HiSilicon Kirin 980 vs Unisoc Tiger T606
When comparing the HiSilicon Kirin 980 and the Unisoc Tiger T606 processors, several key specifications stand out.
In terms of CPU cores and architecture, the HiSilicon Kirin 980 features an architecture that consists of 2 Cortex-A76 cores clocked at 2.6 GHz, another 2 Cortex-A76 cores clocked at 1.92 GHz, and 4 Cortex-A55 cores clocked at 1.8 GHz. On the other hand, the Unisoc Tiger T606 has 2 Cortex-A75 cores clocked at 1.6 GHz and 6 Cortex-A55 cores clocked at the same frequency.
Both processors have 8 cores, but the HiSilicon Kirin 980 offers a more diverse and powerful architecture with its combination of high-performance and power-efficient cores.
In terms of instruction set, the HiSilicon Kirin 980 utilizes the ARMv8-A instruction set, while the Unisoc Tiger T606 uses the ARMv8.2-A instruction set.
In terms of lithography, the HiSilicon Kirin 980 is manufactured using a 7 nm process, which offers better power efficiency and performance compared to a larger lithography. The Unisoc Tiger T606, on the other hand, utilizes a 12 nm process, which is still quite efficient but not as advanced as the 7 nm process.
When it comes to power consumption, the HiSilicon Kirin 980 has a TDP (Thermal Design Power) of 6 Watts, while the Unisoc Tiger T606 has a TDP of 10 Watts. This suggests that the HiSilicon Kirin 980 is more power-efficient, which is favorable for mobile devices where battery life is crucial.
Finally, the HiSilicon Kirin 980 boasts the inclusion of HiSilicon Dual NPU (Neural Processing Unit), which enhances AI-related tasks and provides better performance in machine learning tasks.
Overall, the HiSilicon Kirin 980 offers a more advanced and powerful architecture with better power efficiency, supported by the use of a 7 nm process and the additional HiSilicon Dual NPU. While the Unisoc Tiger T606 is still a capable processor with its 8 cores and 12 nm process, it falls slightly behind in terms of processing power and efficiency compared to the Kirin 980.
In terms of CPU cores and architecture, the HiSilicon Kirin 980 features an architecture that consists of 2 Cortex-A76 cores clocked at 2.6 GHz, another 2 Cortex-A76 cores clocked at 1.92 GHz, and 4 Cortex-A55 cores clocked at 1.8 GHz. On the other hand, the Unisoc Tiger T606 has 2 Cortex-A75 cores clocked at 1.6 GHz and 6 Cortex-A55 cores clocked at the same frequency.
Both processors have 8 cores, but the HiSilicon Kirin 980 offers a more diverse and powerful architecture with its combination of high-performance and power-efficient cores.
In terms of instruction set, the HiSilicon Kirin 980 utilizes the ARMv8-A instruction set, while the Unisoc Tiger T606 uses the ARMv8.2-A instruction set.
In terms of lithography, the HiSilicon Kirin 980 is manufactured using a 7 nm process, which offers better power efficiency and performance compared to a larger lithography. The Unisoc Tiger T606, on the other hand, utilizes a 12 nm process, which is still quite efficient but not as advanced as the 7 nm process.
When it comes to power consumption, the HiSilicon Kirin 980 has a TDP (Thermal Design Power) of 6 Watts, while the Unisoc Tiger T606 has a TDP of 10 Watts. This suggests that the HiSilicon Kirin 980 is more power-efficient, which is favorable for mobile devices where battery life is crucial.
Finally, the HiSilicon Kirin 980 boasts the inclusion of HiSilicon Dual NPU (Neural Processing Unit), which enhances AI-related tasks and provides better performance in machine learning tasks.
Overall, the HiSilicon Kirin 980 offers a more advanced and powerful architecture with better power efficiency, supported by the use of a 7 nm process and the additional HiSilicon Dual NPU. While the Unisoc Tiger T606 is still a capable processor with its 8 cores and 12 nm process, it falls slightly behind in terms of processing power and efficiency compared to the Kirin 980.
CPU cores and architecture
Architecture | 2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
2x 1.6 GHz – Cortex-A75 6x 1.6 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | HiSilicon Dual NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G76 MP10 | Mali-G57 MP1 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 720 MHz | 650 MHz |
Execution units | 10 | 1 |
Shaders | 160 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 1600x900@90Hz |
Max camera resolution | 1x 48MP, 2x 32MP | 1x 24MP, 16MP + 8MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 4 | 2021 October |
Partnumber | T606 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 1000 vs Samsung Exynos 9820
2
Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 730
3
Unisoc Tanggula T760 5G vs Samsung Exynos 1380
4
Unisoc Tiger T610 vs Qualcomm Snapdragon 7 Gen 1
5
MediaTek Helio P35 vs MediaTek Dimensity 9000
6
Qualcomm Snapdragon 460 vs MediaTek Dimensity 6020
7
Samsung Exynos 2200 vs Qualcomm Snapdragon 778G Plus
8
MediaTek Dimensity 720 vs MediaTek Dimensity 1000 Plus
9
MediaTek Helio G88 vs HiSilicon Kirin 950
10
MediaTek Dimensity 1080 vs Qualcomm Snapdragon 768G