HiSilicon Kirin 980 vs MediaTek Dimensity 800U
In comparing the specifications of the HiSilicon Kirin 980 and the MediaTek Dimensity 800U processors, several notable differences stand out.
Starting with the CPU cores and architecture, the Kirin 980 features a combination of Cortex-A76 and Cortex-A55 cores. It includes 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. In contrast, the Dimensity 800U has a combination of Cortex-A76 and Cortex-A55 cores as well. It includes 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores.
Both processors have 8 cores in total but differ in terms of clock speed and core configuration. The Kirin 980 seems to offer slightly higher clock speeds across its cores, potentially indicating better overall performance capabilities.
Moving on to other specifications, both processors are manufactured using a 7 nm lithography process, which offers power efficiency benefits. However, the Kirin 980 boasts a larger number of transistors with 6900 million compared to the Dimensity 800U, which does not specify its transistor count.
Furthermore, the Kirin 980 has a TDP (Thermal Design Power) of 6 Watt, indicating its power consumption. On the other hand, the Dimensity 800U does not provide this information, making it difficult to assess its power efficiency.
One significant difference is evident in the Kirin 980's Neural Processing Unit (NPU). It features the HiSilicon Dual NPU, which provides artificial intelligence capabilities and enhances overall performance in tasks such as image processing and machine learning. The Dimensity 800U, while also having an NPU, does not provide further details about its capabilities.
In summary, the HiSilicon Kirin 980 and MediaTek Dimensity 800U processors showcase some differences in their specifications. The Kirin 980 appears to offer slightly higher clock speeds, a larger number of transistors, a specified TDP, and a more advanced dual NPU. However, more details are required to make a comprehensive assessment of their performance and power efficiency.
Starting with the CPU cores and architecture, the Kirin 980 features a combination of Cortex-A76 and Cortex-A55 cores. It includes 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. In contrast, the Dimensity 800U has a combination of Cortex-A76 and Cortex-A55 cores as well. It includes 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores.
Both processors have 8 cores in total but differ in terms of clock speed and core configuration. The Kirin 980 seems to offer slightly higher clock speeds across its cores, potentially indicating better overall performance capabilities.
Moving on to other specifications, both processors are manufactured using a 7 nm lithography process, which offers power efficiency benefits. However, the Kirin 980 boasts a larger number of transistors with 6900 million compared to the Dimensity 800U, which does not specify its transistor count.
Furthermore, the Kirin 980 has a TDP (Thermal Design Power) of 6 Watt, indicating its power consumption. On the other hand, the Dimensity 800U does not provide this information, making it difficult to assess its power efficiency.
One significant difference is evident in the Kirin 980's Neural Processing Unit (NPU). It features the HiSilicon Dual NPU, which provides artificial intelligence capabilities and enhances overall performance in tasks such as image processing and machine learning. The Dimensity 800U, while also having an NPU, does not provide further details about its capabilities.
In summary, the HiSilicon Kirin 980 and MediaTek Dimensity 800U processors showcase some differences in their specifications. The Kirin 980 appears to offer slightly higher clock speeds, a larger number of transistors, a specified TDP, and a more advanced dual NPU. However, more details are required to make a comprehensive assessment of their performance and power efficiency.
CPU cores and architecture
Architecture | 2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | |
TDP | 6 Watt | |
Neural Processing | HiSilicon Dual NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G76 MP10 | Mali-G57 MP3 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 720 MHz | 850 MHz |
Execution units | 10 | 3 |
Shaders | 160 | 48 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 32MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2018 Quarter 4 | 2020 Quarter 3 |
Partnumber | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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