MediaTek Dimensity 720 vs Unisoc Tanggula T770 5G

The Unisoc Tanggula T770 5G and MediaTek Dimensity 720 are two processors with similar features but slightly different specifications.

Starting with the Unisoc Tanggula T770 5G, it has a CPU architecture of 1x 2.5 GHz – Cortex-A76, 3x 2.2 GHz – Cortex-A76, and 4x 2.0 GHz – Cortex-A55. It is an 8-core processor based on the ARMv8.2-A instruction set. The Tanggula T770 5G is produced using a 6 nm lithography process, which allows for better power efficiency. Its thermal design power (TDP) is 5 Watts, indicating that it consumes relatively less power during operation. Furthermore, it comes equipped with a Neural Processing Unit (NPU), enhancing its capabilities in handling AI-related tasks.

On the other hand, the MediaTek Dimensity 720 also features an 8-core CPU, but with a different architecture. It consists of 2x 2.2 GHz – Cortex-A76 and 6x 2 GHz – Cortex-A55 cores. Just like the Tanggula T770 5G, the Dimensity 720 is based on the ARMv8.2-A instruction set. However, it is manufactured using a 7 nm lithography process, which is slightly less advanced compared to the Tanggula T770 5G. The TDP of the Dimensity 720 is 10 Watts, indicating it consumes a bit more power during operation. Similar to the Tanggula T770 5G, it also includes an NPU for AI-related tasks.

In summary, both the Unisoc Tanggula T770 5G and MediaTek Dimensity 720 are octa-core processors based on the ARMv8.2-A instruction set. They both have NPUs for AI processing, but the Tanggula T770 5G has a slight edge with its 6 nm lithography process and lower TDP of 5 Watts. The Dimensity 720, on the other hand, has a slightly different CPU architecture and is manufactured using a 7 nm lithography process, with a TDP of 10 Watts. Overall, the choice between the two processors would depend on specific requirements, such as power efficiency and processing capabilities needed for different applications.

CPU cores and architecture

Architecture 2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
1x 2.5 GHz – Cortex-A76
3x 2.2 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
TDP 10 Watt 5 Watt
Neural Processing NPU NPU

Memory (RAM)

Max amount up to 12 GB up to 32 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 2x16 bit 4x16 bit


Storage specification UFS 2.2 UFS 3.1


GPU name Mali-G57 MP3 Mali-G57 MP6
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 850 MHz
Execution units 3 6
Shaders 96
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@90Hz 2160x1080@120Hz
Max camera resolution 1x 64MP, 1x 20MP + 1x 16MP 1x 108MP, 2x 24MP
Max Video Capture 4K@30FPS FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 2.77 Gbps 2.7 Gbps
Peak Upload Speed 1.2 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 Quarter 3 2021 February
Partnumber MT6853V/ZA, MT6853V/NZA T770, Tiger T7520
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Dimensity 720
Tanggula T770 5G

GeekBench 6 Single-Core

Dimensity 720
Tanggula T770 5G

GeekBench 6 Multi-Core

Dimensity 720
Tanggula T770 5G