HiSilicon Kirin 980 vs MediaTek Dimensity 900

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The HiSilicon Kirin 980 and MediaTek Dimensity 900 are two powerful processors designed for mobile devices. Let's compare their specifications to see how they stack up against each other.

Starting with the HiSilicon Kirin 980, it boasts a sophisticated architecture consisting of 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. With a total of 8 cores, this processor offers a great balance between performance and power efficiency. It operates on the ARMv8-A instruction set and features a 7 nm lithography, which offers improved power consumption and efficiency. The Kirin 980 also incorporates the HiSilicon Dual NPU for advanced neural processing capabilities.

On the other hand, the MediaTek Dimensity 900 also offers an impressive architecture. It includes 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. With a total of 8 cores, it matches the Kirin 980 in terms of core count. The Dimensity 900 operates on the ARMv8.2-A instruction set and boasts a 6 nm lithography, which provides better power efficiency compared to the Kirin 980. In terms of neural processing, it features an NPU.

When it comes to the number of transistors, the MediaTek Dimensity 900 takes the lead with 10,000 million transistors, whereas the HiSilicon Kirin 980 has 6,900 million transistors.

In terms of power consumption, the Kirin 980 has a slightly lower TDP (thermal design power) at 6 Watts compared to the Dimensity 900's 10 Watts. This suggests that the Kirin 980 may offer better power efficiency.

Overall, both processors offer powerful performance and advanced features. The Kirin 980 shines with its dual NPU for neural processing, while the Dimensity 900 impresses with its 6 nm lithography and higher transistor count. However, the Kirin 980 may have an edge in terms of power efficiency with its lower TDP. Ultimately, the choice between the two processors may depend on the specific requirements and priorities of the device and its users.

CPU cores and architecture

Architecture 2x 2.6 GHz – Cortex-A76
2x 1.92 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 7 nm 6 nm
Number of transistors 6900 million 10000 million
TDP 6 Watt 10 Watt
Neural Processing HiSilicon Dual NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR5
Memory frequency 2133 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G76 MP10 Mali-G68 MP4
GPU Architecture Bifrost Valhall
GPU frequency 720 MHz 900 MHz
Execution units 10 4
Shaders 160 64
DirectX 12 12
OpenCL API 2.1 2.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3120x1440 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 32MP 1x 108MP, 2x 20MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.4 Gbps 2.77 Gbps
Peak Upload Speed 0.2 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 6 (802.11ax)
Bluetooth 5.0 5.2
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2018 Quarter 4 2021 Quarter 1
Partnumber MT6877
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 980
484026
Dimensity 900
435318

GeekBench 6 Single-Core

Score
Kirin 980
698
Dimensity 900
704

GeekBench 6 Multi-Core

Score
Kirin 980
2482
Dimensity 900
2139