MediaTek Dimensity 720 vs Unisoc Tanggula T770 5G
The Unisoc Tanggula T770 5G and MediaTek Dimensity 720 are two processors with similar features but slightly different specifications.
Starting with the Unisoc Tanggula T770 5G, it has a CPU architecture of 1x 2.5 GHz – Cortex-A76, 3x 2.2 GHz – Cortex-A76, and 4x 2.0 GHz – Cortex-A55. It is an 8-core processor based on the ARMv8.2-A instruction set. The Tanggula T770 5G is produced using a 6 nm lithography process, which allows for better power efficiency. Its thermal design power (TDP) is 5 Watts, indicating that it consumes relatively less power during operation. Furthermore, it comes equipped with a Neural Processing Unit (NPU), enhancing its capabilities in handling AI-related tasks.
On the other hand, the MediaTek Dimensity 720 also features an 8-core CPU, but with a different architecture. It consists of 2x 2.2 GHz – Cortex-A76 and 6x 2 GHz – Cortex-A55 cores. Just like the Tanggula T770 5G, the Dimensity 720 is based on the ARMv8.2-A instruction set. However, it is manufactured using a 7 nm lithography process, which is slightly less advanced compared to the Tanggula T770 5G. The TDP of the Dimensity 720 is 10 Watts, indicating it consumes a bit more power during operation. Similar to the Tanggula T770 5G, it also includes an NPU for AI-related tasks.
In summary, both the Unisoc Tanggula T770 5G and MediaTek Dimensity 720 are octa-core processors based on the ARMv8.2-A instruction set. They both have NPUs for AI processing, but the Tanggula T770 5G has a slight edge with its 6 nm lithography process and lower TDP of 5 Watts. The Dimensity 720, on the other hand, has a slightly different CPU architecture and is manufactured using a 7 nm lithography process, with a TDP of 10 Watts. Overall, the choice between the two processors would depend on specific requirements, such as power efficiency and processing capabilities needed for different applications.
Starting with the Unisoc Tanggula T770 5G, it has a CPU architecture of 1x 2.5 GHz – Cortex-A76, 3x 2.2 GHz – Cortex-A76, and 4x 2.0 GHz – Cortex-A55. It is an 8-core processor based on the ARMv8.2-A instruction set. The Tanggula T770 5G is produced using a 6 nm lithography process, which allows for better power efficiency. Its thermal design power (TDP) is 5 Watts, indicating that it consumes relatively less power during operation. Furthermore, it comes equipped with a Neural Processing Unit (NPU), enhancing its capabilities in handling AI-related tasks.
On the other hand, the MediaTek Dimensity 720 also features an 8-core CPU, but with a different architecture. It consists of 2x 2.2 GHz – Cortex-A76 and 6x 2 GHz – Cortex-A55 cores. Just like the Tanggula T770 5G, the Dimensity 720 is based on the ARMv8.2-A instruction set. However, it is manufactured using a 7 nm lithography process, which is slightly less advanced compared to the Tanggula T770 5G. The TDP of the Dimensity 720 is 10 Watts, indicating it consumes a bit more power during operation. Similar to the Tanggula T770 5G, it also includes an NPU for AI-related tasks.
In summary, both the Unisoc Tanggula T770 5G and MediaTek Dimensity 720 are octa-core processors based on the ARMv8.2-A instruction set. They both have NPUs for AI processing, but the Tanggula T770 5G has a slight edge with its 6 nm lithography process and lower TDP of 5 Watts. The Dimensity 720, on the other hand, has a slightly different CPU architecture and is manufactured using a 7 nm lithography process, with a TDP of 10 Watts. Overall, the choice between the two processors would depend on specific requirements, such as power efficiency and processing capabilities needed for different applications.
CPU cores and architecture
Architecture | 2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 10 Watt | 5 Watt |
Neural Processing | NPU | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 32 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP3 | Mali-G57 MP6 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 850 MHz |
Execution units | 3 | 6 |
Shaders | 96 | |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | 2160x1080@120Hz |
Max camera resolution | 1x 64MP, 1x 20MP + 1x 16MP | 1x 108MP, 2x 24MP |
Max Video Capture | 4K@30FPS | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 2.7 Gbps |
Peak Upload Speed | 1.2 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 3 | 2021 February |
Partnumber | MT6853V/ZA, MT6853V/NZA | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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