MediaTek Dimensity 720 vs MediaTek Dimensity 900
The MediaTek Dimensity 720 and MediaTek Dimensity 900 are both processors produced by the Taiwanese company MediaTek. Let's compare their specifications to determine the differences and similarities.
Starting with the MediaTek Dimensity 720, it features a CPU architecture consisting of 2 Cortex-A76 cores clocked at 2.2 GHz, and 6 Cortex-A55 cores clocked at 2 GHz. This processor boasts a total of 8 cores, enabling efficient multitasking. Additionally, it operates on the ARMv8.2-A instruction set and employs a 7 nm lithography process. The TDP (thermal design power) of this processor is set at 10 Watts, ensuring optimal thermal performance. Moreover, it includes a Neural Processing Unit (NPU), which enhances AI capabilities.
On the other hand, the MediaTek Dimensity 900 offers a slightly upgraded architecture. It is equipped with 2 Cortex-A78 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. Similar to the Dimensity 720, it features 8 cores and operates on the ARMv8.2-A instruction set. However, what sets it apart is the use of a more advanced 6 nm lithography process, resulting in improved power efficiency and performance. Additionally, the Dimensity 900 incorporates approximately 10000 million transistors, providing increased computational power compared to the Dimensity 720. Its TDP remains the same at 10 Watts, ensuring minimal power consumption. Like its counterpart, the Dimensity 900 includes an NPU, enhancing AI processing capabilities.
In summary, while both processors have 8 cores and similar TDP values, the Dimensity 900 offers several advancements compared to the Dimensity 720. These include a more powerful architecture with Cortex-A78 cores, a more advanced 6 nm lithography process, and a higher number of transistors. However, both processors feature the same ARMv8.2-A instruction set and include an NPU for AI processing. Ultimately, these specifications contribute to enhanced performance and power efficiency, making both the MediaTek Dimensity 720 and Dimensity 900 suitable choices for various mobile devices.
Starting with the MediaTek Dimensity 720, it features a CPU architecture consisting of 2 Cortex-A76 cores clocked at 2.2 GHz, and 6 Cortex-A55 cores clocked at 2 GHz. This processor boasts a total of 8 cores, enabling efficient multitasking. Additionally, it operates on the ARMv8.2-A instruction set and employs a 7 nm lithography process. The TDP (thermal design power) of this processor is set at 10 Watts, ensuring optimal thermal performance. Moreover, it includes a Neural Processing Unit (NPU), which enhances AI capabilities.
On the other hand, the MediaTek Dimensity 900 offers a slightly upgraded architecture. It is equipped with 2 Cortex-A78 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. Similar to the Dimensity 720, it features 8 cores and operates on the ARMv8.2-A instruction set. However, what sets it apart is the use of a more advanced 6 nm lithography process, resulting in improved power efficiency and performance. Additionally, the Dimensity 900 incorporates approximately 10000 million transistors, providing increased computational power compared to the Dimensity 720. Its TDP remains the same at 10 Watts, ensuring minimal power consumption. Like its counterpart, the Dimensity 900 includes an NPU, enhancing AI processing capabilities.
In summary, while both processors have 8 cores and similar TDP values, the Dimensity 900 offers several advancements compared to the Dimensity 720. These include a more powerful architecture with Cortex-A78 cores, a more advanced 6 nm lithography process, and a higher number of transistors. However, both processors feature the same ARMv8.2-A instruction set and include an NPU for AI processing. Ultimately, these specifications contribute to enhanced performance and power efficiency, making both the MediaTek Dimensity 720 and Dimensity 900 suitable choices for various mobile devices.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 10000 million | |
TDP | 10 Watt | 10 Watt |
Neural Processing | NPU | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP3 | Mali-G68 MP4 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 900 MHz |
Execution units | 3 | 4 |
Shaders | 64 | |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | 2520x1080@120Hz |
Max camera resolution | 1x 64MP, 1x 20MP + 1x 16MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30FPS | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 2.77 Gbps |
Peak Upload Speed | 1.2 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 Quarter 3 | 2021 Quarter 1 |
Partnumber | MT6853V/ZA, MT6853V/NZA | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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