800 has a slightly different architecture. It includes 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. The focus here appears to be on higher clock speeds for improved performance. This processor employs a more advanced 7 nm lithography process, leading to potentially better energy efficiency compared to the Unisoc Tanggula T740 5G. It also includes an NPU for AI-related tasks.
While the number of cores in the Unisoc Tanggula T740 5G is higher (8 cores) compared to the MediaTek Dimensity 800 (4 cores), the latter uses a higher-performance Cortex-A76 microarchitecture for its main cores. The higher clock speeds of the Dimensity 800's cores can result in improved single-threaded performance and faster response times.
It's worth noting that the TDP (Thermal Design Power) of the Dimensity 800 is specified at 10 Watts, which could indicate a higher power consumption compared to the Unisoc Tanggula T740 5G, although the overall impact on battery life will depend on various factors, including power management capabilities of the devices utilizing these processors.
In conclusion, both the Unisoc Tanggula T740 5G and the MediaTek Dimensity 800 have their own unique specifications and strengths. The Unisoc processor offers a balanced mix of performance and power efficiency with its multiple cores and dual NPU, while the MediaTek processor focuses on higher clock speeds and potentially better energy efficiency with its more advanced lithography process. The specific use case and device requirements will dictate which processor may be more suitable.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 4 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
TDP | 10 Watt | |
Neural Processing | NPU | Dual NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 2x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 2.1 |
Graphics
GPU name | Mali-G57 MP4 | Imagination PowerVR GM9446 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 650 MHz | 800 MHz |
Execution units | 4 | |
Shaders | 64 | |
DirectX | 12 | |
OpenCL API | 2.1 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.1 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2960x1440@60Hz |
Max camera resolution | 1x 80MP, 1x 32MP + 1x 16MP | 1x 64MP |
Max Video Capture | 4K@30FPS | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 1.5 Gbps |
Peak Upload Speed | 1.2 Gbps | 0.75 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 2 | 2020 Quarter 1 |
Partnumber | MT6873, MT6873V | T740, Tiger T7510 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 6020 vs MediaTek Dimensity 820
2
MediaTek Helio G88 vs HiSilicon Kirin 810
3
HiSilicon Kirin 960 vs Qualcomm Snapdragon 480 Plus
4
HiSilicon Kirin 820 5G vs Apple A13 Bionic
5
Qualcomm Snapdragon 870 vs Apple A10 Fusion
6
HiSilicon Kirin 935 vs MediaTek Dimensity 1200
7
MediaTek Dimensity 1300 vs MediaTek Dimensity 720
8
MediaTek Dimensity 9000 vs HiSilicon Kirin 950
9
MediaTek Dimensity 920 vs Apple A10X Fusion
10
Unisoc Tiger T616 vs MediaTek Helio P90