MediaTek Dimensity 720 vs Unisoc Tiger T616
The Unisoc Tiger T616 and the MediaTek Dimensity 720 are two processors that offer impressive specifications. Let's compare them based on their CPU cores and architecture, number of cores, instruction set, lithography, TDP, and additional features.
Starting with the CPU cores and architecture, the Unisoc Tiger T616 has an architecture that consists of 2x 2.0 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 720 boasts an architecture that includes 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This indicates that the Dimensity 720 has a slightly faster clock speed for both its high-performance and efficiency clusters.
Moving on to the number of cores, both processors have 8 cores in total, meaning they offer considerable multitasking capabilities and potential for handling demanding tasks.
When comparing the instruction set, both processors utilize the ARMv8.2-A instruction set. This ensures compatibility with the latest software and technology advancements.
In terms of lithography, the Unisoc Tiger T616 is built on a 12 nm process, while the MediaTek Dimensity 720 is built on a more advanced 7 nm process. This suggests that the Dimensity 720 might have better power efficiency and potentially better thermal performance.
Both processors have a TDP (Thermal Design Power) of 10 Watts, indicating that they are designed to operate within similar power constraints. This makes them suitable for mobile devices that require a balance between performance and power consumption.
One notable additional feature of the MediaTek Dimensity 720 is its Neural Processing Unit (NPU). This specialized hardware component enhances AI and machine learning tasks by accelerating the processing of neural networks.
In summary, the MediaTek Dimensity 720 offers a slightly higher clock speed, a more advanced lithography process, and the inclusion of an NPU for improved AI capabilities compared to the Unisoc Tiger T616. However, the Unisoc Tiger T616 still performs admirably with its balanced architecture and instruction set. Ultimately, the choice between the two processors would depend on specific performance requirements and desired features for the target device.
Starting with the CPU cores and architecture, the Unisoc Tiger T616 has an architecture that consists of 2x 2.0 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 720 boasts an architecture that includes 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This indicates that the Dimensity 720 has a slightly faster clock speed for both its high-performance and efficiency clusters.
Moving on to the number of cores, both processors have 8 cores in total, meaning they offer considerable multitasking capabilities and potential for handling demanding tasks.
When comparing the instruction set, both processors utilize the ARMv8.2-A instruction set. This ensures compatibility with the latest software and technology advancements.
In terms of lithography, the Unisoc Tiger T616 is built on a 12 nm process, while the MediaTek Dimensity 720 is built on a more advanced 7 nm process. This suggests that the Dimensity 720 might have better power efficiency and potentially better thermal performance.
Both processors have a TDP (Thermal Design Power) of 10 Watts, indicating that they are designed to operate within similar power constraints. This makes them suitable for mobile devices that require a balance between performance and power consumption.
One notable additional feature of the MediaTek Dimensity 720 is its Neural Processing Unit (NPU). This specialized hardware component enhances AI and machine learning tasks by accelerating the processing of neural networks.
In summary, the MediaTek Dimensity 720 offers a slightly higher clock speed, a more advanced lithography process, and the inclusion of an NPU for improved AI capabilities compared to the Unisoc Tiger T616. However, the Unisoc Tiger T616 still performs admirably with its balanced architecture and instruction set. Ultimately, the choice between the two processors would depend on specific performance requirements and desired features for the target device.
CPU cores and architecture
Architecture | 2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
2x 2.0 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
TDP | 10 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 6 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 2x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 2.1 |
Graphics
GPU name | Mali-G57 MP3 | Mali-G57 MP1 |
GPU Architecture | Valhall | Bifrost |
GPU frequency | 850 MHz | 750 MHz |
Execution units | 3 | 1 |
Shaders | 16 | |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | 2400x1080 |
Max camera resolution | 1x 64MP, 1x 20MP + 1x 16MP | 1x 64MP, 2x 32MP |
Max Video Capture | 4K@30FPS | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 0.3 Gbps |
Peak Upload Speed | 1.2 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 3 | 2021 |
Partnumber | MT6853V/ZA, MT6853V/NZA | T616 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 6100 Plus vs HiSilicon Kirin 955
2
Qualcomm Snapdragon 778G Plus vs Qualcomm Snapdragon 460
3
MediaTek Dimensity 700 vs MediaTek Dimensity 1050
4
Samsung Exynos 8890 vs Samsung Exynos 2100
5
MediaTek Dimensity 8100 vs Unisoc Tanggula T770 5G
6
Qualcomm Snapdragon 845 vs Qualcomm Snapdragon 765G
7
MediaTek Helio G35 vs Qualcomm Snapdragon 888
8
HiSilicon Kirin 985 5G vs Apple A17 Pro
9
Qualcomm Snapdragon 8 Plus Gen 1 vs MediaTek Helio G85
10
Samsung Exynos 990 vs HiSilicon Kirin 980