HiSilicon Kirin 980 vs MediaTek Dimensity 900
The HiSilicon Kirin 980 and MediaTek Dimensity 900 are two powerful processors designed for mobile devices. Let's compare their specifications to see how they stack up against each other.
Starting with the HiSilicon Kirin 980, it boasts a sophisticated architecture consisting of 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. With a total of 8 cores, this processor offers a great balance between performance and power efficiency. It operates on the ARMv8-A instruction set and features a 7 nm lithography, which offers improved power consumption and efficiency. The Kirin 980 also incorporates the HiSilicon Dual NPU for advanced neural processing capabilities.
On the other hand, the MediaTek Dimensity 900 also offers an impressive architecture. It includes 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. With a total of 8 cores, it matches the Kirin 980 in terms of core count. The Dimensity 900 operates on the ARMv8.2-A instruction set and boasts a 6 nm lithography, which provides better power efficiency compared to the Kirin 980. In terms of neural processing, it features an NPU.
When it comes to the number of transistors, the MediaTek Dimensity 900 takes the lead with 10,000 million transistors, whereas the HiSilicon Kirin 980 has 6,900 million transistors.
In terms of power consumption, the Kirin 980 has a slightly lower TDP (thermal design power) at 6 Watts compared to the Dimensity 900's 10 Watts. This suggests that the Kirin 980 may offer better power efficiency.
Overall, both processors offer powerful performance and advanced features. The Kirin 980 shines with its dual NPU for neural processing, while the Dimensity 900 impresses with its 6 nm lithography and higher transistor count. However, the Kirin 980 may have an edge in terms of power efficiency with its lower TDP. Ultimately, the choice between the two processors may depend on the specific requirements and priorities of the device and its users.
Starting with the HiSilicon Kirin 980, it boasts a sophisticated architecture consisting of 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. With a total of 8 cores, this processor offers a great balance between performance and power efficiency. It operates on the ARMv8-A instruction set and features a 7 nm lithography, which offers improved power consumption and efficiency. The Kirin 980 also incorporates the HiSilicon Dual NPU for advanced neural processing capabilities.
On the other hand, the MediaTek Dimensity 900 also offers an impressive architecture. It includes 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. With a total of 8 cores, it matches the Kirin 980 in terms of core count. The Dimensity 900 operates on the ARMv8.2-A instruction set and boasts a 6 nm lithography, which provides better power efficiency compared to the Kirin 980. In terms of neural processing, it features an NPU.
When it comes to the number of transistors, the MediaTek Dimensity 900 takes the lead with 10,000 million transistors, whereas the HiSilicon Kirin 980 has 6,900 million transistors.
In terms of power consumption, the Kirin 980 has a slightly lower TDP (thermal design power) at 6 Watts compared to the Dimensity 900's 10 Watts. This suggests that the Kirin 980 may offer better power efficiency.
Overall, both processors offer powerful performance and advanced features. The Kirin 980 shines with its dual NPU for neural processing, while the Dimensity 900 impresses with its 6 nm lithography and higher transistor count. However, the Kirin 980 may have an edge in terms of power efficiency with its lower TDP. Ultimately, the choice between the two processors may depend on the specific requirements and priorities of the device and its users.
CPU cores and architecture
Architecture | 2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 6900 million | 10000 million |
TDP | 6 Watt | 10 Watt |
Neural Processing | HiSilicon Dual NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G76 MP10 | Mali-G68 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 720 MHz | 900 MHz |
Execution units | 10 | 4 |
Shaders | 160 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 32MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.0 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2018 Quarter 4 | 2021 Quarter 1 |
Partnumber | MT6877 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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