HiSilicon Kirin 980 vs MediaTek Dimensity 820

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The HiSilicon Kirin 980 and MediaTek Dimensity 820 are both powerful processors used in smartphones and other electronic devices. When comparing their specifications, several key differences are apparent.

In terms of CPU cores and architecture, the HiSilicon Kirin 980 is equipped with 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 820 features 4x 2.6 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores, providing strong performance and multitasking capabilities.

In terms of instruction set, the HiSilicon Kirin 980 uses ARMv8-A, while the MediaTek Dimensity 820 uses ARMv8.2-A. While both are advanced instruction sets, the ARMv8.2-A used by the Dimensity 820 may offer slight improvements in performance and efficiency.

Both processors share the same 7 nm lithography, which indicates advanced manufacturing technology that allows for smaller and more power-efficient transistors. Speaking of transistors, the HiSilicon Kirin 980 boasts 6900 million transistors, while this information is not specified for the MediaTek Dimensity 820.

In terms of power consumption, the HiSilicon Kirin 980 has a lower thermal design power (TDP) of 6 Watts, indicating higher energy efficiency. The MediaTek Dimensity 820, on the other hand, has a TDP of 10 Watts, consuming more power.

When it comes to neural processing capabilities, the HiSilicon Kirin 980 includes the HiSilicon Dual NPU, providing advanced artificial intelligence capabilities. The MediaTek Dimensity 820, in contrast, features a general NPU without specifying further details.

In conclusion, both the HiSilicon Kirin 980 and MediaTek Dimensity 820 are powerful processors with their own strengths and capabilities. The Kirin 980 offers a wider variety of CPU cores and a more energy-efficient design, while the Dimensity 820 boasts a slightly newer instruction set. The choice between the two processors may depend on the specific requirements of the device and the user's preferences.

CPU cores and architecture

Architecture 2x 2.6 GHz – Cortex-A76
2x 1.92 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
4x 2.6 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 7 nm 7 nm
Number of transistors 6900 million
TDP 6 Watt 10 Watt
Neural Processing HiSilicon Dual NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G76 MP10 Mali-G57 MP5
GPU Architecture Bifrost Valhall
GPU frequency 720 MHz 650 MHz
Execution units 10 5
Shaders 160 80
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3120x1440 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 32MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.4 Gbps 2.77 Gbps
Peak Upload Speed 0.2 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.0 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2018 Quarter 4 2020 May
Partnumber MT6875
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 980
484026
Dimensity 820
403227

GeekBench 6 Single-Core

Score
Kirin 980
698
Dimensity 820
615

GeekBench 6 Multi-Core

Score
Kirin 980
2482
Dimensity 820
1924